Abstract: A control device that includes a circuit board, a plurality of heating elements that generate heat that accompanies driving the motor, and a rotation angle sensor that detects a rotation angle of the motor. The circuit board has a power supply input portion to which a driving current of the motor is supplied, a heating element mounting region where the plurality of the heating elements are mounted, and a controller mounting region where the rotation angle sensor is mounted. The power supply input portion, the heating element mounting region, and the controller mounting region are disposed in such an order. The circuit board, as seen from an axial direction of the rotating shaft, protrudes to an outside of a projection region that projects an outer surface of a cylindrical portion of a motor case that surrounds the motor. The power supply input portion is located on a portion out of portions of the circuit board that are on the outside of the projection region.

Abstract: In a semiconductor device, on a heat dissipation portion of a lead frame opposite to a mounting portion on which a semiconductor element is mounted, a thin molding portion having a thickness of about 0.02 mm to 0.3 mm is formed by a second molding resin which is a high-heat-dissipation resin. A scale-like portion on which scale-shaped projections are consecutively formed is provided over both sides across a resin boundary portion of the heat dissipation portion. The scale-like portion reaches abutting surfaces of an upper die and a lower die of a mold used in a molding process. Thus, the same void inhibition effect as with an air vent is obtained.

Abstract: Provided is a choke coil capable of improving a noise reduction effect by sufficiently attenuating magnetic field coupling between the choke coil and a metal part. A connector connection line includes: a first connection line led out from a connector conductor side of a coil main body of a winding wire along a y-axis direction away from the coil main body; a second connection line led out from the first connection line at a corner portion of a first pier column or a second pier column along a x-axis direction away from a connector conductor; a third connection line led out from the second connection line along a z-axis direction toward a lower yoke; and a fourth connection line led out from the third connection line along the x-axis direction toward the connector conductor.

Abstract: A semiconductor device is provided with a heat dissipating face side skirt portion, which is a frame-form projection, on a heat dissipating face of a lead frame. Because of this, creepage distance increases with a small increase in an amount of resin, and insulating properties improve. Also, the heat dissipating face side skirt portion is molded via two transfer molding steps, wettability of the second molding resin with respect to a first molding resin and the lead frame increases, and adhesion improves. Furthermore, an end face of an inner lead is exposed in an element sealing portion on a mounting face side, and covered with a second thin molded portion molded using the second molding resin, whereby heat generated in a semiconductor element can efficiently be caused to escape from faces of both a first thin molded portion and the second thin molded portion, because of which heat dissipation improves.

Abstract: A semiconductor device includes a first insulating resin member sealing a mounting surface of a lead frame, and a second insulating resin member sealing a heat dissipating surface. The second insulating resin member contains a filler having a maximum diameter of 0.02 mm to 0.075 mm. The second insulating resin member includes a thin molded portion formed in contact with the heat dissipating surface of the lead frame. The thin molded portion has a thickness 1.1 times to 2 times the maximum diameter of the filler. The semiconductor device includes, at an interface between the first insulating resin member and the second insulating resin member, a mixture layer in which these resins are mixed with each other.

Abstract: In a semiconductor device, on a heat dissipation portion of a lead frame opposite to a mounting portion on which a semiconductor element is mounted, a thin molding portion having a thickness of about 0.02 mm to 0.3 mm is formed by a second molding resin which is a high-heat-dissipation resin. A scale-like portion on which scale-shaped projections are consecutively formed is provided over both sides across a resin boundary portion of the heat dissipation portion. The scale-like portion reaches abutting surfaces of an upper die and a lower die of a mold used in a molding process. Thus, the same void inhibition effect as with an air vent is obtained.

Abstract: A semiconductor device includes a first insulating resin member sealing a mounting surface of a lead frame, and a second insulating resin member sealing a heat dissipating surface. The second insulating resin member contains a filler having a maximum diameter of 0.02 mm to 0.075 mm. The second insulating resin member includes a thin molded portion formed in contact with the heat dissipating surface of the lead frame. The thin molded portion has a thickness 1.1 times to 2 times the maximum diameter of the filler. The semiconductor device includes, at an interface between the first insulating resin member and the second insulating resin member, a mixture layer in which these resins are mixed with each other.

Abstract: The electronic device includes: a substrate having an electronic circuit formed therein; a housing for housing the substrate; and a connector disposed on the substrate and serving as an interface between outside and inside of the housing. The substrate has a main circuit pattern portion that forms a main circuit and a frame ground pattern portion that forms a frame ground. The main circuit pattern portion and the frame ground pattern portion are disposed so as not to overlap each other on the substrate and in the substrate. A terminal of the connector is disposed in the frame ground pattern portion.

Abstract: In a rotary electric machine in which a controller and a heat sink are arranged in an extending direction of an output shaft of a motor, in order to provide a rotary electric machine which secures a heat rejection performance and an insulation performance of a semiconductor device to be mounted to the controller and is downsized as a whole, the controller includes a semiconductor device having a drive circuit provided so as to correspond to a stator winding of the motor, and the semiconductor device has a main face held in close contact with the heat sink. On a close contact face between the semiconductor device and the heat sink, a drive circuit is formed so as to extend along an outer edge portion of the heat sink to increase a cooling area.

