Abstract: In a semiconductor device, a first skirt portion molded from a first mold resin and a second skirt portion molded from a second mold resin are provided on a heat dissipating surface of a lead frame. Also, a thinly-molded portion is molded integrally with the second skirt portion from the second mold resin. According to this kind of configuration, adhesion between the thinly-molded portion and lead frame is high, and the semiconductor device with excellent heat dissipation and insulation is obtained.

Abstract: A dual-mode choke coil includes: a lower core that has a first through fourth columnar body; a first upper core and a second upper core; a first coil in which two coil conductors are respectively wound onto the first columnar body and a third columnar body in mutually different directions and are connected in series; and a second coil in which two coil conductors are respectively wound onto a second columnar body and the fourth columnar body in mutually different directions and are connected in series, and in which the winding direction of the coil conductor of the second columnar body is the same as that of the coil conductor of the first columnar body. With this configuration, both common mode noise and normal mode noise can be reduced.

Abstract: Problem To obtain a drive unit integrated rotating electrical machine that makes it easier to connect power circuits and achieves not only excellent vibration resistance but also excellent heat releasing properties. Means for Solution A drive unit integrated rotating electrical machine has a motor, a drive unit driving the motor under control and provided with power switching elements and conductors passing a current to the power switching elements, and a heat sink cooling the drive unit, which are combined into one unit. The drive unit integrated rotating electrical machine is characterized in that: the power switching elements are molded and formed into mold modules in a state in which terminals thereof are exposed; the conductors are insert-molded in a frame in a state in which terminals thereof are exposed; and the exposed terminals of the mold modules are connected to the exposed terminals of the insert-molded conductors and the mold modules are firmly fixed to the heat sink.

Abstract: A scale-like portion wherein metal plating is changed into a scale-like form is provided by continuously carrying out laser spot irradiation on a lead frame, the front surface of which is coated with the metal plating. The scale-like portion is disposed in an optional portion of the lead frame, for example, in the vicinity of a gate break mark, in an outer peripheral portion in a region sealed with a molding resin, or around a semiconductor element. The adhesion between the lead frame and the molding resin improves owing to the anchor effect of the scale-like portion, and it is thus possible to suppress the molding resin separating from the lead frame.

Abstract: In an electric power steering driving unit provided with an electric motor that outputs auxiliary torque to a handwheel of a vehicle, a control apparatus having semiconductor switching devices that each control a current to the electric motor, and a noise filter that prevents noise, produced when the semiconductor switching devices each control a current to the electric motor, from being emitted, the noise filter is configured with a plurality of coils, capacitors that make pairs with the respective corresponding coils, and a bus bar that performs connections among the coils and the capacitors, and part of or all of the noise filter is configured as a structural member that is different from the control apparatus.

Abstract: A power semiconductor module includes: a plurality of first metal plates arranged in the same planar state; a power semiconductor chip mounted on the first metal plate; and an overbridge-shaped second metal plate which is composed of bridge frame sections and leg sections that support the bridge frame sections, the leg sections being for appropriately performing solder bonding between electrodes of the power semiconductor chips and between the electrode of the power semiconductor chip and the first metal plate, the power semiconductor module being configured by a resin package in which these members are sealed with electrically insulating resin. In the power semiconductor module, the solder bonding section of the leg section is formed in a planar shape by bending process and is provided at a position lower than the bridge frame section.

Abstract: There is provided a mold module and an electric power steering apparatus in which the temperature distribution in electronic components such as semiconductor chips utilized in an electronic relay and an inverter circuit unit is equalized and hence the heat radiation performance can be improved. In a mold module according to the present invention, a plurality of terminals for forming wiring leads and a plurality of electronic components mounted on the respective terminals are molded with a molding resin; at least part of the plurality of terminals are exposed at the rear side of the molding resin; an electric power steering apparatus according to the present invention utilizes the mold module.

