Patents by Inventor Katsuhiko Kawabata
Katsuhiko Kawabata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11837510Abstract: The present invention provides a method for analyzing a silicon substrate, by which impurities such as a very small amount of metal in a silicon substrate provided with a thick nitride film can be analyzed with high accuracy with ICP-MS, and is characterized by use of a silicon substrate analysis apparatus including an analysis scan port having a load port, a substrate conveyance robot, an aligner, a drying chamber, a vapor phase decomposition chamber, an analysis stage and a nozzle for analysis of a substrate; an analysis liquid collection unit; and an analyzer for performing inductive coupling plasma analysis.Type: GrantFiled: April 8, 2019Date of Patent: December 5, 2023Assignee: KIOXIA CORPORATIONInventors: Jiahong Wu, Katsuhiko Kawabata, Mitsumasa Ikeuchi, Sungjae Lee
-
Publication number: 20230335387Abstract: A method for analyzing a sample containing metal fine particles with an inductively coupled plasma mass spectrometer. The method enables analysis of the sample without the need of standard metal fine particles. Specifically, the present invention relates to a method for analyzing metal fine particles in liquid by use of an inductively coupled plasma mass spectrometer. In the method, the analysis apparatus is provided with a standard solution introduction apparatus including a standard solution storage unit for storing a standard solution containing a specific element in a known concentration, a syringe pump for suctioning and discharging the standard solution, and a solution introduction unit having a standard solution nebulizer and a standard solution spray chamber that are supplied with the standard solution, the standard solution is directly supplied to the standard solution nebulizer at a flow rate of 3 ?L/min or less.Type: ApplicationFiled: December 20, 2022Publication date: October 19, 2023Applicant: IAS Inc.Inventors: Katsuhiko Kawabata, Tatsuya Ichinose, Kohei Nishiguchi
-
Patent number: 11569081Abstract: The present invention provides a method for analyzing a sample containing metal fine particles with an inductive coupling plasma mass spectrometer. The method enables analysis of the sample without the need of standard metal fine particles. Specifically, the present invention relates to a method for analyzing metal fine particles in liquid by use of an inductive coupling plasma mass spectrometer. In the method, the analysis apparatus is provided with a standard solution introduction apparatus including a standard solution storage unit for storing a standard solution containing a specific element in a known concentration, a syringe pump for suctioning and discharging the standard solution, and a solution introduction unit having a standard solution nebulizer and a standard solution spray chamber that are supplied with the standard solution, the standard solution is directly supplied to the standard solution nebulizer at a flow rate of 3 ?L/min or less.Type: GrantFiled: August 29, 2019Date of Patent: January 31, 2023Assignee: IAS INC.Inventors: Katsuhiko Kawabata, Tatsuya Ichinose, Kohei Nishiguchi
-
Patent number: 11422071Abstract: A substrate analysis method using a nozzle for substrate analysis which discharges an analysis liquid from a tip thereof, scans a substrate surface with a discharged analysis liquid, and sucks the analysis liquid. This is done by arranging a liquid catch plate that catches the discharged analysis liquid, thus retaining analysis liquid discharged between the nozzle tip and the liquid catch plate; positioning the substrate so that the end part thereof can be inserted between the nozzle tip and the liquid catch plate; bringing the end part of the substrate into contact with analysis liquid retained between the nozzle tip and liquid catch plate; and moving the nozzle and liquid catch plate concurrently along a periphery of the substrate, while keeping the end part of the substrate in contact with the analysis liquid, to analyze the end part of the substrate.Type: GrantFiled: November 6, 2019Date of Patent: August 23, 2022Assignee: IAS, INC.Inventors: Katsuhiko Kawabata, Sungjae Lee, Takuma Hayashi
-
Publication number: 20220042882Abstract: A substrate analysis method using a nozzle for substrate analysis which discharges an analysis liquid from a tip thereof, scans a substrate surface with a discharged analysis liquid, and sucks the analysis liquid. This is done by arranging a liquid catch plate that catches the discharged analysis liquid, thus retaining analysis liquid discharged between the nozzle tip and the liquid catch plate; positioning the substrate so that the end part thereof can be inserted between the nozzle tip and the liquid catch plate; bringing the end part of the substrate into contact with analysis liquid retained between the nozzle tip and liquid catch plate; and moving the nozzle and liquid catch plate concurrently along a periphery of the substrate, while keeping the end part of the substrate in contact with the analysis liquid, to analyze the end part of the substrate.Type: ApplicationFiled: November 6, 2019Publication date: February 10, 2022Applicant: IAS, INC.Inventors: KATSUHIKO KAWABATA, SUNGJAE LEE, TAKUMA HAYASHI
