Abstract: Provided is a mounting component for an optical fiber that allows a laser device and an optical fiber to be aligned with higher precision while providing protection for the laser device mounted on a substrate.

Abstract: Provided is a downsized connector for a multicore fiber and a plurality of single-mode fibers which can simplify the core alignment process between the fibers. The optical fiber connector includes a mount substrate, a multicore fiber including a plurality of cores arrayed in the same plane, a first sub-substrate configured to fix an end part of the multicore fiber, and to be bonded on the mount substrate, a plurality of single-mode fibers including at least the same number of fibers as the plurality of cores of the multicore fiber, and a second sub-substrate configured to fix end parts of the plurality of single-mode fibers, and to be bonded on the mount substrate. A relative position between the first sub-substrate and the second sub-substrate is determined, so that the plurality of cores of the multicore fiber and the plurality of single-mode fibers of the same number as the plurality of cores are optically coupled, respectively.

Abstract: The invention is directed to the provision of an optical integrated device wherein provisions are made to be able to mount components on a substrate with high accuracy and high packing density without having to heat the components. The optical integrated device includes a substrate, an optical device optically coupled to a first device, and an electrical device mounted on top of the optical device or on top of a second device, wherein the optical device is bonded to the substrate by surface activated bonding via a first bonding portion formed from a metallic material on the substrate, and the electrical device is bonded to the optical device or the second device by surface activated bonding via a second bonding portion formed from a metallic material on the optical device or the second device.

Abstract: Provided is a mounting component for an optical fiber that allows a laser device and an optical fiber to be aligned with higher precision while providing protection for the laser device mounted on a substrate.

Abstract: The invention is directed to the provision of an optical device in which provisions are made to form a gap between an optical waveguide and a substrate without having to form a groove or the like in the substrate and to prevent any stress from being applied to an optical element even when it is heated by a heater for temperature adjustment. More specifically, the invention provides an optical device includes a substrate, an optical element with an optical waveguide formed in a surface thereof that faces the substrate, bonding portions formed on the substrate at positions that oppose each other across the optical waveguide, a heater, formed on at least one of the optical element and the substrate, for heating the optical waveguide, and a micro bump structure formed from a metallic material, wherein the optical element is bonded to the bonding portions via the micro bump structure in such a manner that a gap is formed between the optical waveguide and the substrate.

Abstract: To provide a liquid crystal device and a method of manufacturing the liquid crystal device which has high durability in an environment of high temperature and high humidity, and which can be applied to optical communication device. A liquid crystal device and a method of manufacturing the liquid crystal device includes a first substrate provided with a frame shaped seal region for encapsulating a liquid crystal layer, and a second substrate provided in opposition to the first substrate, wherein a gold frame shaped structure is provided in the seal region of the first substrate so as to be crushed and deformed to form metallic bond when superimposed and joined to the second substrate, and wherein a gold film is disposed in the portion of the second substrate opposed to the gold frame shaped structure so as to form metallic bond to the gold frame shaped structure.

Abstract: Provided is a light source device having optical fiber arrays arranged so that different sets of RGB laser lights are focused at different depth positions, while enhancing the efficiency of light utilization. The light source device includes a plurality of optical devices each of which generate red, green, or blue laser light, a plurality of first, second, and third optical fibers through each of which the red, green, or blue laser light from a corresponding one of the plurality of optical devices is guided, and a fiber bundle combiner which forms a fiber bundle by fixedly holding together end portions of the plurality of first, second, and third optical fibers in such a manner that a plurality of optical fiber sets, each comprising three optical fibers one from the first optical fibers, one from the second optical fibers, and one from the third optical fibers, are stacked in layers.

Abstract: Provided is a laser module wherein any defective laser device can be isolated by performing burn-in on laser devices mounted on a mounting substrate. The laser module includes laser devices that emit laser light, a driver IC for driving the laser devices, a mounting substrate on which the laser devices and the driver IC are mounted, a common electrode terminal to which a common electrode of the laser devices is connected, individual electrode terminals to which individual electrodes of the laser devices are respectively connected, driver terminals to which the driver IC is connected, and test terminals which are respectively connected to the common electrode terminal and the individual electrode terminals, and to which an external power supply is to be connected when performing burn-in of the laser devices, wherein the number of the laser devices and the number of the test terminals are each larger than the number of the driver terminals.

Abstract: Provided is a downsized connector for a multicore fiber and a plurality of single-mode fibers which can simplify the core alignment process between the fibers. The optical fiber connector includes a mount substrate, a multicore fiber including a plurality of cores arrayed in the same plane, a first sub-substrate configured to fix an end part of the multicore fiber, and to be bonded on the mount substrate, a plurality of single-mode fibers including at least the same number of fibers as the plurality of cores of the multicore fiber, and a second sub-substrate configured to fix end parts of the plurality of single-mode fibers, and to be bonded on the mount substrate. A relative position between the first sub-substrate and the second sub-substrate is determined, so that the plurality of cores of the multicore fiber and the plurality of single-mode fibers of the same number as the plurality of cores are optically coupled, respectively.

Abstract: The present invention is directed to provide a method of manufacturing an optical module in which optical devices are optically aligned with high precision regardless of elastic return of bonding bumps. The invention provides a method of manufacturing an optical module including the steps of forming bumps for bonding made of metal on a substrate, and bonding a second optical device on the bonding bumps by applying a load so that the bumps for bonding are deformed only by a predetermined amount from a position where a first optical device and the second optical device are optically coupled most efficiently and, after that, releasing the load.

