Patents by Inventor Katsuhisa Kitano
Katsuhisa Kitano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20070093611Abstract: A propylene-based resin is disclosed which has at least one kind of functional groups selected from the group (i) consisting of a hydroxyl group, an amino group and a mercapto group, and at least one kind of functional groups selected from the group (ii) consisting of a carboxyl group, an acid anhydride group, epoxy group and an isocyanate group.Type: ApplicationFiled: October 19, 2006Publication date: April 26, 2007Applicant: Sumitomo Chemical Company, LimitedInventors: Hiroyoshi Nakajima, Katsuhisa Kitano, Makoto Satoh
-
Publication number: 20070093606Abstract: A method for producing a modified polyolefin resin is disclosed which has a step of melt-kneading 100 parts by weight of polyolefin resin (A), from 0.1 to 20 parts by weight of at least two kinds of nonaromatic double-bond-containing monomer (B) and from 0.01 to 20 parts by weight of organic peroxide (C), wherein at least one member of the at least two kinds of nonaromatic double-bond-containing monomer (B) is a nonaromatic double-bond-containing monomer having at least one kind of functional group selected from the group consisting of amino group, hydroxyl group and mercapto group or a derivative of the monomer (B1), and other at least one member is a nonaromatic double-bond-containing monomer having at least one kind of functional group selected from the group consisting of carboxyl group, acid anhydride group, epoxy group and isocyanate group or a derivative of the monomer (B2).Type: ApplicationFiled: October 19, 2006Publication date: April 26, 2007Applicant: Sumitomo Chemical Company, LimitedInventors: Hiroyoshi Nakajima, Katsuhisa Kitano, Makoto Satoh
-
Publication number: 20060074174Abstract: Disclosed is a polyolefin resin composition comprising 100 parts by weight of component (A), 0.001 to 10 parts by weight of component (B) and 0.01 to 100 parts by weight of component (C): component (A): polyolefin resin; component (B): carbon black which satisfies the following requirements (1) and (2): requirement (1): containing a volatile component in an amount of less than 0.2% by weight as measured by the method provided in JIS K6221: requirement (2): containing at least one element selected from the group consisting of iron, nickel, copper, cobalt, aluminum, manganese and vanadium in an amount, based on the weight of the carbon black, of 4 ppm or less; component (C): stabilizer.Type: ApplicationFiled: September 15, 2005Publication date: April 6, 2006Inventors: Yoshiaki Oobayashi, Katsuhisa Kitano, Kazunori Teraoka
-
Patent number: 6919410Abstract: There is provided a process for producing a modified polypropylene resin, which comprises the steps of mixing the following components (A) to (D), and reacting them with one another: (A) 100 parts by weight of a polypropylene resin, (B) 0.1 to 30 parts by weight of a compound having a bond or a functional group selected from the group consisting of a non-aromatic carbon-carbon multiple bond, an oxirane group and a derived carboxyl group, (C) 0.001 to 30 parts by weight of a compound having at least two functional groups reactive to a carboxyl group, and (D) 0.01 to 20 parts by weight of an organic peroxide having a decomposition temperature of from 50 to 120° C., at which temperature a half-life of the organic peroxide is 1 minute.Type: GrantFiled: October 24, 2002Date of Patent: July 19, 2005Assignee: Sumitomo Chemical Company, LimitedInventors: Katsuhisa Kitano, Takashi Sanada
-
Publication number: 20050058820Abstract: Disclosed is a composite material comprising: resin (I) comprising 10 to 99% by weight of a crystalline thermoplastic resin which is defined as component (A), and 1 to 90% by weight of a crystalline thermoplastic resin having a crystallization temperature lower than that of component (A) by at least 10° C., which resin is defined as component (B), and 5 to 400 parts by weight, based on 100 parts by weight of the resin (I), of fiber, which is defined as component (C), wherein the contents of the component (A) and the component (B) are each based on a combined content of these two components.Type: ApplicationFiled: July 26, 2004Publication date: March 17, 2005Inventors: Katsuhisa Kitano, Kenji Atarashi, Yoshiaki Oobayashi
-
Publication number: 20040220325Abstract: A fiber-polypropylene resin composite is disclosed which includes:Type: ApplicationFiled: February 2, 2004Publication date: November 4, 2004Applicant: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Katsuhisa Kitano, Kenji Atarashi, Hiroyuki Tanimura
-
