Abstract: A sensor, particularly an impedance sensor, for example a soot sensor, is provided which has two mutually electrically insulated electrodes, wherein at least one external electrode is formed from a composite of metal and inorganic oxide as a film pattern having a film thickness of 0.5 to 20 ?m. The trace width of the film pattern and the spacing between the traces is 5 to 70 ?m and the border region around the conductor trace edge varies less than 10 ?m. Both electrodes can be arranged adjacent to each other as a film pattern in a plane. Preferably, the sensor has a heater. For mass production, electrodes are produced as a film pattern having a film thickness of 0.5 to 20 ?m on electrically insulating oxide bases and, following full-surface imprinting of a metal powder and oxide-containing paste, the electrodes are structured particularly accurately as traces from the printed film. In particular, the film thickness of the printed film is reduced.

Abstract: A sensor, particularly an impedance sensor, for example a soot sensor, is provided which has two mutually electrically insulated electrodes, wherein at least one external electrode is formed from a composite of metal and inorganic oxide as a film pattern having a film thickness of 0.5 to 20 ?m. The trace width of the film pattern and the spacing between the traces is 5 to 70 ?m and the border region around the conductor trace edge varies less than 10 ?m. Both electrodes can be arranged adjacent to each other as a film pattern in a plane. Preferably, the sensor has a heater. For mass production, electrodes are produced as a film pattern having a film thickness of 0.5 to 20 ?m on electrically insulating oxide bases and, following full-surface imprinting of a metal powder and oxide-containing paste, the electrodes are structured particularly accurately as traces from the printed film. In particular, the film thickness of the printed film is reduced.

Abstract: A high temperature-stable sensor is provided in which electrodes on a substrate or an insulation layer are in contact with a sensitive layer, wherein the electrodes have platinum, rhodium, or iridium or an electrically conductive oxide layer. For this purpose, an intermediate product is provided as a platform chip, which has a deposited layer made of platinum, rhodium, or iridium or an alloy of platinum, rhodium, or iridium and is covered by an electrically conductive oxide. From the deposited layer, a conductive structure is formed and thus a platform chip is created with an electrically conductive structure subject to external influences. This structure has an electrically conductive oxide and/or its parts have long-term, stable characteristic resistance curves under high-temperature loading above about 500° C., especially between about 600° C. and 950° C. A sensor with a gas-sensitive layer formed as a gas-sensitive sensor is preferred.

Abstract: The invention relates to the arrangement of a film resistor (chip) in an exhaust-gas pipe or exhaust-gas recirculation pipe, wherein the film resistor is fixed in a carrier, which is sealed against a shield or a housing, wherein this shield or housing is connected tightly to the exhaust-gas pipe or exhaust-gas recirculation pipe, wherein the carrier and the shield or the housing are sealed against each other spaced apart from the exhaust-gas pipe or exhaust-gas recirculation pipe radially outside of this pipe.

Abstract: A flow sensor element and a method for self-cleaning of the flow sensor element are provided, in which a temperature-measuring element and a heating element are arranged on a carrier element, and these elements can form a multiple-part ceramic component. The temperature-measuring element has a platinum thin-film resistor on a ceramic substrate for the temperature measurement and is heated with an additional platinum thin-film resistor. A measurement device, in particular an anemometric measurement device of a flow sensor, contains film resistors mounted in at least one opening of a cover or a hollow body. Two of the film resistors have resistance values differing by one to three orders of magnitude. The anemometric measurement device has a temperature sensor and a heat output sensor set in a carrier element. The temperature sensor has a temperature-measuring resistor and a heat conductor, as platinum thin-film or thick-film resistors, on a ceramic substrate.

Abstract: A measurement device, in particular anemometric measurement device of a flow sensor, contains film resistors in one or more opening(s) of a cover or a hollow body. The film resistors are fastened according to the invention in the opening(s). Two film resistors differ with respect to their resistance by one to three orders of magnitude. In an anemometric measurement device of a flow sensor according to the invention, a temperature sensor and a heating capacity sensor are placed in a carrier element. The temperature sensor has a temperature-measuring resistor and a heat conductor as platinum thin-film or thick-film resistors on a ceramic substrate. For self-cleaning of an anemometric measurement device of a flow sensor, in which a temperature-measuring element and a heating element are placed in a carrier element, the temperature-measuring element has a platinum thin-film resistor on a ceramic substrate for temperature measurement and is heated with an additional platinum thin-film resistor.

