Abstract: A camera module includes an image sensor, a lens assembly, and a mechanical actuator. The lens assembly is positioned to focus an image on the image sensor and includes a variable focus lens. The mechanical actuator causes relative translation between the lens assembly and the image sensor in each of an X-direction parallel to a first lateral axis and a Y-direction parallel to a second lateral axis. The first lateral axis is substantially perpendicular to an optical axis of the lens assembly, and the second lateral axis substantially perpendicular to each of the optical axis and the first lateral axis. The lens assembly is fixed relative to the image sensor in each of a first rotational direction about the first lateral axis and a second rotational direction about the second lateral axis.

Abstract: A camera module includes an image sensor, a lens assembly, and a mechanical actuator. The lens assembly is positioned to focus an image on the image sensor and includes a variable focus lens. The mechanical actuator causes relative translation between the lens assembly and the image sensor in each of an X-direction parallel to a first lateral axis and a Y-direction parallel to a second lateral axis. The first lateral axis is substantially perpendicular to an optical axis of the lens assembly, and the second lateral axis substantially perpendicular to each of the optical axis and the first lateral axis. The lens assembly is fixed relative to the image sensor in each of a first rotational direction about the first lateral axis and a second rotational direction about the second lateral axis.

Abstract: A method of manufacturing a sheet of fused silica includes polishing a sheet of fused silica having a thickness of less than 500 ?m and a major face surface area of at least 6? square inches. The polishing is performed by removing less than 100 micrometers depth of material of a major surface of the sheet, such as by bonding the sheet to a substrate, polishing a first major side of the sheet, debonding the sheet from the substrate, flipping the sheet, bonding the flipped sheet to the substrate or a new substrate, and polishing a second major side of the sheet. Prior to polishing, the sheet has a peak-to-valley waviness of at least 1 micrometer, but after polishing has peak-to-valley waviness less than 500 nanometers.