Abstract: The present invention provides a semiconductor device capable of improving a withstand voltage for a wire placed in the neighborhood of a contact. When the direction in which a wiring layer extends in the direction of a plane as viewed from the top of a substrate, is defined as a first direction, the direction orthogonal to the first direction on the plane is defined as a second direction, a radius of curvature of a conductive material layer closest to the opening is defined as R, a point where the conductive material layer and an end of the wiring layer intersect, is defined as X, a point where a straight line extending along the second direction from the point X intersects a straight line extending along the first direction through the center of the radius R of curvature of the conductive material layer, is defined as Y, and the distance between the points X and Y as viewed in the second direction is defined as A, the relations in COS−1(A/R)>46 are established.

Abstract: There is provided a connection structure in which concentration of current in a connection portion of wirings, or of an element and a wiring is prevented. Three slits are formed in each of a first wiring and a second wiring, which extends in a direction perpendicular to a direction in which the first wiring extends, so that distances from the side of a cross internal angle gradually become longer. A portion of a current path is changed by these slits so as to limit current which can flow through the cross internal angle.

Abstract: Expansion promotion means (24) for more efficiently promoting the expansion of the depletion layer (19) than the electrically insulating film(14) having a suppressor electrode layer (20) buried therein is arranged between narrow portions (23b) of the suppressor electrode layer to control the expansion of the depletion layer (19), by which arrangement the spacing s between the narrow portions (23b) can be reduced without decreasing the field reducing effect of the field reduction means, which contains the suppressor electrode layer.

Abstract: Expansion promotion means (24) for more efficiently promoting the expansion of the depletion layer (19) than the electrically insulating film (14) having a suppressor electrode layer (20) buried therein is arranged between narrow portions (23b) of the suppressor electrode layer to control the expansion of the depletion layer (19), by which arrangement the spacing s between the narrow portions (23b) can be reduced without decreasing the field reducing effect of the field reduction means, which contains the suppressor electrode layer.