Abstract: The invention provides an optical device and an optical device manufacturing method wherein provisions are made to be able to precisely align an optical fiber relative to a substrate without heating the substrate and to maintain the optimum alignment condition for an extended period of time. More specifically, the invention provides an optical device manufacturing method which includes the steps of forming a first metallic film on a portion of a substrate, forming a second metallic film on a portion of the outer circumference of an optical fiber, and bonding together the first metallic film and the second metallic film by surface activated bonding, and an optical device manufactured by such a manufacturing method.

Abstract: The invention is directed to the provision of an optical device in which provisions are made to form a gap between an optical waveguide and a substrate without having to form a groove or the like in the substrate and to prevent any stress from being applied to an optical element even when it is heated by a heater for temperature adjustment. More specifically, the invention provides an optical device includes a substrate, an optical element with an optical waveguide formed in a surface thereof that faces the substrate, bonding portions formed on the substrate at positions that oppose each other across the optical waveguide, a heater, formed on at least one of the optical element and the substrate, for heating the optical waveguide, and a micro bump structure formed from a metallic material, wherein the optical element is bonded to the bonding portions via the micro bump structure in such a manner that a gap is formed between the optical waveguide and the substrate.

Abstract: Provided is an optical device capable of bonding each optical part to a substrate with the same applied load by surface activated bonding even if the planar shape sizes of a plurality of optical parts to be mounted on the substrate are different from one another. The optical device includes a substrate, a plurality of optical parts different in planar shape size, bonded to the substrate by surface activated bonding adjacent to one another, and optically coupled with one another, and a plurality of bonding parts provided on the substrate in correspondence to the plurality of optical parts and including metallic micro bumps for bonding each optical part. The total area of the top surfaces of the micro bumps to be bonded to the corresponding optical part of each of the plurality of bonding parts is substantially the same.

Abstract: An optical module and a fabrication method thereof, the optical module includes a sub-substrate which includes a support layer, an active layer, a BOX layer interposed between the support layer and the active layer, and a height adjusting layer, an optical fiber, and an optical device which is fixed to a silicon substrate, wherein the sub-substrate includes a fixing groove formed by the active layer and the BOX layer, the optical fiber is fixed to the fixing groove, and the optical fiber is optically coupled to the optical device by positioning the sub-substrate via the height adjusting layer with respect to the silicon substrate.

Abstract: The invention provides an optical device and an optical device manufacturing method wherein provisions are made to be able to precisely align an optical fiber relative to a substrate without heating the substrate and to maintain the optimum alignment condition for an extended period of time. More specifically, the invention provides an optical device manufacturing method which includes the steps of forming a first metallic film on a portion of a substrate, forming a second metallic film on a portion of the outer circumference of an optical fiber, and bonding together the first metallic film and the second metallic film by surface activated bonding,, and an optical device manufactured by such a manufacturing method.

Abstract: To provide a liquid crystal device and a method of manufacturing the liquid crystal device which has high durability in an environment of high temperature and high humidity, and which can be applied to optical communication device. A liquid crystal device and a method of manufacturing the liquid crystal device includes a first substrate provided with a frame shaped seal region for encapsulating a liquid crystal layer, and a second substrate provided in opposition to the first substrate, wherein a gold frame shaped structure is provided in the seal region of the first substrate so as to be crushed and deformed to form metallic bond when superimposed and joined to the second substrate, and wherein a gold film is disposed in the portion of the second substrate opposed to the gold frame shaped structure so as to form metallic bond to the gold frame shaped structure.

Abstract: On a mounting substrate 101, an LD element 102 and a wavelength converter element 103 are mounted as optical elements. An end of an optical fiber 105 is fixed, at a given length, in a fiber anchoring groove 301 of a sub-substrate 104. The sub-substrate 104 is mounted to the mounting substrate 101 with the surface supporting the optical fiber 105 opposing thereto, and the wavelength converter element 103 and the optical fiber 105 being coupled. By mounting of the sub-substrate 104 to the mounting substrate 101, the coupling position of the output end of the wavelength converter element 103 and the input end of the optical fiber 105 is provided an internal position that is a given distance from the end of mounting substrate 101.

Abstract: The present invention is directed to provide a method of manufacturing an optical module in which optical devices are optically aligned with high precision regardless of elastic return of bonding bumps. The invention provides a method of manufacturing an optical module including the steps of forming bumps for bonding made of metal on a substrate, and bonding a second optical device on the bonding bumps by applying a load so that the bumps for bonding are deformed only by a predetermined amount from a position where a first optical device and the second optical device are optically coupled most efficiently and, after that, releasing the load.

Abstract: An integrated device includes an optical element and an electrical element that are implemented on a substrate. The optical element and the electrical element are bonded by surface-activated bonding technology to a bonding portion that is formed on the substrate and made of metal material.