-
Publication number: 20210118751Abstract: The present invention provides a method for analyzing a silicon substrate, by which impurities such as a very small amount of metal in a silicon substrate provided with a thick nitride film can be analyzed with high accuracy with ICP-MS, and is characterized by use of a silicon substrate analysis apparatus including an analysis scan port having a load port, a substrate conveyance robot, an aligner, a drying chamber, a vapor phase decomposition chamber, an analysis stage and a nozzle for analysis of a substrate; an analysis liquid collection unit; and an analyzer for performing inductive coupling plasma analysis.Type: ApplicationFiled: April 8, 2019Publication date: April 22, 2021Applicants: Kioxia Corporation, IAS Inc.Inventors: Jiahong Wu, Katsuhiko Kawabata, Mitsumasa Ikeuchi, Sungjae Lee
-
Patent number: 10688485Abstract: The present invention provides a substrate analysis nozzle that reliably prevents a leakage (release) of analysis solution from the nozzle even in the case of a highly hydrophilic substrate and that collects the analysis solution with a high collection ratio after scanning. The present invention is directed to a substrate analysis nozzle configured to discharge an analysis solution from a tip of the substrate analysis nozzle onto a substrate, configured to scan a surface of the substrate using the discharged analysis solution, and configured to suck the analysis solution. The substrate analysis nozzle has a triple-tube structure made up of: a pipe through which the analysis solution is discharged and sucked; a first outer tube surrounding the pipe and surrounding the analysis solution used for scanning; and a second outer tube surrounding the first outer tube.Type: GrantFiled: July 18, 2017Date of Patent: June 23, 2020Assignee: IAS, INCInventors: Katsuhiko Kawabata, Sungjae Lee
-
Publication number: 20190358622Abstract: The present invention provides a substrate analysis nozzle that reliably prevents a leakage (release) of analysis solution from the nozzle even in the case of a highly hydrophilic substrate and that collects the analysis solution with a high collection ratio after scanning. The present invention is directed to a substrate analysis nozzle configured to discharge an analysis solution from a tip of the substrate analysis nozzle onto a substrate, configured to scan a surface of the substrate using the discharged analysis solution, and configured to suck the analysis solution. The substrate analysis nozzle has a triple-tube structure made up of: a pipe through which the analysis solution is discharged and sucked; a first outer tube surrounding the pipe and surrounding the analysis solution used for scanning; and a second outer tube surrounding the first outer tube.Type: ApplicationFiled: July 18, 2017Publication date: November 28, 2019Applicant: IAS Inc.Inventors: Katsuhiko Kawabata, Sungjae Lee
-
Publication number: 20190013248Abstract: Provided is a nozzle for substrate analysis with a simple structure, which enables analysis to be reliably performed without leaking an analysis liquid when a substrate having high hydrophilicity is scanned with the analysis liquid. The nozzle for analysis of a substrate according to the present invention includes: a double pipe including a nozzle main body that discharges and suctions an analysis liquid, and an outer pipe disposed on the outer periphery of the nozzle main body so as to surround the scanning analysis liquid; exhaust means having an exhaust path between the nozzle main body and the outer pipe; and a gas spraying pipe for spraying an inert gas to the tip of the nozzle main body in a direction substantially parallel to a substrate surface, the gas spraying pipe being disposed on the outer periphery of the tip of the outer pipe and on a side opposite to a scanning direction of the nozzle.Type: ApplicationFiled: October 25, 2016Publication date: January 10, 2019Applicant: IAS INC.Inventors: Katsuhiko Kawabata, Sungjae Lee, Tatsuya Ichinose
-
Patent number: 10151727Abstract: An object of the present invention is to provide an analysis apparatus in which local analysis of a substrate with ICP-MS is automated. The present invention relates to an automatic analysis apparatus for a local region of a substrate, including: a nozzle for local analysis having: analysis-liquid supply means that ejects analysis liquid onto a substrate; analysis-liquid discharge means that takes the analysis liquid including an object to be analyzed from the substrate into the nozzle to feed the analysis liquid to a nebulizer; and exhaust means including an exhaust channel in the nozzle; automatic liquid-feed means that automatically feeds the collected analysis liquid to ICP-MS; flow adjustment means that adjusts the flow of the analysis liquid; and automatic control means that simultaneously performs local analysis and analysis of the object to be analyzed with the ICP-MS to perform automatic analysis to a plurality of adjacent predetermined regions, successively.Type: GrantFiled: July 21, 2015Date of Patent: December 11, 2018Assignees: IAS, INC., SHIN_ETSU HANDOTAI CO., LTD.Inventors: Katsuhiko Kawabata, Tatsuya Ichinose, Toshihiko Imai
