Patents by Inventor Katsuhisa Tanabe
Katsuhisa Tanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11946144Abstract: An object of the present invention is to provide an electroless Pd plating solution which enables formation of a Pd plating film forming a plating film having excellent wire bondability even after a high-temperature thermal history. An electroless Pd plating solution of the present invention includes: a Palladium compound, a reducing agent, a complexing agent, and at least one selected from a group consisting of Ge and rare earth element.Type: GrantFiled: October 3, 2018Date of Patent: April 2, 2024Assignee: C. UYEMURA & CO., LTD.Inventors: Tsuyoshi Maeda, Katsuhisa Tanabe, Tomohiro Kawahara
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Publication number: 20230407487Abstract: The present invention aims to provide an etchant that can provide good deposition of a metal plating such as a nickel plating, despite its acidity, and a method of surface treatment of aluminum or an aluminum alloy using the etchant. Included is an etchant containing a zinc compound and a fluorine compound and having a pH of 4.5 to 6.5.Type: ApplicationFiled: June 16, 2023Publication date: December 21, 2023Applicant: C.Uyemura & Co., Ltd.Inventors: Takuma Maekawa, Katsuhisa Tanabe, Sayuri Tanaka, Fuminori Shibayama
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Patent number: 11814717Abstract: The purpose of the present invention is to provide a palladium plating solution and a plating method for improving a bath stability of a palladium plating, without decreasing a deposition property of the palladium plating. A palladium plating solution for improving a bath stability, without decreasing a deposition property, comprising: an aqueous palladium compound: one or more complexing agent containing a compound having at least an ethylenediamine or a propylenediamine skeleton; a formic acid or a formate; and a sulfur compound, wherein the palladium plating solution is having two or more sulfide groups in a molecule of the sulfur compound.Type: GrantFiled: March 31, 2021Date of Patent: November 14, 2023Assignee: C. Uyemura & Co., Ltd.Inventors: Yohei Kaneko, Yuhei Oogami, Katsuhisa Tanabe, Tsuyoshi Maeda
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Publication number: 20230203665Abstract: A gold plating solution containing a gold cyanide salt, a reducing agent that is formaldehyde or its precursor, and an iron cyanide compound, and not containing a chelate compound having two or more iminodiacetic acid groups or aminomethylenephosphonic acid groups, is brought into contact with a chelating resin having an iminodiacetic acid group or an aminomethylenephosphonic acid group, thereby removing iron ions from the gold plating solution.Type: ApplicationFiled: December 28, 2022Publication date: June 29, 2023Applicant: C. Uyemura & Co., Ltd.Inventors: Yohei KANEKO, Katsuhisa Tanabe, Tsuyoshi Maeda, Naoshi Nishimura
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Publication number: 20230151493Abstract: The present invention aims to provide a metal displacement solution that can provide good adhesion to a plating film (metal film), and a method for surface treatment of aluminum or an aluminum alloy using the metal displacement solution. Included is a metal displacement solution which contains a zinc compound, a nickel compound, a germanium compound, and a fluorine compound.Type: ApplicationFiled: November 3, 2022Publication date: May 18, 2023Applicant: C.Uyemura & Co., Ltd.Inventors: Takuma Maekawa, Katsuhisa Tanabe, Sayuri Tanaka, Fuminori Shibayama
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Publication number: 20230111446Abstract: The electroless gold plating bath includes a gold sulfate, a thiosulfate, ascorbic acid compounds, and hydrazine compounds, the hydrazine compounds being at least one selected from the group consisting of adipic dihydrazide, propionic hydrazide, hydrazine sulfate, hydrazine monohydrochloride, hydrazine dihydrochloride, hydrazine carbonate, hydrazine monohydrate, sebacic dihydrazide, dodecanediohydrazide, isophthalic dihydrazide, hydrazide, 3-hydro-2-naphtboic hydrazide benzophenone hydrazone, phenylhydrazine, benzylhydrazine monohydrochloride, methylhydrazine sulfate, and isopropylhydrazine hydrochloride.Type: ApplicationFiled: October 4, 2022Publication date: April 13, 2023Inventors: Sayuri TANAKA, Takuma MAEKAWA, Katsuhisa TANABE, Fuminori SHIBAYAMA
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Publication number: 20220396881Abstract: A method for fabricating an electronic component includes the steps of: forming a base material layer of, for example, nickel on a base material of copper, copper alloy, aluminium, or aluminium alloy; applying, as a catalyst, one or more metals selected from the group consisting of gold, palladium, platinum, silver, rhodium, cobalt, tin, copper, iridium, osmium, and ruthenium, on the base material layer; and forming a surface layer by an electroless tin plating bath including trivalent titanium as an reducing agent and pyrophosphate salt as a complexing agent. The surface layer has a thickness of 0.5 ?m or more.Type: ApplicationFiled: June 8, 2022Publication date: December 15, 2022Inventors: Yohei KANEKO, Katsuhisa TANABE, Tsuyoshi MAEDA, Yuhei OGAMI