Abstract: A semiconductor device is provided with a heat dissipating face side skirt portion, which is a frame-form projection, on a heat dissipating face of a lead frame. Because of this, creepage distance increases with a small increase in an amount of resin, and insulating properties improve. Also, the heat dissipating face side skirt portion is molded via two transfer molding steps, wettability of the second molding resin with respect to a first molding resin and the lead frame increases, and adhesion improves. Furthermore, an end face of an inner lead is exposed in an element sealing portion on a mounting face side, and covered with a second thin molded portion molded using the second molding resin, whereby heat generated in a semiconductor element can efficiently be caused to escape from faces of both a first thin molded portion and the second thin molded portion, because of which heat dissipation improves.

Abstract: Lands (11c and 11d) are parts of base plates (104c and 104d), and electrodes of a shunt resistor (103U) are put on and connected to the lands (11c and 11d). Slits (130 and 131) are formed in the lands (11c and 11d) to separate a main electric circuit in which a main current flows and control terminals (123 and 124) with which the electric potentials of the electrodes of the shunt resistor (103U) are detected. Leading end portions of the slits (130 and 131) extend to the vicinity of the electrodes of the shunt resistor (103U).

Abstract: In a rotary electric machine in which a controller and a heat sink are arranged in an extending direction of an output shaft of a motor, in order to provide a rotary electric machine which secures a heat rejection performance and an insulation performance of a semiconductor device to be mounted to the controller and is downsized as a whole, the controller includes a semiconductor device having a drive circuit provided so as to correspond to a stator winding of the motor, and the semiconductor device has a main face held in close contact with the heat sink. On a close contact face between the semiconductor device and the heat sink, a drive circuit is formed so as to extend along an outer edge portion of the heat sink to increase a cooling area.

Abstract: Lands (11c and 11d) are parts of base plates (104c and 104d), and electrodes of a shunt resistor (103U) are put on and connected to the lands (11c and 11d). Slits (130 and 131) are formed in the lands (11c and 11d) to separate a main electric circuit in which a main current flows and control terminals (123 and 124) with which the electric potentials of the electrodes of the shunt resistor (103U) are detected. Leading end portions of the slits (130 and 131) extend to the vicinity of the electrodes of the shunt resistor (103U).

Abstract: A dual-mode choke coil includes: a lower core that has a first through fourth columnar body; a first upper core and a second upper core; a first coil in which two coil conductors are respectively wound onto the first columnar body and a third columnar body in mutually different directions and are connected in series; and a second coil in which two coil conductors are respectively wound onto a second columnar body and the fourth columnar body in mutually different directions and are connected in series, and in which the winding direction of the coil conductor of the second columnar body is the same as that of the coil conductor of the first columnar body. With this configuration, both common mode noise and normal mode noise can be reduced.

Abstract: Provided is a choke coil capable of improving a noise reduction effect by sufficiently attenuating magnetic field coupling between the choke coil and a metal part. A connector connection line includes: a first connection line led out from a connector conductor side of a coil main body of a winding wire along a y-axis direction away from the coil main body; a second connection line led out from the first connection line at a corner portion of a first pier column or a second pier column along a x-axis direction away from a connector conductor; a third connection line led out from the second connection line along a z-axis direction toward a lower yoke; and a fourth connection line led out from the third connection line along the x-axis direction toward the connector conductor.

Abstract: In a semiconductor device, a thinly-molded portion covering a whole of a heat dissipating surface portion of a lead frame and a die pad space filled portion are integrally molded from a second mold resin, because of which adhesion between the thinly-molded portion and lead frame improves owing to the die pad space filled portion adhering to a side surface of the lead frame. Also, as the thinly-molded portion is partially thicker owing to the die pad space filled portion, strength of the thinly-molded portion increases, and a deficiency or cracking is unlikely to occur.

Abstract: In a semiconductor device, a first skirt portion molded from a first mold resin and a second skirt portion molded from a second mold resin are provided on a heat dissipating surface of a lead frame. Also, a thinly-molded portion is molded integrally with the second skirt portion from the second mold resin. According to this kind of configuration, adhesion between the thinly-molded portion and lead frame is high, and the semiconductor device with excellent heat dissipation and insulation is obtained.

Abstract: A scale-like portion wherein metal plating is changed into a scale-like form is provided by continuously carrying out laser spot irradiation on a lead frame, the front surface of which is coated with the metal plating. The scale-like portion is disposed in an optional portion of the lead frame, for example, in the vicinity of a gate break mark, in an outer peripheral portion in a region sealed with a molding resin, or around a semiconductor element. The adhesion between the lead frame and the molding resin improves owing to the anchor effect of the scale-like portion, and it is thus possible to suppress the molding resin separating from the lead frame.

Abstract: An object is to release heat efficiently to heat-resistance abilities of individual components by enhancing a heat-radiation performance of power circuit components forming a power module (100) and by enhancing a heat generation balance. The power circuit components formed of power switching elements (107 and 108) forming a bridge circuit and a motor relay switching element (109) are mounted on conductive members (102) while a heat generation balance is maintained. Then, the conductive members (102) are disposed on a heat-releasing heat sink (30) by abutment, and the power circuit components and the heat sink (30) are integrally molded using mold resin (101).

Abstract: In a semiconductor device, a thinly-molded portion covering a whole of a heat dissipating surface portion of a lead frame and a die pad space filled portion are integrally molded from a second mold resin, because of which adhesion between the thinly-molded portion and lead frame improves owing to the die pad space filled portion adhering to a side surface of the lead frame. Also, as the thinly-molded portion is partially thicker owing to the die pad space filled portion, strength of the thinly-molded portion increases, and a deficiency or cracking is unlikely to occur.