Abstract: This disclosure provides a horizontal radiation antenna including a grounded conductor plate on the back surface of a multilayer substrate, a radiation element to which a microstrip line is connected on a front surface of the multilayer substrate, and a passive element on an end portion side of the multilayer substrate compared with the radiation element. An intermediate grounded conductor plate is provided within the multilayer substrate between insulation layers and faces the microstrip line. The intermediate grounded conductor plate defines a notch portion whose end portion side is open. The intermediate grounded conductor surrounds the radiation element and the passive element in the notch portion. The intermediate grounded conductor is electrically connected to the grounded conductor plate.

Abstract: In a multilayer substrate, eight front-side antenna portions and eight back-side antenna portions are disposed. Front-side radiation elements in the front-side antenna portions and back-side radiation elements in the back-side antenna portions are arranged in a staggered pattern when being vertically projected onto an back side of the multilayer substrate. The front-side radiation elements are disposed on a front side of the multilayer substrate, and a front-side ground layer is formed near the back side of the multilayer substrate. On the other hand, the back-side radiation elements are disposed on the back side of the multilayer substrate, and a back-side ground layer is formed near the front side of the multilayer substrate. The front-side radiation element and the back-side radiation element are disposed so as not to overlap each other when being vertically projected onto the back side of the multilayer substrate.

Abstract: In a multilayer substrate (2), an internal ground layer (11) is provided at a position between insulating layers (4) and (5) and a radiating element (13) is provided at a position between insulating layers (3) and (4). A first coplanar line (7) is connected to an intermediate position of the radiating element (13) in an X-axis direction, and a second coplanar line (9) is connected to an intermediate position of the radiating element (13) in a Y-axis direction. A passive element (16) is laminated on the upper surface of the radiating element (13) through the insulating layer (3). The passive element (16) is formed in a cross shape in which a first patch (16A) extending in the X-axis direction and a second patch (16B) extending in the Y-axis direction are orthogonal to each other.

Abstract: A semiconductor component is face-up mounted on a package substrate. An antenna substrate is flip-chip mounted on a front side of the semiconductor component. A device-side high-frequency signal terminal is disposed on the front side of the semiconductor component, and an antenna-side high-frequency signal terminal is disposed on a back side of the antenna substrate. The device-side high-frequency signal terminal and the antenna-side high-frequency signal terminal are electrically connected to each other. Thus, the antenna substrate for high-frequency signals can be separated from the package substrate for baseband signals.

Abstract: This disclosure provides a wideband antenna including a feed line, a ground conductor plate and a radiating conductor element connected to the feed line and facing the ground conductor plate at a distance from the ground conductor plate. A parasitic conductor element is provided on a side opposite to the ground conductor plate as viewed from the radiating conductor plate and is insulated from these plates. A coupling adjusting conductor plate is positioned between the radiating conductor element and the parasitic conductor element, is configured to adjust an amount of coupling between them, overlaps an area where the radiating conductor element and the parasitic conductor element overlap, and straddles the radiating conductor element in a direction orthogonal to the direction of a current I that flows therein. Both end sides of the coupling adjusting conductor plate are electrically connected to the ground conductor plate via via-holes.

Abstract: A chip antenna is mounted on a mother substrate including a feed line. In a representative embodiment, the chip antenna includes a laminated body including plural insulating layers, a radiating conductor element, a parasitic conductor element, a coupling adjusting conductor plate, and a LGA. The radiating conductor element is connected to the feed line via a first flat electrode pad of the LGA. On the other hand, the coupling adjusting conductor plate is provided between the radiating conductor element and the parasitic conductor element, and both end sides of the coupling adjusting conductor plate are connected to second and third flat electrode pads of the LGA. Another representative embodiment does not include a coupling adjusting conductor plate in the laminated body and includes an LGA that may or may not include second and third flat electrode pads.

Abstract: This disclosure provides a horizontal radiation antenna. The antenna includes a back-surface-side grounded conductor plate on a back surface of a substrate, a radiation element to which a coplanar line is connected on the front surface of the substrate, and a passive element closer to an end portion side of the substrate than the radiation element. A front-surface-side grounded conductor plate is provided at a substantially same height as the radiation element with respect to a thickness direction of the substrate, and a conductive wall surface capable of reflecting a high-frequency signal radiated from the radiation element is provided between the front-surface-side grounded conductor plate and the back-surface-side grounded conductor plate.

Abstract: This disclosure provides a horizontal radiation antenna including a grounded conductor plate on the back surface of a multilayer substrate, a radiation element to which a microstrip line is connected on a front surface of the multilayer substrate, and a passive element on an end portion side of the multilayer substrate compared with the radiation element. An intermediate grounded conductor plate is provided within the multilayer substrate between insulation layers and faces the microstrip line. The intermediate grounded conductor plate defines a notch portion whose end portion side is open. The intermediate grounded conductor surrounds the radiation element and the passive element in the notch portion. The intermediate grounded conductor is electrically connected to the grounded conductor plate.

Abstract: The present invention provides a technique for simplifying consumer user registration of a product. A removable memory is provided by a manufacturer with a consumer device, such as an electrical appliance, that needs registration for warranty purposes, etc. The memory includes predetermined information, such as consumer information. Later, when a consumer purchases the electric appliance, the removable memory M is mounted in the electric appliance, and the information from the electric appliance is written into the removable memory. The information written into the removable memory is transferred to the manufacturer, employing a portable telephone terminal, a home gateway, or the like, thereby completing the user registration process.