Abstract: A storage device includes a bottom surface, a plurality of sides, and a top surface. The top surface integrally couples to the plurality of sides. The bottom surface, the plurality of sides, and the top surface form an outer surface of the storage device. The top surface, when coupled to the bottom surface, contacts one or more internal components of the storage device. The top surface comprises a plurality of finned ridges and a smooth continuous mounting surface. The plurality of finned ridges protrudes away from the outer surface of the storage device. The plurality of finned ridges is formed to direct heat away from the storage device. The smooth continuous mounting surface is configured to accept attachment of a thermal dissipation module.

Abstract: A peripheral component interconnect includes a cable with a header. The header includes a cable connector and a heat sink. The heat sink has a cross-section that is reduced at an end that is opposite of the cable connector. In addition or in the alternative, a peripheral component interconnect card includes a circuit board and a bracket, an electrical component, a board connector, and a rail mounted to the circuit board. The bracket includes a port for a cable to pass through, and the rail is configured to engage the cable and define a pathway that rotates between the bracket and the board connector. In addition or in the alternative an electrical connection system includes a chassis with a guide, a card, and a cable. The cable includes a guiding feature that engages the guide which directs the cable connector from being misaligned to being aligned with the board connector.

Abstract: A peripheral component interconnect includes a cable with a header. The header includes a cable connector and a heat sink. The heat sink has a cross-section that is reduced at an end that is opposite of the cable connector. In addition or in the alternative, a peripheral component interconnect card includes a circuit board and a bracket, an electrical component, a board connector, and a rail mounted to the circuit board. The bracket includes a port for a cable to pass through, and the rail is configured to engage the cable and define a pathway that rotates between the bracket and the board connector. In addition or in the alternative an electrical connection system includes a chassis with a guide, a card, and a cable. The cable includes a guiding feature that engages the guide which directs the cable connector from being misaligned to being aligned with the board connector.

Abstract: A storage device includes a bottom surface, a plurality of sides, and a top surface. The top surface integrally couples to the plurality of sides. The bottom surface, the plurality of sides, and the top surface form an outer surface of the storage device. The top surface, when coupled to the bottom surface, contacts one or more internal components of the storage device. The top surface comprises a plurality of finned ridges and a smooth continuous mounting surface. The plurality of finned ridges protrudes away from the outer surface of the storage device. The plurality of finned ridges is formed to direct heat away from the storage device. The smooth continuous mounting surface is configured to accept attachment of a thermal dissipation module.

Abstract: A cable connector housing attachment for protecting and directing a cable including an anchor portion configured for attachment to a cable connector housing; and a cable guide portion comprising a base wall, a first side wall, and a second side wall each extending from the anchor portion in the direction of the cable from the cable connector housing, wherein the first side wall comprises a guiding edge opposite the anchor portion, wherein the guiding edge creates a non-parallel and non-perpendicular angle relative to the direction of the cable from the cable connector housing, and wherein the guiding edge directs a bend of the cable in a direction offset from the direction of the cable from the cable connector housing.

Abstract: An electronic interconnect includes a board, a rotatable connector, and a heat sink. The board extends along a plane, and the rotatable connector is connected to the board. The rotatable connector is configured to allow rotation about an axis parallel to the plane, between a first position and a second position. The heat sink is connected to the rotatable connector and extends a first distance from the board in the first position and a second, greater distance from the board in the second position.

Abstract: A microfluidic control apparatus, such as a relief valve, includes a pressure containing housing to contain a fluid within an interior of the pressure containing housing, and a nanotube in fluid communication between the interior of the pressure containing housing and an exterior of the pressure containing housing. The nanotube is used to contain water therein such that, below a predetermined temperature, the water within the nanotube prevents pressure relief through the nanotube from the interior to the exterior of the pressure containing housing, and above the predetermined temperature, the water within the nanotube enables pressure relief through the nanotube from the interior to the exterior of the pressure containing housing.

Abstract: A heat sink assembly, includes: a first heat sink; an adhesive thermal interface material applied to the first heat sink to mate the first heat sink to a first heat-generating component; a second heat sink; one or more support members connecting the first heat sink and the second heat sink; and a non-adhesive thermal interface material applied to the second heat sink to mate the second heat sink to a second heat-generating component.

Abstract: A heat sink assembly, includes: a first heat sink; an adhesive thermal interface material applied to the first heat sink to mate the first heat sink to a first heat-generating component; a second heat sink; one or more support members connecting the first heat sink and the second heat sink; and a non-adhesive thermal interface material applied to the second heat sink to mate the second heat sink to a second heat-generating component.

Abstract: A heat sink can be attached to a heat-producing electronic device by aligning an adhesive material to a surface of the heat sink, applying the adhesive material to the surface to form an outer perimeter and applying, within the outer perimeter, a thermally conductive material to the surface. The surface of the heat sink and a surface of the heat-producing electronic device can then be aligned, and the heat sink can be assembled to the heat-producing electronic device by bringing the heat-producing electronic device surface into contact with the adhesive material. The heat sink can then be affixed to the heat-producing electronic device by applying a compressive force to the assembly to activate the adhesive material.