Abstract: The invention is directed to the provision of an optical device in which provisions are made to form a gap between an optical waveguide and a substrate without having to form a groove or the like in the substrate and to prevent any stress from being applied to an optical element even when it is heated by a heater for temperature adjustment. More specifically, the invention provides an optical device includes a substrate, an optical element with an optical waveguide formed in a surface thereof that faces the substrate, bonding portions formed on the substrate at positions that oppose each other across the optical waveguide, a heater, formed on at least one of the optical element and the substrate, for heating the optical waveguide, and a micro bump structure formed from a metallic material, wherein the optical element is bonded to the bonding portions via the micro bump structure in such a manner that a gap is formed between the optical waveguide and the substrate.

Abstract: The present invention is a laser light source device having: a silicon substrate having a first flat surface and a second flat surface which is formed at a position lower than the first flat surface by a level difference in the thickness direction; a first junction having a microbump structure comprising Au formed on the first flat surface; a second junction having a microbump structure comprising Au formed on the second flat surface; a first optical element and a second optical element for emitting laser light, which are joined to the first junction by a surface activation technique; a reflective member for reflecting the laser light from the first optical element toward a multiplexer, the reflective member being joined to the second junction by the abovementioned technique; and a multiplexer for directly receiving the laser light from the second optical element and multiplexing the laser light from the first optical element and the laser light from the second optical element, the multiplexer being joined to

Abstract: Provided is a light source device having optical fiber arrays arranged so that different sets of RGB laser lights are focused at different depth positions, while enhancing the efficiency of light utilization. The light source device includes a plurality of optical devices each of which generate red, green, or blue laser light, a plurality of first, second, and third optical fibers through each of which the red, green, or blue laser light from a corresponding one of the plurality of optical devices is guided, and a fiber bundle combiner which forms a fiber bundle by fixedly holding together end portions of the plurality of first, second, and third optical fibers in such a manner that a plurality of optical fiber sets, each comprising three optical fibers one from the first optical fibers, one from the second optical fibers, and one from the third optical fibers, are stacked in layers.

Abstract: Provided is a laser module wherein any defective laser device can be isolated by performing burn-in on laser devices mounted on a mounting substrate. The laser module includes laser devices that emit laser light, a driver IC for driving the laser devices, a mounting substrate on which the laser devices and the driver IC are mounted, a common electrode terminal to which a common electrode of the laser devices is connected, individual electrode terminals to which individual electrodes of the laser devices are respectively connected, driver terminals to which the driver IC is connected, and test terminals which are respectively connected to the common electrode terminal and the individual electrode terminals, and to which an external power supply is to be connected when performing burn-in of the laser devices, wherein the number of the laser devices and the number of the test terminals are each larger than the number of the driver terminals.

Abstract: An integrated device includes an optical element and an electrical element that are implemented on a substrate. The optical element and the electrical element are bonded by surface-activated bonding technology to a bonding portion that is formed on the substrate and made of metal material.

Abstract: An optical module and a fabrication method thereof, the optical module includes a sub-substrate which includes a support layer, an active layer, a BOX layer interposed between the support layer and the active layer, and a height adjusting layer, an optical fiber, and an optical device which is fixed to a silicon substrate, wherein the sub-substrate includes a fixing groove formed by the active layer and the BOX layer, the optical fiber is fixed to the fixing groove, and the optical fiber is optically coupled to the optical device by positioning the sub-substrate via the height adjusting layer with respect to the silicon substrate.

Abstract: The present invention is a laser light source device having: a silicon substrate having a first flat surface and a second flat surface which is formed at a position lower than the first flat surface by a level difference in the thickness direction; a first junction having a microbump structure comprising Au formed on the first flat surface; a second junction having a microbump structure comprising Au formed on the second flat surface; a first optical element and a second optical element for emitting laser light, which are joined to the first junction by a surface activation technique; a reflective member for reflecting the laser light from the first optical element toward a multiplexer, the reflective member being joined to the second junction by the abovementioned technique; and a multiplexer for directly receiving the laser light from the second optical element and multiplexing the laser light from the first optical element and the laser light from the second optical element, the multiplexer being joined to

Abstract: On a mounting substrate 101, an LD element 102 and a wavelength converter element 103 are mounted as optical elements. An end of an optical fiber 105 is fixed, at a given length, in a fiber anchoring groove 301 of a sub-substrate 104. The sub-substrate 104 is mounted to the mounting substrate 101 with the surface supporting the optical fiber 105 opposing thereto, and the wavelength converter element 103 and the optical fiber 105 being coupled. By mounting of the sub-substrate 104 to the mounting substrate 101, the coupling position of the output end of the wavelength converter element 103 and the input end of the optical fiber 105 is provided an internal position that is a given distance from the end of mounting substrate 101.

Abstract: Provided is an optical device capable of bonding each optical part to a substrate with the same applied load by surface activated bonding even if the planar shape sizes of a plurality of optical parts to be mounted on the substrate are different from one another. The optical device includes a substrate, a plurality of optical parts different in planar shape size, bonded to the substrate by surface activated bonding adjacent to one another, and optically coupled with one another, and a plurality of bonding parts provided on the substrate in correspondence to the plurality of optical parts and including metallic micro bumps for bonding each optical part. The total area of the top surfaces of the micro bumps to be bonded to the corresponding optical part of each of the plurality of bonding parts is substantially the same.

Abstract: The invention is directed to the provision of an optical integrated device wherein provisions are made to be able to mount components on a substrate with high accuracy and high packing density without having to heat the components. The optical integrated device includes a substrate, an optical device optically coupled to a first device, and an electrical device mounted on top of the optical device or on top of a second device, wherein the optical device is bonded to the substrate by surface activated bonding via a first bonding portion formed from a metallic material on the substrate, and the electrical device is bonded to the optical device or the second device by surface activated bonding via a second bonding portion formed from a metallic material on the optical device or the second device.