Abstract: A control device (3) controlling an electric motor (2) is disposed on an axial line of a rotor shaft (30) of the electric motor (2). The control device (3) includes semiconductor switching devices (15) forming a three-phase bridge circuit that controls a current of the electric motor (2) and capacitors (13) that suppresses a ripple component of a current flowing to the electric motor (2). The semiconductor switching devices (15) and the capacitors (13) are provided in pairs for respective arms of the three-phase bridge circuit and disposed concentrically. Hence, impedance across the three-phase circuit controlling a current flowing to the electric motor is reduced. Consequently, not only can ripples be absorbed efficiently but also power efficiency of a driving device can be enhanced.

Abstract: In an electric power steering driving unit provided with an electric motor that outputs auxiliary torque to a handwheel of a vehicle, a control apparatus having semiconductor switching devices that each control a current to the electric motor, and a noise filter that prevents noise, produced when the semiconductor switching devices each control a current to the electric motor, from being emitted, the noise filter is configured with a plurality of coils, capacitors that make pairs with the respective corresponding coils, and a bus bar that performs connections among the coils and the capacitors, and part of or all of the noise filter is configured as a structural member that is different from the control apparatus.

Abstract: There is provided a mold module and an electric power steering apparatus in which the temperature distribution in electronic components such as semiconductor chips utilized in an electronic relay and an inverter circuit unit is equalized and hence the heat radiation performance can be improved. In a mold module according to the present invention, a plurality of terminals for forming wiring leads and a plurality of electronic components mounted on the respective terminals are molded with a molding resin; at least part of the plurality of terminals are exposed at the rear side of the molding resin; an electric power steering apparatus according to the present invention utilizes the mold module.

Abstract: To obtain a drive unit integrated rotating electrical machine that makes it easier to connect power circuits and achieves not only excellent vibration resistance but also excellent heat releasing properties. Means for Solution A drive unit integrated rotating electrical machine has a motor, a drive unit driving the motor under control and provided with power switching elements and conductors passing a current to the power switching elements, and a heat sink cooling the drive unit, which are combined into one unit. The drive unit integrated rotating electrical machine is characterized in that: the power switching elements are molded and formed into mold modules in a state in which terminals thereof are exposed; the conductors are insert-molded in a frame in a state in which terminals thereof are exposed; and the exposed terminals of the mold modules are connected to the exposed terminals of the insert-molded conductors and the mold modules are firmly fixed to the heat sink.

Abstract: A power semiconductor module includes: a plurality of first metal plates arranged in the same planar state; a power semiconductor chip mounted on the first metal plate; and an overbridge-shaped second metal plate which is composed of bridge frame sections and leg sections that support the bridge frame sections, the leg sections being for appropriately performing solder bonding between electrodes of the power semiconductor chips and between the electrode of the power semiconductor chip and the first metal plate, the power semiconductor module being configured by a resin package in which these members are sealed with electrically insulating resin. In the power semiconductor module, the solder bonding section of the leg section is formed in a planar shape by bending process and is provided at a position lower than the bridge frame section.

Abstract: An object is to release heat efficiently to heat-resistance abilities of individual components by enhancing a heat-radiation performance of power circuit components forming a power module (100) and by enhancing a heat generation balance. The power circuit components formed of power switching elements (107 and 108) forming a bridge circuit and a motor relay switching element (109) are mounted on conductive members (102) while a heat generation balance is maintained. Then, the conductive members (102) are disposed on a heat-releasing heat sink (30) by abutment, and the power circuit components and the heat sink (30) are integrally molded using mold resin (101).

Abstract: A control device (3) controlling an electric motor (2) is disposed on an axial line of a rotor shaft (30) of the electric motor (2). The control device (3) includes semiconductor switching devices (15) forming a three-phase bridge circuit that controls a current of the electric motor (2) and capacitors (13) that suppresses a ripple component of a current flowing to the electric motor (2). The semiconductor switching devices (15) and the capacitors (13) are provided in pairs for respective arms of the three-phase bridge circuit and disposed concentrically. Hence, impedance across the three-phase circuit controlling a current flowing to the electric motor is reduced. Consequently, not only can ripples be absorbed efficiently but also power efficiency of a driving device can be enhanced.