Abstract: A high-temperature platform chip has at least three electrodes on an electrically insulating substrate constructed as a heating plate with a heat conductor on the back side.

Abstract: A flow sensor element and a method for self-cleaning of the flow sensor element are provided, in which a temperature-measuring element and a heating element are arranged on a carrier element, and these elements can form a multiple-part ceramic component. The temperature-measuring element has a platinum thin-film resistor on a ceramic substrate for the temperature measurement and is heated with an additional platinum thin-film resistor. A measurement device, in particular an anemometric measurement device of a flow sensor, contains film resistors mounted in at least one opening of a cover or a hollow body. Two of the film resistors have resistance values differing by one to three orders of magnitude. The anemometric measurement device has a temperature sensor and a heat output sensor set in a carrier element. The temperature sensor has a temperature-measuring resistor and a heat conductor, as platinum thin-film or thick-film resistors, on a ceramic substrate.

Abstract: The present invention relates to soot sensors based on one-piece strip conductor structures, to methods for measuring soot, and to the use of heat conductor chips for soot measurement. For this purpose, the invention is based on the sensitivity of intensive variables, especially substance-specific variables. According to the invention, an electric soot sensor is provided, in which at least one chip is provided with at least one one-piece strip conductor having, in particular, two terminal panels, and the soot sensor has a soot determination facility that is adapted to determine an intensive or specific change of a surface. The inventive method is characterized by soot deposits causing a change of an intensive variable, especially of a thermospecific or electrical parameter of a chip, and by determination of said variable.

Abstract: A high temperature-stable sensor is provided in which electrodes on a substrate or an insulation layer are in contact with a sensitive layer, wherein the electrodes have platinum, rhodium, or iridium or an electrically conductive oxide layer. For this purpose, an intermediate product is provided as a platform chip, which has a deposited layer made of platinum, rhodium, or iridium or an alloy of platinum, rhodium, or iridium and is covered by an electrically conductive oxide. From the deposited layer, a conductive structure is formed and thus a platform chip is created with an electrically conductive structure subject to external influences. This structure has an electrically conductive oxide and/or its parts have long-term, stable characteristic resistance curves under high-temperature loading above about 500° C., especially between about 600° C. and 950° C. A sensor with a gas-sensitive layer formed as a gas-sensitive sensor is preferred.

Abstract: A flow sensor element is provided having at least one temperature-measuring element and at least one heating element each having at least one platinum thin film resistor, the at least one temperature-measuring element and the at least one heating element each being arranged on a carrier element which is formed from a ceramic foil laminate or a multi-part ceramic component. The carrier elements have electrical conductor paths and junction surfaces for electrically contacting the at least one temperature-measuring element and the at least one heating element. The at least one temperature-measuring element and the at least one heating element each have a metallic carrier foil with an electrically insulating coating, on which the platinum thin film resistors are arranged. The flow sensor element may be used for mass through-flow measurements of gaseous or liquid media in pipe ducts, for example in an exhaust gas pipe of an internal combustion engine.

Abstract: A semiconductor component with an integrated circuit has a cooling body as a heat sink and a temperature sensor thermally connected thereto, whose resistance is dependent on temperature. The temperature sensor contains a thin film measuring resistor, which is applied to an electrically insulating surface of a foil-like substrate, and the total thickness of the temperature sensor lies in a range of about 10 &mgr;m to 100 &mgr;m. The thin film measuring resistor is formed as a planar component, with the temperature sensor being arranged between the integrated circuit and the cooling body. The thin film measuring resistor is provided on one side with a thermal coupling layer bordering on the cooling body, while on the other side the resistor has a substrate bordering on a heat distributor, which at least partially surrounds the integrated circuit.

Abstract: A flow sensor element is provided having at least one temperature-measuring element and at least one heating element each having at least one platinum thin film resistor, the at least one temperature-measuring element and the at least one heating element each being arranged on a carrier element which is formed from a ceramic foil laminate or a multi-part ceramic component. The carrier elements have electrical conductor paths and junction surfaces for electrically contacting the at least one temperature-measuring element and the at least one heating element. The at least one temperature-measuring element and the at least one heating element each have a metallic carrier foil with an electrically insulating coating, on which the platinum thin film resistors are arranged. The flow sensor element may be used for mass through-flow measurements of gaseous or liquid media in pipe ducts, for example in an exhaust gas pipe of an internal combustion engine.

