Patents by Inventor Kaoru Yamada
Kaoru Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7476290Abstract: The present invention provides a substrate processing apparatus and a substrate processing method suitable for use in an etching apparatus which etches a thin film formed on a peripheral portion of a substrate. The present invention also provides a substrate processing apparatus and a substrate processing method suitable for use in a cleaning apparatus which performs a cleaning process on a substrate which has been etched. The substrate processing apparatus for use in etching includes a substrate holder for holding a substrate substantially horizontally and rotating the substrate, and a processing liquid supply unit for supplying a processing liquid onto a peripheral portion of the substrate which is being rotated in such a manner that the processing liquid is stationary with respect to the substrate.Type: GrantFiled: October 30, 2003Date of Patent: January 13, 2009Assignee: Ebara CorporationInventors: Takayuki Saito, Tsukuru Suzuki, Kaoru Yamada, Kenya Ito, Masayuki Kamezawa, Kenji Yamaguchi
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Publication number: 20080314763Abstract: A method and device for regenerating an ion exchanger can regenerate an ion exchanger easily and quickly, and can minimize a load upon cleaning of the regenerated ion exchanger and disposal of waste liquid. A method for regenerating a contaminated ion exchanger includes: providing a pair of a regeneration electrode and a counter electrode, a partition disposed between the electrodes, and an ion exchanger to be regenerated disposed between the counter electrode and the partition; and applying a voltage between the regeneration electrode and the counter electrode while supplying a liquid between the partition and the regeneration electrode and also supplying a liquid between the partition and the counter electrode.Type: ApplicationFiled: August 14, 2008Publication date: December 25, 2008Inventors: Takayuki Saito, Tsukuru Suzuki, Yuji Makita, Kaoru Yamada, Masayuki Kumekawa, Hozumi Yasuda, Osamu Nabeya, Kazuto Hirokawa, Mitsuhiro Shirakashi, Yasushi Toma, Itsuki Kobata
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Patent number: 7427345Abstract: A method and device for regenerating an ion exchanger can regenerate an ion exchanger easily and quickly, and can minimize a load upon cleaning of the regenerated ion exchanger and disposal of waste liquid. A method for regenerating a contaminated ion exchanger includes: providing a pair of a regeneration electrode and a counter electrode, a partition disposed between the electrodes, and an ion exchanger to be regenerated disposed between the counter electrode and the partition; and applying a voltage between the regeneration electrode and the counter electrode while supplying a liquid between the partition and the regeneration electrode and also supplying a liquid between the partition and the counter electrode.Type: GrantFiled: November 29, 2002Date of Patent: September 23, 2008Assignee: Ebara CorporationInventors: Takayuki Saito, Tsukuru Suzuki, Yuji Makita, Kaoru Yamada, Masayuki Kumekawa, Hozumi Yasuda, Osamu Nabeya, Kazuto Hirokawa, Mitsuhiko Shirakashi, Yasushi Toma, Itsuki Kobata
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Publication number: 20070277930Abstract: A substrate cleaning apparatus does not need positioning of a transport system on start-up of the apparatus and can reduce the installation area of the apparatus. The substrate cleaning apparatus includes a base-integrated frame (1) in which are mounted a substrate transport device (2) for transporting a substrate, at least one substrate processing unit (3) for processing the substrate, a substrate loading port (5) for placing a substrate-housing cassette (4) on it, and a processing liquid supply apparatus (6) for supplying a processing liquid to the substrate processing unit, wherein maintenance of the substrate processing unit (3) can be performed from the backside of the apparatus.Type: ApplicationFiled: September 14, 2005Publication date: December 6, 2007Inventors: Toshi Yokoyama, Seiji Katsuoka, Takahiro Ogawa, Kaoru Yamada, Kazuaki Maeda
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Publication number: 20070187259Abstract: A substrate processing apparatus can perform an electrolytic processing, which is different from a common, conventional etching, to remove (clean off) a conductive material (film) formed on or adhering to a bevel portion, etc. of a substrate, or process a peripheral portion of a substrate through an electrochemical action. The substrate processing apparatus includes: an electrode section having a plurality of electrodes which are laminated with insulators being interposed, and having a holding portion which is to be opposed to a peripheral portion of a substrate; an ion exchanger disposed in the holding portion of the electrode section; a liquid supply section for supplying a liquid to the holding position of the electrode section; and a power source for applying a voltage to the electrodes of the electrode section so that the electrodes alternately have different polarities.Type: ApplicationFiled: March 9, 2007Publication date: August 16, 2007Inventors: Itsuki Kobata, Mitsuhiko Shirakashi, Masayuki Kumekawa, Takayuki Saito, Yasushi Toma, Tsukuru Suzuki, Kaoru Yamada, Yuji Makita, Hozumi Yasuda
