Patents by Inventor Katsuaki Nakano

Katsuaki Nakano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120075880
    Abstract: The conventional light source unit has problems of an increasing size and radiation. According to the present invention, a direction ā€œDā€ for mounting the connector 14 at a power source side to a connector portion 13 is perpendicular or substantially perpendicular with respect to a direction O-O for mounting a light source unit 1 to the vehicle light unit 100. As a result, the present invention can decrease a depth space of the light source unit and efficiently radiated heat generated by the light emitting chips 40 to 44, resistances RS, RT, RP, diodes DS, DT, and conductors 51 to 57 from a heat radiation member 8 to an outside.
    Type: Application
    Filed: September 26, 2011
    Publication date: March 29, 2012
    Inventors: Masateru HAYASHI, Katsuaki Nakano
  • Publication number: 20120026747
    Abstract: A capacity of a sealing member is reduced to its required minimum. The present invention provides: a board 3; light emitting chips 40 to 44; a control element; wiring elements 51 to 56, 61 to 65, and 610 to 650; a bank member 18; and a sealing member 180. The sealing member 180 is injected into the bank member 18, and the light emitting chips 40 to 44 and a part of the wiring elements are sealed. The present invention is capable of reducing the capacity of the sealing member 180 to its required minimum by means of the bank member 18.
    Type: Application
    Filed: July 27, 2011
    Publication date: February 2, 2012
    Inventors: Masateru HAYASHI, Katsuaki Nakano
  • Publication number: 20120007505
    Abstract: To reliably provide a wiring element for feeding power to a light emitting chip so as not to be shorted. The present invention provides: a board 3; light emitting chips 40 to 44; resistors R1 to R12 and diodes D1 and D2, each of which serves as a control element; and conductors 51 to 57, wire lines 61 to 65, and bonding portions 610 to 650, each of which serves as a wiring element. A first conductor 51 is mounted on either one side of a mount surface 34 of the board 3 that is divided into two sections by means of a line segment L connecting the light emitting chips 41, 42 and 43, 44. As a result, the present invention is capable of reliably providing the first conductor 51 and a third wire line 63 for feeding power to the light emitting chips 40 to 44 so as not to be shorted.
    Type: Application
    Filed: July 11, 2011
    Publication date: January 12, 2012
    Inventors: Masateru HAYASHI, Katsuaki Nakano
  • Publication number: 20110181186
    Abstract: In a conventional driving circuit, it has been inefficient and difficult to measure, classify, and rank Vf characteristics of a light emitting element that is in a bare-chip state. According to the present invention, a semiconductor-type light source is made of four light emitting chips 41 to 44 that are in a bare-chip state, the light emitting chips being randomly mounted on a board 3 without classifying Vf characteristics in advance. As the resistors, opening resistors R2, R4, R6 and trimming resistors R1, R3, R5 are disposed in parallel and then are connected in series to the four light emitting chips. Values of the resistors are adjusted so that a predetermined set current value or luminous flux value is reliably obtained with respect to the four light emitting chips. As a result, the present invention is capable of efficiently and easily mounting the four light emitting elements 41 to 44 and the resistors R1 to R7 on the board 3.
    Type: Application
    Filed: January 25, 2011
    Publication date: July 28, 2011
    Inventors: Katsuaki NAKANO, Masateru Hayashi
  • Publication number: 20110175529
    Abstract: The present invention includes a light source 10 and a socket 11. The light source 10 includes a base plate 3, light emitting chips 41 to 44 for a semiconductor-type light source, resistors 51, 52, diodes 53, 54 and wiring 6. The socket 11 includes an insulating member 7, a radiating member 8 and feed members 91 to 93. The light source 10 is attached to the socket 11. The base plate 3 is attached to the radiating member 8. Such a structure of the present invention can be implemented in reduced size and with an enhanced heat radiation effect.
    Type: Application
    Filed: January 18, 2011
    Publication date: July 21, 2011
    Inventors: Masateru HAYASHI, Katsuaki Nakano, Masaru Kojima
  • Publication number: 20110151237
    Abstract: Disclosed is a surface-treated ceramic member which has a coating film-formed surface comprising a ceramic sintered body with a porosity of 1% or less and a sol-gel coating film of a silicon alkoxide compound polymer formed on at least a part of a ceramic sintered body, wherein the coating film and the surface of the body are coexistent in the coating film-formed surface. Specifically the area of the sol-gel coating film accounts for 5 to 80% of the total area of the coating film-formed surface. The surface-treated ceramic member has excellent corrosion resistance and is free from scattering of particles.
    Type: Application
    Filed: February 14, 2011
    Publication date: June 23, 2011
    Applicants: ULVAC, Inc., Ferrotec Ceramics Corporation
    Inventors: Katsuaki NAKANO, Junichi Itoh, Daisuke Hiramatsu, Tadahisa Arahori, Ken Okamoto
  • Publication number: 20100287768
    Abstract: There is provided a method of manufacturing an electrostatic chuck which is free from fluctuations in performance or incomplete detachment from the beginning of use, without being influenced by the impurities that remain on the surface of, or in the inside of, a dielectric layer at the time of manufacturing thereof, in case the dielectric layer which comes into contact with an article to be held by the electrostatic chuck is made of silicone rubber or resin. Before assembling the dielectric layer into the surface of a base having disposed thereon an electrode, or after the dielectric layer has been assembled into the surface of the base, a step is performed in which a heating plate that has been heated to a predetermined temperature is pressed against the contact surface of the dielectric layer.
    Type: Application
    Filed: July 28, 2008
    Publication date: November 18, 2010
    Inventors: Yoshinori FUJII, Katsuaki NAKANO, Hidenori FUKUMOTO, Nobumasa MIYANAGA
  • Patent number: 6309107
    Abstract: A linear motion guide unit is disclosed, in which a track rail and a slider have respectively reference surfaces that serve to locate accurately them with respect to a bed and a table, thereby keeping the track rail and slider against dislocation as well as changes in posture. The track rail is mounted to the bed, with a reference side surface for mounting and a reference bottom surface for mounting of the track rail being brought into abutment against a mounting side surface and a mounting top surface of the bed, respectively. The slider is mounted to the table, with a reference side surface for mounting and a reference top surface for mounting of the slider being brought into abutment against a mounting side surface and a mounting lower surface of the table, respectively.
    Type: Grant
    Filed: March 29, 2000
    Date of Patent: October 30, 2001
    Assignee: Nippon Thompson Co., Ltd.
    Inventors: Hiroshi Ueki, Katsuaki Nakano