Abstract: A microfluidic control apparatus, such as a relief valve, includes a pressure containing housing to contain a fluid within an interior of the pressure containing housing, and a nanotube in fluid communication between the interior of the pressure containing housing and an exterior of the pressure containing housing. The nanotube is used to contain water therein such that, below a predetermined temperature, the water within the nanotube prevents pressure relief through the nanotube from the interior to the exterior of the pressure containing housing, and above the predetermined temperature, the water within the nanotube enables pressure relief through the nanotube from the interior to the exterior of the pressure containing housing.

Abstract: A cooling system that includes two or more fans that each have a chassis. The chassis includes a first face, a second face, and a sidewall. The fans then can be attached to each other by attaching a sidewall of a first fan chassis to a sidewall of a second fan chassis. An adjustable vane is attached perpendicularly and approximately equidistant between the fans, with an angular control element that is attached to the first fan chassis. The vane can be oriented such that the vane divides the airflow distributed to the fans. The vane then can be adjusted radially by the angular control element, which is attached to the fan chassis. If an impeller of a fan chassis fails the vane can be adjusted radially using an angular control element to distribute more airflow to the failed fan superimposing the non-failed fan chassis.

Abstract: A heat sink can be attached to a heat-producing electronic device by aligning an adhesive material to a surface of the heat sink, applying the adhesive material to the surface to form an outer perimeter and applying, within the outer perimeter, a thermally conductive material to the surface. The surface of the heat sink and a surface of the heat-producing electronic device can then be aligned, and the heat sink can be assembled to the heat-producing electronic device by bringing the heat-producing electronic device surface into contact with the adhesive material. The heat sink can then be affixed to the heat-producing electronic device by applying a compressive force to the assembly to activate the adhesive material.

Abstract: A heat sink can be attached to a heat-producing electronic device by aligning an adhesive material to a surface of the heat sink, applying the adhesive material to the surface to form an outer perimeter and applying, within the outer perimeter, a thermally conductive material to the surface. The surface of the heat sink and a surface of the heat-producing electronic device can then be aligned, and the heat sink can be assembled to the heat-producing electronic device by bringing the heat-producing electronic device surface into contact with the adhesive material. The heat sink can then be affixed to the heat-producing electronic device by applying a compressive force to the assembly to activate the adhesive material.

Abstract: A heat sink can be attached to a heat-producing electronic device by aligning an adhesive material to a surface of the heat sink, applying the adhesive material to the surface to form an outer perimeter and applying, within the outer perimeter, a thermally conductive material to the surface. The surface of the heat sink and a surface of the heat-producing electronic device can then be aligned, and the heat sink can be assembled to the heat-producing electronic device by bringing the heat-producing electronic device surface into contact with the adhesive material. The heat sink can then be affixed to the heat-producing electronic device by applying a compressive force to the assembly to activate the adhesive material.

Abstract: A heat sink can be attached to a heat-producing electronic device by aligning an adhesive material to a surface of the heat sink, applying the adhesive material to the surface to form an outer perimeter and applying, within the outer perimeter, a thermally conductive material to the surface. The surface of the heat sink and a surface of the heat-producing electronic device can then be aligned, and the heat sink can be assembled to the heat-producing electronic device by bringing the heat-producing electronic device surface into contact with the adhesive material. The heat sink can then be affixed to the heat-producing electronic device by applying a compressive force to the assembly to activate the adhesive material.

Abstract: A cooling system that includes two or more fans that each have a chassis. The chassis includes a first face, a second face, and a sidewall. The fans then can be attached to each other by attaching a sidewall of a first fan chassis to a sidewall of a second fan chassis. An adjustable vane is attached perpendicularly and approximately equidistant between the fans, with an angular control element that is attached to the first fan chassis. The vane can be oriented such that the vane divides the airflow distributed to the fans. The vane then can be adjusted radially by the angular control element, which is attached to the fan chassis. If an impeller of a fan chassis fails the vane can be adjusted radially using an angular control element to distribute more airflow to the failed fan superimposing the non-failed fan chassis.

Abstract: A heat sink can be attached to a heat-producing electronic device by aligning an adhesive material to a surface of the heat sink, applying the adhesive material to the surface to form an outer perimeter and applying, within the outer perimeter, a thermally conductive material to the surface. The surface of the heat sink and a surface of the heat-producing electronic device can then be aligned, and the heat sink can be assembled to the heat-producing electronic device by bringing the heat-producing electronic device surface into contact with the adhesive material. The heat sink can then be affixed to the heat-producing electronic device by applying a compressive force to the assembly to activate the adhesive material.

Abstract: A heat sink can be attached to a heat-producing electronic device by aligning an adhesive material to a surface of the heat sink, applying the adhesive material to the surface to form an outer perimeter and applying, within the outer perimeter, a thermally conductive material to the surface. The surface of the heat sink and a surface of the heat-producing electronic device can then be aligned, and the heat sink can be assembled to the heat-producing electronic device by bringing the heat-producing electronic device surface into contact with the adhesive material. The heat sink can then be affixed to the heat-producing electronic device by applying a compressive force to the assembly to activate the adhesive material.