Abstract: A temperature-dependent measuring resistance with low mass and thereby rapid response time has a conductor path provided with at least two connection contact pads. The conductor path is applied to a metal substrate with an insulation layer (membrane) situated thereon. A portion of the conductor path spans a recess of the substrate in a bridge-like manner. The conductor path is selectively covered by a passivation layer up to its connection contact pads.

Abstract: A semiconductor component with an integrated circuit has a cooling body as a heat sink and a temperature sensor thermally connected thereto, whose resistance is dependent on temperature. The temperature sensor contains a thin film measuring resistor, which is applied to an electrically insulating surface of a foil-like substrate, and the total thickness of the temperature sensor lies in a range of about 10 &mgr;m to 100 &mgr;m. The thin film measuring resistor is formed as a planar component, with the temperature sensor being arranged between the integrated circuit and the cooling body. The thin film measuring resistor is provided on one side with a thermal coupling layer bordering on the cooling body, while on the other side the resistor has a substrate bordering on a heat distributor, which at least partially surrounds the integrated circuit.

Abstract: For reduction of toxic components in exhaust gases of internal combustion engines, particularly of nitrogen oxides in motor vehicles, a portion of the exhaust gases, essentially operating as inert gases, are recirculated into the combustion chamber of the engine for the purpose of reducing the peak combustion temperature. In the air intake region the engine is fed an adjustable mixture of partially recirculated exhaust gas and air, wherein the mass of in-flowing air and the mass of exhaust gas recirculated from the engine following its cleaning and cooling are fed respectively to its own flow rate sensor. From the determined mass flow amounts of in-flowing air and recirculated exhaust gas, an actual value signal is formed and compared with a target value signal dependent upon the respective performance specification. A regulation deviation of the actual value signal leads to an adjustment signal, which intervenes into the exhaust gas recirculation for the purpose of adjusting the amount recirculated.

Abstract: For reduction of toxic components in exhaust gases of internal combustion engines, particularly of nitrogen oxides in motor vehicles, a portion of the exhaust gases, essentially operating as inert gases, are recirculated into the combustion chamber of the engine for the purpose of reducing the peak combustion temperature. In the air intake region the engine is fed an adjustable mixture of partially recirculated exhaust gas and air, wherein the mass of in-flowing air and the mass of exhaust gas recirculated from the engine following its cleaning and cooling are fed respectively to its own flow rate sensor. From the determined mass flow amounts of in-flowing air and recirculated exhaust gas, an actual value signal is formed and compared with a target value signal dependent upon the respective performance specification. A regulation deviation of the actual value signal leads to an adjustment signal, which intervenes into the exhaust gas recirculation for the purpose of adjusting the amount recirculated.

Abstract: A composite wire is provided as a connection wire for electric temperature sensors, the wire having a core made of a nickel-based alloy which self-passivates at the core surface, wherein the core has a jacket made of platinum. A suitable nickel-based alloy which self-passivates at the core surface contains chromium in a range of about 16 to 22-wt %, preferably about 20-wt %.

Abstract: For reductions of toxic components in exhaust gases of internal combustion engines, particularly of nitrogen oxides in motor vehicles, a portion of the exhaust gases, essentially operating as inert gases, are recirculated into the combustion chamber of the engine for the purpose of reducing the peak combustion temperature. In the air intake region the engine is fed an adjustable mixture of partially recirculated exhaust gas and air, wherein the mass of in-flowing air and the mass of exhaust gas recirculated from the engine following its cleaning and cooling are fed respectively to its own flow rate sensor. From the determined mass flow amounts of in-flowing air and recirculated exhaust gas, an actual value signal is formed and compared with a target value signal dependent upon the respective performance specification. A regulation deviation of the actual value signal leads to an adjustment signal, which intervenes into the exhaust gas recirculation for the purpose of adjusting the amount recirculated.

Abstract: In order to connect contact surfaces of electric component blanks for layer resistors to at least two elongated, metallic connection leads, elongated, slot-shaped openings are made, e.g., by etching, in a continuous metal sheet to manufacture a connection lead blank. The openings border on later connection leads of the connection blank and cross-struts yet to be removed. In a second step, the connection lead blank is brought into a cassette and seized, whereby one of the cross-struts projects out of the cassette and is separated in a third step, such that the free ends of the parallel-running connection leads project out of the cassette. In a fourth step, the cassette is brought into a bonding or welding device, so that the free ends of the connection leads cover the contact surfaces of a component blank or a multi-component blank and are connected together by a bonding or welding operation. In case a multi-component blank (multi-unit plate) is used, it is then separated into individual components.