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Patent number: 7208076Abstract: A substrate processing apparatus can perform an electrolytic processing, which is different from a common, conventional etching, to remove (clean off) a conductive material (film) formed on or adhering to a bevel portion, etc. of a substrate, or process a peripheral portion of a substrate through an electrochemical action. The substrate processing apparatus includes: an electrode section having a plurality of electrodes which are laminated with insulators being interposed, and having a holding portion which is to be opposed to a peripheral portion of a substrate; an ion exchanger disposed in the holding portion of the electrode section; a liquid supply section for supplying a liquid to the holding position of the electrode section; and a power source for applying a voltage to the electrodes of the electrode section so that the electrodes alternately have different polarities.Type: GrantFiled: September 11, 2002Date of Patent: April 24, 2007Assignee: Ebara CorporationInventors: Itsuki Kobata, Mitsuhiko Shirakashi, Masayuki Kumekawa, Takayuki Saito, Yasushi Toma, Tsukuru Suzuki, Kaoru Yamada, Yuji Makita, Hozumi Yasuda
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Publication number: 20060234503Abstract: The present invention relates to a substrate processing apparatus and a substrate processing method for performing a chemical liquid process, a cleaning process, a drying process, or the like while rotating a substrate such as a semiconductor wafer or a liquid crystal substrate. The present invention also relates to a substrate holding apparatus for holding and rotating a substrate. The substrate processing apparatus (1) for processing a substrate (W) while supplying a fluid to the substrate (W) includes a substrate holder (11) for holding and rotating the substrate (W), and a holder suction unit (24) for sucking the fluid from the substrate holder (11). The substrate holding apparatus includes a plurality of rollers (20) which are brought into contact with an edge portion of a substrate (W) so as to hold and rotate the substrate (W), and at least one moving mechanism (303a) for moving the rollers (20).Type: ApplicationFiled: July 28, 2004Publication date: October 19, 2006Inventors: Kaoru Yamada, Takayuki Saito, Sumio Yabe, Kenya Ito, Masayuki Kamezawa, Masaya Seki, Ichiro Katakabe, Yuki Inoue
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Patent number: 7101465Abstract: There is provided an electrolytic processing device including: a processing electrode to be brought into contact with or close to a workpiece; a feeding electrode for supplying electricity to the workpiece; an ion exchanger disposed in at least one of spaces between the workpiece and the processing electrode, and between the workpiece and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a liquid supply section for supplying a liquid to the space between the workpiece and at least one of the processing electrode and the feeding electrode, in which the ion exchanger is present. A substrate processing apparatus having the electrolytic processing device is also provided.Type: GrantFiled: January 7, 2003Date of Patent: September 5, 2006Assignee: Ebara CorporationInventors: Itsuki Kobata, Mitsuhiko Shirakashi, Masayuki Kumekawa, Takayuki Saito, Yasushi Toma, Tsukuru Suzuki, Kaoru Yamada, Yuji Makita, Hozumi Yasuda
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Publication number: 20060065645Abstract: A region surrounded by two gate wiring and two drain wiring includes pixels and when there is a defect of short-circuit in adjacent pixel electrodes, the short-circuited portion is removed by irradiating a laser via a mask having a transmission pattern, which corresponds to a pattern of the gate wiring, drain wiring and pixel electrodes in the short-circuited portion. The above short-circuited portion is identified and removed in comparison to a normal pattern, by use of information from an inspection apparatus, and the pattern defect formed on the substrate is automatically repaired. By applying the above method to a manufacturing process of display apparatus, in particular, to a resist pattern forming process, a display apparatus having a highly qualified display property may be achieved.Type: ApplicationFiled: June 3, 2005Publication date: March 30, 2006Inventors: Nobuaki Nakasu, Kaoru Yamada, Yuichiro Tanaka, Takeshi Arai, Hideyuki Honoki, Kazushi Yoshimura, Tetsuya Kawamura, Masanori Okawa
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Publication number: 20050242064Abstract: A substrate processing apparatus comprises roll chucks for holding and rotating a substrate, a closable chamber housing the roll chucks therein, and a gas introduction pipe for introducing a gas into the chamber. The substrate processing apparatus further comprises an etching unit for etching and cleaning a peripheral portion of the substrate while the substrate is being rotated by the roll chucks, and a first supply passage for supplying a first liquid to the etching unit.Type: ApplicationFiled: July 11, 2005Publication date: November 3, 2005Inventors: Takayuki Saito, Tsukuru Suzuki, Yuji Makita, Kaoru Yamada, Mitsuhiko Shirakashi, Kenya Ito