-
Publication number: 20180217036Abstract: A silicon substrate analyzing device with which impurities such as trace metals in a silicon substrate having a thick nitride film or oxide film formed on a silicon substrate surface can be analyzed with a high precision by ICP-MS. The silicon substrate analyzing device includes a load port, a substrate transportation robot, an aligner, a drying chamber, a gas-phase decomposition chamber, an analysis scan port having an analysis stage and a substrate analyzing nozzle, an analysis liquid collecting means, and an analysis means for performing inductively coupled plasma mass spectrometry. The silicon substrate having an oxide film or a nitride film formed on the silicon substrate is subjected to scanning the surface of the silicon substrate with a high-concentration recovered liquid with use of the substrate analyzing nozzle so that the high-concentration recovered liquid is recovered.Type: ApplicationFiled: August 16, 2016Publication date: August 2, 2018Applicant: IAS Inc.Inventors: Katsuhiko Kawabata, Tatsuya Ichinose, Hayashi Takuma
-
Patent number: 10024801Abstract: The present invention relates to an analysis system capable of online transferring an analysis sample and promptly acquiring an analysis result. The analysis system capable of analyzing the analysis samples supplied from at least two sites, with one analysis apparatus, and requiring no cleaning process for a nebulizer and a spray chamber, is provided. The present invention relates to analysis system including at least two sample individually transferring units. Each sample transferring path of the sample individually transferring units is coupled to a plasma torch of a common analysis unit including the one analysis apparatus with inductively-coupled plasma or microwave plasma. Each sample transferring path has a main flow path, a makeup gas supply path, and a drain flow path. The plasma torch has a sample introducing pipe that introduces the atomized analysis sample, provided at a substantially center.Type: GrantFiled: August 16, 2016Date of Patent: July 17, 2018Assignee: IAS Inc.Inventors: Katsuhiko Kawabata, Tatsuya Ichinose, Mitsumasa Ikeuchi
-
Publication number: 20180024068Abstract: The present invention relates to an analysis system capable of online transferring an analysis sample and promptly acquiring an analysis result. The analysis system capable of analyzing the analysis samples supplied from at least two sites, with one analysis apparatus, and requiring no cleaning process for a nebulizer and a spray chamber, is provided. The present invention relates to analysis system including at least two sample individually transferring units. Each sample transferring path of the sample individually transferring units is coupled to a plasma torch of a common analysis unit including the one analysis apparatus with inductively-coupled plasma or microwave plasma. Each sample transferring path has a main flow path, a makeup gas supply path, and a drain flow path. The plasma torch has a sample introducing pipe that introduces the atomized analysis sample, provided at a substantially center.Type: ApplicationFiled: August 16, 2016Publication date: January 25, 2018Applicant: IAS Inc.Inventors: Katsuhiko Kawabata, Tatsuya Ichinose, Mitsumasa Ikeuchi
-
Patent number: 9741627Abstract: The present invention provides an etching apparatus suitable for etching polysilicon on a substrate or bulk silicon constituting the substrate. The present invention relates to an etching apparatus including a gas-flow adjusting means that allows etching gas to flow from a periphery of a substrate to substantially a center of the substrate, and relates to a technology capable of etching polysilicon or bulk silicon at a uniform thickness on an entire substrate surface. In addition, the gas-flow adjusting means is installed in a vertically movable manner, and an etching speed can be controlled by an adjustment of the gas-flow adjusting means.Type: GrantFiled: January 21, 2014Date of Patent: August 22, 2017Assignee: IAS, INCInventors: Katsuhiko Kawabata, Takuma Hayashi, Mitsumasa Ikeuchi, Sungjae Lee, Jin Kunika
-
Publication number: 20170160233Abstract: An object of the present invention is to provide an analysis apparatus in which local analysis of a substrate with ICP-MS is automated. The present invention relates to an automatic analysis apparatus for a local region of a substrate, including: a nozzle for local analysis having: analysis-liquid supply means that ejects analysis liquid onto a substrate; analysis-liquid discharge means that takes the analysis liquid including an object to be analyzed from the substrate into the nozzle to feed the analysis liquid to a nebulizer; and exhaust means including an exhaust channel in the nozzle; automatic liquid-feed means that automatically feeds the collected analysis liquid to ICP-MS; flow adjustment means that adjusts the flow of the analysis liquid; and automatic control means that simultaneously performs local analysis and analysis of the object to be analyzed with the ICP-MS to perform automatic analysis to a plurality of adjacent predetermined regions, successively.Type: ApplicationFiled: July 21, 2015Publication date: June 8, 2017Applicants: IAS Inc., Shin-Etsu Handotai Co., Ltd.Inventors: Katsuhiko Kawabata, Tatsuya Ichinose, Toshihiko Shirakawa R&D Center Imai
