Patents by Inventor Katsuhisa Tanabe

Katsuhisa Tanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTROLESS PLATINUM PLATING BATH
    Publication number: 20190309423
    Abstract: An electroless platinum plating solution includes a soluble platinum compound, a complexing agent, a reducing agent, and a halide ion supplying agent, the reducing agent being formic acid.
    Type: Application
    Filed: April 27, 2017
    Publication date: October 10, 2019
    Inventors: Tetsuya SASAMURA, Katsuhisa TANABE, Hiroki OKUBO, Tatsushi SOMEYA, Eriko FURUYA
  • Electroless gold plating bath, electroless gold plating method and electronic parts
    Patent number: 7985285
    Abstract: An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, a formaldehyde metabisulfite adduct, and an amine compound represented by R1—NH—C2H4—NH—R2 or (CH2—NH—C2H4—NH—CH2)n—R4 (wherein R1 to R4 represent —OH, —CH3, —CH2OH, —C2H4OH, —CH2N(CH3)2, —CH2NH(CH2OH), —CH2NH(C2H4OH), —C2H4NH(CH2OH), —C2H4NH(C2H4OH), —CH2N(CH2OH)2, —CH2N(C2H4OH)2, —C2H4N(CH2OH)2 or —C2H4N(C2H4OH)2, and n is an integer of 1 to 4). A gold plated coating of a good appearance can be formed without causing a failure in appearance owing to the progress of intergranular corrosion in a nickel surface.
    Type: Grant
    Filed: December 5, 2007
    Date of Patent: July 26, 2011
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Masayuki Kiso, Yukinori Oda, Seigo Kurosaka, Tohru Kamitamari, Yoshikazu Saijo, Katsuhisa Tanabe
  • Electroless gold plating bath, electroless gold plating method and electronic parts
    Publication number: 20080138506
    Abstract: An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, a formaldehyde metabisulfite adduct, and an amine compound represented by R1—NH—C2H4—NH—R2 or (CH2—NH—C2H4—NH—CH2)n—R4 (wherein R1 to R4 represent —OH, —CH3, —CH2OH, —C2H4OH, —CH2N(CH3)2, —CH2NH(CH2OH), —CH2NH(C2H4OH), —C2H4NH(CH2OH), —C2H4NH(C2H4OH), —CH2N(CH2OH)2, —CH2N(C2H4OH)2, —C2H4N(CH2OH)2 or —C2H4N(C2H4OH)2, and n is an integer of 1 to 4). A gold plated coating of a good appearance can be formed without causing a failure in appearance owing to the progress of intergranular corrosion in a nickel surface.
    Type: Application
    Filed: December 5, 2007
    Publication date: June 12, 2008
    Inventors: Masayuki Kiso, Yukinori Oda, Seigo Kurosaka, Tohru Kamitamari, Yoshikazu Saijo, Katsuhisa Tanabe