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Publication number: 20220388279Abstract: The present invention is to provide a plating film which can improve soldering bond reliability of solder bond against the accumulation of thermal history. The present invention is a multilayer plating film comprising an electroless nickel-germanium alloy plating film; an electroless palladium plating film; and an electroless gold plating film in this order.Type: ApplicationFiled: May 31, 2022Publication date: December 8, 2022Applicant: C. Uyemura & Co., Ltd.Inventors: Katsuhisa TANABE, Tatsushi SOMEYA, Naoki NAKANO, Kazuki YAMAGUCHI
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Patent number: 11492706Abstract: An electroless palladium plating liquid containing at least hydrazine or a salt thereof as a reducing agent, which has excellent bath stability in the vicinity of acidity to neutrality range, long-term stability, and is capable of suppressing the Pd film deposition rate decrease caused by elution of etching resist. An electroless palladium plating solution of the invention includes a palladium compound, hydrazine or its salt, at least one selected from a group consisting of a compound represented by the following formula (1) or its salt and a compound represented by the following formula (2) or its salt; and a pH of 8 or less, NH2NHCOR1 (1), (NH2NHCO)2(R2)n (2), wherein R1 represents H, NH2, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, NHNH2, or an aromatic group, wherein each of these groups may have a substituent; R2 represents (CH2) or an aromatic group, wherein each of these groups may have a substituent; and n represents an integer of 0 to 10.Type: GrantFiled: February 15, 2019Date of Patent: November 8, 2022Assignee: C. UYEMURA & CO., LTD.Inventors: Tetsuya Sasamura, Tatsushi Someya, Katsuhisa Tanabe, Shinsuke Wada, Eriko Furuya
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Publication number: 20220033973Abstract: A plating bath at least contains a palladium compound, a reducing agent, a complexing agent, and a stabilizer. The stabilizer is an organic compound in which a divalent sulfur compound is bonded to a compound with a heterocyclic structure, and the organic compound contains neither a thiol group nor a disulfide bond.Type: ApplicationFiled: July 27, 2021Publication date: February 3, 2022Inventors: Takuma MAEKAWA, Katsuhisa TANABE, Toshiaki SHIBATA
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Publication number: 20210310127Abstract: The purpose of the present invention is to provide a palladium plating solution and a plating method for improving a bath stability of a palladium plating, without decreasing a deposition property of the palladium plating. A palladium plating solution for improving a bath stability, without decreasing a deposition property, comprising: an aqueous palladium compound; one or more complexing agent containing a compound having at least an ethylenediamine or a propylenediamine skeleton; a formic acid or a formate; and a sulfur compound, wherein the palladium plating solution is having two or more sulfide groups in a molecule of the sulfur compound.Type: ApplicationFiled: March 31, 2021Publication date: October 7, 2021Inventors: Yohei Kaneko, Yuhei Oogami, Katsuhisa Tanabe, Tsuyoshi Maeda
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Patent number: 10975475Abstract: The present invention provides an electroless gold plating bath having excellent plating bath stability without containing a cyanide compound under long term plating bath heating time. An electroless gold plating bath of the present invention solving above problems includes: a water-soluble gold salt; a reducing agent; and a phosphine compound represented by a following formula (1) wherein R1, R2, and R3 represent identically or differently either a phenyl group, or an alkyl group having 1 to 5 carbons, and at least one of the phenyl group or the alkyl group is substituted by a sulfonate group or its salt, a cyano group, or a carboxy group or its salt.Type: GrantFiled: March 2, 2020Date of Patent: April 13, 2021Assignee: C. UYEMURA & CO., LTD.Inventors: Yohei Kaneko, Naoshi Nishimura, Tsuyoshi Maeda, Katsuhisa Tanabe
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Patent number: 10941493Abstract: A film formation method is provided with a catalyst film formation step for forming a catalyst film on the surface of a substrate by displacement reduction plating, an intermediate film formation step for forming a palladium plating film on the catalyst film, and a surface film formation step for forming a gold plating film on the palladium plating film.Type: GrantFiled: April 27, 2017Date of Patent: March 9, 2021Assignee: C. Uyemura & Co., Ltd.Inventors: Katsuhisa Tanabe, Tatsushi Someya, Naoshi Nishimura, Tetsuya Sasamura, Eriko Furuya