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Patent number: 6937296Abstract: Shorting defects between the scan lines and signal lines are repaired during the manufacture of a TFT or other flat panel display unit without causing liquid crystal orientation defects and production yield is thereby improved. In a TFT panel in which scan line 2 bifurcates where scan line 2 and signal line 3 intersect, the lines having a protective insulation film 8 therebetween, one leg of the scan line 2 bifurcation is cut by a laser 9 where a short 7 has been found between lines at the intersection, thereby electrically separating the short. An insulation film material 13 dispensed from a glass pipette 12 is then applied locally to the cut part and surrounding area and cured to form a new insulation film.Type: GrantFiled: August 31, 2001Date of Patent: August 30, 2005Assignee: Hitachi, Ltd.Inventors: Michinobu Mizumura, Mikio Hongo, Masaaki Okunaka, Kaoru Yamada
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Patent number: 6932884Abstract: A substrate processing apparatus comprises roll chucks for holding and rotating a substrate, a closable chamber housing the roll chucks therein, and a gas introduction pipe for introducing a gas into the chamber. The substrate processing apparatus further comprises an etching unit for etching and cleaning a peripheral portion of the substrate while the substrate is being rotated by the roll chucks, and a first supply passage for supplying a first liquid to the etching unit.Type: GrantFiled: September 4, 2002Date of Patent: August 23, 2005Assignee: Ebara CorporationInventors: Takayuki Saito, Tsukuru Suzuki, Yuji Makita, Kaoru Yamada, Mitsuhiko Shirakashi, Kenya Ito
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Publication number: 20050092351Abstract: The present invention provides a substrate processing apparatus and a substrate processing method suitable for use in an etching apparatus which etches a thin film formed on a peripheral portion of a substrate. The present invention also provides a substrate processing apparatus and a substrate processing method suitable for use in a cleaning apparatus which performs a cleaning process on a substrate which has been etched. The substrate processing apparatus for use in etching includes a substrate holder 11 for holding a substrate W substantially horizontally and rotating the substrate W, and a processing liquid supply unit 15 for supplying a processing liquid onto a peripheral portion of the substrate W which is being rotated in such a manner that the processing liquid is stationary with respect to the substrate W.Type: ApplicationFiled: October 30, 2003Publication date: May 5, 2005Inventors: Takayuki Saito, Tsukuru Suzuki, Kaoru Yamada, Kenya Ito, Masayuki Kamezawa, Kenji Yamaguchi
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Publication number: 20040256237Abstract: There is provided an electrolytic processing apparatus and method which, while omitting a CMP treatment entirely or reducing a load upon a CMP treatment to the least possible extent, can process a conductive material formed in the surface of a substrate to flatten the material, or can remove (clean) extraneous matter adhering to the surface of a workpiece such as a substrate. The electrolytic processing apparatus includes: a pair of electrodes disposed at a given distance; an ion exchange disposed between the pair of electrodes; and a liquid supply section for supplying a liquid between the pair of electrodes. The electrolytic processing method includes: providing an electrode section having, a pair of electrodes disposed at a given distance with an ion exchanger being interposed: and bringing the electrode into contact with or close to a workpiece while supplying a fluid to the ion exchanger, thereby processing the surface of the workpiece.Type: ApplicationFiled: August 9, 2004Publication date: December 23, 2004Inventors: Itsuki Kobata, Mitsuhiko Shirakashi, Masayuki Kumekawa, Takayuki Saito, Yasushi Toma, Tsukuru Suzuki, Kaoru Yamada, Yuji Makita, Hozumi Yasuda, Ikutaro Noji, Kunio Fujiwara, Osamu Nabeya
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Publication number: 20040231989Abstract: There is a provided a substrate processing apparatus that can perform an electrolytic processing, which is different from a common, conventional etching, to remove (clean off) a conductive material (film) formed on or adhering to a bevel portion, etc. of a substrate or process a peripheral portion of a substrate through an electrochemical action. The substrate processing apparatus includes: an electrode section having a plurality of electrodes which are laminated with insulators being interposed, and having a holding portion which is to be opposed to a peripheral portion of a substrate: an ion exchanger disposed in the holding portion of the electrode section; a liquid supply section for supplying a liquid to the holding position of the electrode section; and a power source for applying a voltage to the electrodes of the electrode section so that the electrodes alternately have different polarities.Type: ApplicationFiled: July 6, 2004Publication date: November 25, 2004Inventors: Itsuki Kobata, Mitsuhiko Shirakashi, Masayuki Kumekawa, Takayuki Saito, Yasushi Toma, Tsukuru Suzuki, Kaoru Yamada, Yuji Makita, Hozumi Yasuda