-
Publication number: 20150357249Abstract: The present invention provides an etching apparatus suitable for etching polysilicon on a substrate or bulk silicon constituting the substrate. The present invention relates to an etching apparatus including a gas-flow adjusting means that allows etching gas to flow from a periphery of a substrate to substantially a center of the substrate, and relates to a technology capable of etching polysilicon or bulk silicon at a uniform thickness on an entire substrate surface. In addition, the gas-flow adjusting means is installed in a vertically movable manner, and an etching speed can be controlled by an adjustment of the gas-flow adjusting means.Type: ApplicationFiled: January 21, 2014Publication date: December 10, 2015Applicant: IAS Inc.Inventors: Katsuhiko Kawabata, Takuma Hayashi, Mitsumasa Ikeuchi, Sungjae Lee, Jin Kunika
-
Patent number: 8453524Abstract: A solution feeding device for feeding a sample solution which is precisely adjusted in the mixed quantity of a standard solution is realized. The solution feeding device comprises: a mixing module (100) including a first passage (101), a second passage (102), and a third passage (103) for providing communications of the midways of those two passages with a higher passage resistance than those of the two passages; a first storage unit (10) communicating with one end side of the first passage for storing a sample solution; a suctioning nebulizer (20) communicating with the other end side of the first passage for sucking the sample solution; a second storage unit (30) communicating through an on-off valve (31) with one end side of the second passage for storing a standard solution; and a syringe pump (40) communicating with the other end side of the second passage for sucking and discharging the standard solution, respectively, in the open state and the closed state of the on-off valve.Type: GrantFiled: August 14, 2006Date of Patent: June 4, 2013Assignee: IAS Inc.Inventor: Katsuhiko Kawabata
-
Publication number: 20120300440Abstract: A battery pack (40) includes battery modules, a flat battery box (20), and a solar panel (10). The modules are arranged in parallel to each other. Each module includes cylindrical rechargeable battery cells (41) that are arranged side by side in the longitudinal direction of the cells. One of the cells is serially connected to another one of the cells arranged adjacent to this one of the cells in the longitudinal direction. The box (20) accommodates the battery pack (40). The panel (10) includes solar cells (41) capable of generating power for charging the pack (40). The box (20) is arranged on the back surface of the panel (10). The panel (10) and the pack (40) are arranged substantially in parallel to each other so that the distances between the parts of panel (10) and the pack (40) are substantially fixed. The modules are held in a non-horizontal orientation.Type: ApplicationFiled: January 26, 2011Publication date: November 29, 2012Inventors: Ichiro Miyamae, Yuji Uehara, Katsuhiko Kawabata, Yuki Matsuo
-
Publication number: 20100276019Abstract: Intended is to realize a solution feeding device for feeding a sample solution which is precisely adjusted in the mixed quantity of a standard solution. The solution feeding device comprises: mixing means (100) including a first passage (101), a second passage (102), and a third passage (103) for providing communications of the midways of those two passages with a higher passage resistance than those of the two passages; first storage means (10) communicating with one end side of the first passage for storing a sample solution; suction means (20) communicating with the other end side of the first passage for sucking the sample solution; second storage means (30) communicating through an on-off valve (31) with one end side of the second passage for storing a standard solution; and a syringe pump (40) communicating with the other end side of the second passage for sucking and discharging the standard solution, respectively, in the open state and the closed state of the on-off valve.Type: ApplicationFiled: August 14, 2006Publication date: November 4, 2010Inventor: Katsuhiko Kawabata
-
Patent number: 7264760Abstract: Tips of the lug portions of a board touch the bottom of the opening between projecting portions and step portions, when the upper mold and the lower mold are fit together with a battery and board inserted. Thus the board is retained in position in the molds certainly. After the molds are fit together, polyamide resin is injected into a molding space from a resin-material-injecting orifice provided in the upper mold.Type: GrantFiled: January 29, 2003Date of Patent: September 4, 2007Assignee: Sanyo Electric Co., Ltd.Inventors: Katsuhiko Kawabata, Hiroki Teraoka, Mikitaka Tamai, Hiroshi Osaka