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Publication number: 20210054508Abstract: An electroless palladium plating liquid containing at least hydrazine or a salt thereof as a reducing agent, which has excellent bath stability in the vicinity of acidity to neutrality range, long-term stability, and is capable of suppressing the Pd film deposition rate decrease caused by elution of etching resist. An electroless palladium plating solution of the invention includes a palladium compound, hydrazine or its salt, at least one selected from a group consisting of a compound represented by the following formula (1) or its salt and a compound represented by the following formula (2) or its salt; and a pH of 8 or less, NH2NHCOR1 (1), (NH2NHCO)2(R2)n (2), wherein R1 represents H, NH2, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, NHNH2, or an aromatic group, wherein each of these groups may have a substituent; R2 represents (CH2) or an aromatic group, wherein each of these groups may have a substituent; and n represents an integer of 0 to 10.Type: ApplicationFiled: February 15, 2019Publication date: February 25, 2021Applicant: C. Uyemura & Co., Ltd.Inventors: Tetsuya SASAMURA, Tatsushi SOMEYA, Katsuhisa TANABE, Shinsuke WADA, Eriko FURUYA
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Patent number: 10822704Abstract: An electroless platinum plating solution includes a soluble platinum compound, a complexing agent, a reducing agent, and a halide ion supplying agent, the reducing agent being formic acid.Type: GrantFiled: April 27, 2017Date of Patent: November 3, 2020Assignee: C. Uyemura & Co., Ltd.Inventors: Tetsuya Sasamura, Katsuhisa Tanabe, Hiroki Okubo, Tatsushi Someya, Eriko Furuya
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Publication number: 20200340120Abstract: The purpose of the present invention is to provide a gold plating method and a plating film for preventing a decrease of wire bonding characteristic by a thermal hysteresis by implementation and else. In addition, the purpose of the present invention is to provide a gold plating method and a plating film for preventing a decrease of wire bonding characteristic by a thermal hysteresis by implementation and else, even when a film thickness of a gold plating film is thin. A gold plating method for wire bonding connection by plating using a silver catalyst on a copper or copper alloy film, comprising: a silver catalyst forming step for forming a silver film as the silver catalyst for forming a palladium film; a palladium film forming step for forming the palladium film on the silver catalyst; a gold plating film forming step for forming a gold plating film on the palladium film, wherein a film thickness of the silver film is 0.05 ?m to 0.5 ?m.Type: ApplicationFiled: April 9, 2020Publication date: October 29, 2020Inventors: Tsuyoshi Maeda, Katsuhisa Tanabe, Naoshi Nishimura, Yohei Kaneko
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Publication number: 20200318239Abstract: An object of the present invention is to provide an electroless Pd plating solution which enables formation of a Pd plating film forming a plating film having excellent wire bondability even after a high-temperature thermal history. An electroless Pd plating solution of the present invention includes: a Palladium compound, a reducing agent, a complexing agent, and at least one selected from a group consisting of Ge and rare earth element.Type: ApplicationFiled: October 3, 2018Publication date: October 8, 2020Applicant: C. Uyemura & Co., Ltd.Inventors: Tsuyoshi MAEDA, Katsuhisa TANABE, Tomohiro KAWAHARA
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Publication number: 20200283906Abstract: The present invention provides an electroless gold plating bath having excellent plating bath stability without containing a cyanide compound under long term plating bath heating time. An electroless gold plating bath of the present invention solving above problems includes: a water-soluble gold salt; a reducing agent; and a phosphine compound represented by a following formula (1) wherein R1, R2, and R3 represent identically or differently either a phenyl group, or an alkyl group having 1 to 5 carbons, and at least one of the phenyl group or the alkyl group is substituted by a sulfonate group or its salt, a cyano group, or a carboxy group or its salt.Type: ApplicationFiled: March 2, 2020Publication date: September 10, 2020Applicant: C. Uyemura & Co., Ltd.Inventors: Yohei KANEKO, Naoshi NISHIMURA, Tsuyoshi MAEDA, Katsuhisa TANABE
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Publication number: 20200248312Abstract: An object of the present invention is to provide an electroless Pd plating solution which enables formation of a Pd plating film forming a plating film having excellent wire bondability even after a high-temperature thermal history. An electroless Pd plating solution of the present invention solved above problems, the solution includes a Palladium compound, at least one selected from a group consisting of a hypophosphorous acid compound and a phosphorous acid compound, at least one selected from the group consisting of an amine borane compound and a hydroboron compound, and a complexing agent.Type: ApplicationFiled: October 3, 2018Publication date: August 6, 2020Applicant: C. Uyemura & Co., Ltd.Inventors: Tsuyoshi MAEDA, Katsuhisa TANABE, Shinsuke WADA
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Publication number: 20190345612Abstract: A film formation method is provided with a catalyst film formation step for forming a catalyst film on the surface of a substrate by displacement reduction plating, an intermediate film formation step for forming a palladium plating film on the catalyst film, and a surface film formation step for forming a gold plating film on the palladium plating film.Type: ApplicationFiled: April 27, 2017Publication date: November 14, 2019Inventors: Katsuhisa TANABE, Tatsushi SOMEYA, Naoshi NISHIMURA, Tetsuya SASAMURA, Eriko FURUYA