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Publication number: 20040129569Abstract: The present invention provides an electrolytic processing apparatus which, while eliminating a CMP processing entirely or reducing a load on a CMP processing to the least possible extent, can process and flatten a conductive material formed in the surface of a substrate, or can remove (clean) extraneous matter adhering to the surface of a workpiece such as a substrate. The present invention includes an electrode section including a plurality of electrode members disposed in parallel, each electrode member comprising an electrode and an ion exchanger covering the surface of the electrode, a holder for holding a workpiece, which is capable of bringing the workpiece close to or into contact with the ion exchanger of the electrode member, and a power source to be connected to the electrode of each electrode member of the electrode section. The ion exchanger of the electrode member comprises an ion exchanger having an excellent surface smoothness and an ion exchanger having a large ion exchange capacity.Type: ApplicationFiled: September 25, 2003Publication date: July 8, 2004Inventors: Osamu Nabeya, Masayuki Kumekawa, Hozumi Yasuda, Itsuki Kobata, Takeshi Ilzumi, Nobuyuki Takada, Koichi Fukaya, Mitsuhiko Shirakashi, Takayuki Saito, Yasushi Toma, Tsukuru Suzuki, Kaoru Yamada, Yuji Makita
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Publication number: 20040112761Abstract: There is provided a method and device for regenerating an ion exchanger which can regenerate an ion exchanger easily and quickly, and can minimize a load upon cleaning of the regenerated ion exchanger and disposal of waste liquid. A method for regenerating a contaminated ion exchanger includes: providing a pair of a regeneration electrode and a counter electrode, a partition disposed between the electrodes, and an ion exchanger to be regenerated disposed between the counter electrode and the partition; and applying a voltage between the regeneration electrode and the counter electrode while supplying a liquid between the partition and the regeneration electrode and also supplying a liquid between the partition and the counter electrode.Type: ApplicationFiled: November 18, 2003Publication date: June 17, 2004Inventors: Takayuki Saito, Tsukuru Suzuki, Yuji Makita, Kaoru Yamada, Masayuki Kumekawa, Hozumi Yasuda, Osamu Nabeya, Kazuto Hirokawa, Mitsuhiko Shirakashi, Yasushi Toma, Itsuki Kobata
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Publication number: 20030136668Abstract: There is provided an electrolytic processing device including: a processing electrode brought into contact with or close to a workpiece; a feeding electrode for supplying electricity to the workpiece; an ion exchanger disposed in at least one of the spaces between the workpiece and the processing electrode, and between the workpiece and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a liquid supply section for supplying a liquid to the space between the workpiece and at least one of the processing electrode and the feeding electrode, in which the ion exchanger is present. A substrate processing apparatus having the electrolytic processing device is also provided.Type: ApplicationFiled: January 7, 2003Publication date: July 24, 2003Inventors: Itsuki Kobata, Mitsuhiko Shirakashi, Masayuki Kumekawa, Takayuki Saito, Yasushi Toma, Tsukuru Suzuki, Kaoru Yamada, Yuji Makita, Hozumi Yasuda
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Publication number: 20030132103Abstract: There is provided an electrolytic processing device including: a processing electrode brought into contact with or close to a workpiece; a feeding electrode for supplying electricity to the workpiece; an ion exchanger disposed in at least one of the spaces between the workpiece and the processing electrode, and between the workpiece and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a liquid supply section or supplying a liquid to the space between the workpiece and at least one of the processing electrode and the feeding electrode, in which the ion exchanger is present. A substrate processing apparatus having the electrolytic processing device is also provided.Type: ApplicationFiled: November 22, 2002Publication date: July 17, 2003Inventors: Itsuki Kobata, Mitsuhiko Shirakashi, Masayuki Kumekawa, Takayuki Saito, Yasushi Toma, Tsukuru Suzuki, Kaoru Yamada, Yuji Makita
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Publication number: 20030041968Abstract: A substrate processing apparatus comprises roll chucks for holding and rotating a substrate, a closable chamber housing the roll chucks therein, and a gas introduction pipe for introducing a gas into the chamber. The substrate processing apparatus further comprises an etching unit for etching and cleaning a peripheral portion of the substrate while the substrate is being rotated by the roll chucks, and a first supply passage for supplying a first liquid to the etching unit.Type: ApplicationFiled: September 4, 2002Publication date: March 6, 2003Inventors: Takayuki Saito, Tsukuru Suzuki, Yuji Makita, Kaoru Yamada, Mitsuhiko Shirakashi, Kenya Ito