Patent number: 6797363Abstract: Disclosed is a fiber/resin composite comprising fibers (A), polypropylene resin (B) and modified polyolefin resin (C), the weight ratio of the polypropylene resin (B) to the modified polyolefin resin (C) being 99.9/0.1 to 60/40, the modified polyolefin resin (C) having a melt flow rate of 30 to 150 g/10 min, the fibers (A) being arranged parallel to each other in one direction, the composite having a length of 2 to 100 mm along the direction in which the fibers (A) are arranged, the fibers (A) having a weight average length equal to the length of the composite, wherein the polypropylene resin (B) is composed of propylene homopolymer segment (B-1) and propylene-ethylene copolymer segment (B-2), the propylene homopolymer segment (B-1) having an isotactic pentad fraction of at least 0.980 and the content of the propylene-ethylene copolymer segment (B-2) in the polypropylene resin (B) being 10 to 40% by weight.Type: GrantFiled: December 3, 2003Date of Patent: September 28, 2004Assignee: Sumitomo Chemical Company, LimitedInventors: Katsuhisa Kitano, Kenji Atarashi
-
Patent number: 6780506Abstract: Disclosed is a fiber-reinforced polyolefin resin composite containing a polyolefin resin (components (A)), fibers (component (B)) and a heavy metal deactivator (component (C)), the ratio of the weight of component (A) to the weight of component (B), (component (A)/component (B)), being from 20/80 to 95/5, the ratio of the weight of component (C) to the combined weight of component (A) and component (B), (component (C)/[component (A)+component (B)]), being from 0.001/100 to 5/100, wherein in the composite substantially all the component (B) have lengths of 2 mm or more. The composite has an improved durability under circumstances of contact with metal. A molded article obtained from the composite is also disclosed.Type: GrantFiled: April 24, 2003Date of Patent: August 24, 2004Assignee: Sumitomo Chemical Company, LimitedInventors: Yoshiaki Oobayashi, Katsuhisa Kitano
-
Publication number: 20040126554Abstract: Disclosed is a fiber/resin composite comprising fibers (A), polypropylene resin (B) and modified polyolefin resin (C), the weight ratio of the polypropylene resin (B) to the modified polyolefin resin (C) being 99.9/0.1 to 60/40, the modified polyolefin resin (C) having a melt flow rate of 30 to 150 g/10 min, the fibers (A) being arranged parallel to each other in one direction, the composite having a length of 2 to 100 mm along the direction in which the fibers (A) are arranged, the fibers (A) having a weight average length equal to the length of the composite, wherein the polypropylene resin (B) is composed of propylene homopolymer segment (B-1) and propylene-ethylene copolymer segment (B-2), the propylene homopolymer segment (B-1) having an isotactic pentad fraction of at least 0.980 and the content of the propylene-ethylene copolymer segment (B-2) in the polypropylene resin (B) being 10 to 40% by weight.Type: ApplicationFiled: December 3, 2003Publication date: July 1, 2004Applicant: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Katsuhisa Kitano, Kenji Atarashi
-
Publication number: 20040005448Abstract: Disclosed is a fiber-reinforced polyolefin resin composite containing a polyolefin resin (components (A)), fibers (component (B)) and a heavy metal deactivator (component (C)), the ratio of the weight of component (A) to the weight of component (B), (component (A)/component (B)), being from 20/80 to 95/5, the ratio of the weight of component (C) to the combined weight of component (A) and component (B), (component (C)/[component (A)+component (B)]), being from 0.001/100 to 5/100, wherein in the composite substantially all the component (B) have lengths of 2 mm or more. The composite has an improved durability under circumstances of contact with metal. A molded article obtained from the composite is also disclosed.Type: ApplicationFiled: April 24, 2003Publication date: January 8, 2004Applicant: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Yoshiaki Oobayashi, Katsuhisa Kitano
-
Publication number: 20040002569Abstract: Disclosed are a composite material containing (A) a modified polyolefin resin graft-modified with an unsaturated carboxylic acid and/or its derivative and (B) a filler, wherein a content of the component (B) is from 1 to 80 parts by weight based on 100 parts by weight of a combined content of the components (A) and (B), a graft amount of the unsaturated carboxylic acid and/or its derivative in the component (A) is 0.3% by weight or more, and the component (A) has a melt flow rate as measured at 230° C. and a load of 21.2 N of 400 g/10 min or less and a composite material further containing (C) a polyolefin resin.Type: ApplicationFiled: June 9, 2003Publication date: January 1, 2004Applicant: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Katsuhisa Kitano, Takashi Sanada
-
Publication number: 20030236338Abstract: Disclosed is a formed article made of a fiber-reinforced polypropylene resin comprising from 20 to 95% by weight of a polypropylene resin and from 5 to 80% by weight of fibers, wherein in the formed article the polypropylene has an intrinsic viscosity [&eegr;] of from 1.05 dl/g to 2.00 dl/g, the fibers have a weight average fiber length of from 1 mm to 10 mm, and a degree of dispersion of the fibers is from 0 to 1.2. The formed article is superior in both mechanical strength and fatigue characteristic.Type: ApplicationFiled: April 24, 2003Publication date: December 25, 2003Applicant: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Katsuhisa Kitano, Takashi Sanada, Kenji Atarashi
-
Publication number: 20030119996Abstract: There is provided a process for producing a modified polypropylene resin, which comprises the steps of mixing the following components (A) to (D), and reacting them with one another:Type: ApplicationFiled: October 24, 2002Publication date: June 26, 2003Applicant: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Katsuhisa Kitano, Takashi Sanada
-
Patent number: 6569950Abstract: There is provided a process for producing an acid modified polypropylene resin, which comprises the step of kneading: (1) 100 parts by weight of a polypropylene resin (A), (2) 0.1 to 20 parts by weight of an unsaturated carboxylic acid or a derivative thereof (B), (3) 0.01 to 20 parts by weight of an organic peroxide (C) having a decomposition temperature of from 50 to 120° C., at which a half-life of the organic peroxide is 1 minute, and (4) optionally, 0.01 to 20 parts by weight of an organic peroxide (D) having a decomposition temperature of from 150 to 200° C., at which a half-life of the organic peroxide is 1 minute.Type: GrantFiled: January 14, 2002Date of Patent: May 27, 2003Assignee: Sumitomo Chemical Company, LimitedInventors: Katsuhisa Kitano, Takashi Sanada
-
Publication number: 20020161131Abstract: There is provided a process for producing an acid modified polypropylene resin, which comprises the step of kneading:Type: ApplicationFiled: January 14, 2002Publication date: October 31, 2002Applicant: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Katsuhisa Kitano, Takashi Sanada
-
Patent number: 5976260Abstract: It is an object of the present invention to obtain a vacuum chucking which can vacuum suck a wafer even if dusts attach thereon. The main body of vacuum chuck (101) has a plurality of block grooves (125) on the surface on which the wafer (1) is sucked and fixed, in which vacuum evacuation paths (105) each for vacuum evacuating each block groove (125) are provided for each block groove (125). When the wafer (1) is sucked and fixed under low pressure, even if the degree of vacuum in one of the block grooves (125) decreases due to attachment of dusts on part of the suction surface, or the like, the wafer (1) can surely be sucked and held.Type: GrantFiled: March 7, 1996Date of Patent: November 2, 1999Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Yoshimi Kinoshita, Tomoyuki Kanda, Katsuhisa Kitano, Kazuo Yoshida, Hiroshi Ohnishi, Kenichiro Yamanishi, Shigeo Sasaki, Hideki Komori, Taizo Eshima, Kouichirou Tsutahara, Toshihiko Noguchi, Toru Takahama, Yoshihiko Kusakabe, Takeshi Iwamoto, Nobuyuki Kosaka
-
Patent number: 5534073Abstract: It is an object of the present invention to obtain a vacuum chucking which can vacuum suck a wafer even if dusts attach thereon. The main body of vacuum chuck (101) has a plurality of block grooves (125) on the surface on which the wafer (1) is sucked and fixed, in which vacuum evacuation paths (105) each for vacuum evacuating each block groove (125) are provided for each block groove (125). When the wafer(1) is sucked and fixed under low pressure, even if the degree of vacuum in one of the block grooves (125) decreases due to attachment of dusts on part of the suction surface, or the like, the wafer (1) can surely be sucked and held.Type: GrantFiled: September 7, 1993Date of Patent: July 9, 1996Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Yoshimi Kinoshita, Tomoyuki Kanda, Katsuhisa Kitano, Kazuo Yoshida, Hiroshi Ohnishi, Kenichiro Yamanishi, Shigeo Sasaki, Hideki Komori, Taizo Eshima, Kouichirou Tsutahara, Toshihiko Noguchi, Toru Takahama, Yoshihiko Kusakabe, Takeshi Iwamoto, Nobuyuki Kosaka
-
Patent number: 5252132Abstract: A semiconductor film production apparatus includes a reaction vessel for containing a substrate and including a gas supply port for supplying a reaction gas to the vessel, a gas discharge port for discharging the reaction gas from the vessel after reaction, and a light-transmitting glass window; a light source disposed outside the reaction vessel for irradiating a substrate in the reaction vessel through the light-transmitting glass window to heat the substrate; a cylindrical substrate holder disposed in the reaction vessel for holding the substrate with a first surface facing the light source and a second surface, opposed to the first surface, exposed to the reaction gas; a ring plate having a central opening with an area smaller than the substrate and an outside diameter dividing the reaction vessel into two compartments, the ring plate contacting the first surface of the substrate; a carrier gas supply port for introducing a carrier gas between the substrate and the light-transmitting glass window; and a rType: GrantFiled: November 22, 1991Date of Patent: October 12, 1993Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Masao Oda, Yoshiyuki Goto, Toyomi Osige, Tatsuya Iwasa, Yoshimi Kinoshita, Katsuhisa Kitano, Kazuo Yoshida