Patents by Inventor Katsumi Hisano
Katsumi Hisano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Electronic apparatus having a circulation path of liquid coolant to cool a heat-generating component
Publication number: 20040070940Abstract: An electronic apparatus includes a first housing and a second housing. The first housing incorporates a pump. The second housing incorporates a heat-radiating portion. The pump has a heat-receiving portion. A circulation path for circulating liquid coolant connects the pump and the heat-radiating portion. The circulation path has two pipes. The first pipe connects the pump to the coolant inlet port of the heat-radiating portion. The second pipe connects the pump to the coolant outlet port of the heat-radiating portion. The first and second pipes extend from two adjacent points on the pump, toward a midpoint between the coolant inlet port and coolant outlet port.Type: ApplicationFiled: August 29, 2003Publication date: April 15, 2004Applicant: Kabushiki Kaisha ToshibaInventors: Kentaro Tomioka, Katsumi Hisano, Tomonao Takamatsu, Mitsuyoshi Tanimoto, Hiroyuki Kusaka, Teruo Kinoshita -
Publication number: 20040070934Abstract: An electronic apparatus comprising a housing, a display panel provided in the housing and having a back wall, and a heat-radiating portion provided in the housing to radiate the heat generated by a heat-generating component. The heat-radiating portion opposes the back wall of the display panel. The display panel and the heat-radiating portion are coupled to each other by support members. The support members hold the display panel and the heat-radiating portion at specific positions in the housing.Type: ApplicationFiled: August 29, 2003Publication date: April 15, 2004Applicant: Kabushiki Kaisha ToshibaInventors: Kentaro Tomioka, Katsumi Hisano, Tomonao Takamatsu, Mitsuyoshi Tanimoto, Hiroyuki Kusaka, Teruo Kinoshita
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Publication number: 20040057207Abstract: An electronic apparatus comprises a housing for accommodating a heat generating component and a display unit supported by the housing. A heat receiving head thermally connected to the heat generating component is accommodated inside the housing. A heat radiator is disposed in the display unit. A heat receiving head and the heat radiator are connected to each other through a circulating path for circulating cooling medium. The circulating path is provided with an intermediate cooling unit. Before cooling medium heated by heat transfer by the heat receiving head reaches the heat radiator, the intermediate cooling unit forces cooling medium to be cooled.Type: ApplicationFiled: September 25, 2003Publication date: March 25, 2004Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Kenichi Ishikawa, Katsumi Hisano
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Publication number: 20040042174Abstract: An electronic apparatus includes a heat-generating component, a heat receiving portion thermally connected to the heat-generating component, a heat radiating portion to radiate heat generated y the heat-generating component, and a circulation path to circulate a liquid coolant between the heat receiving and radiating portions. The heat radiating portion has a circulation passage defined therein, a first region including a coolant inlet port, and a second region including a coolant outlet port. The circulation passage has first and second circulation passages. The first circulation passage extends from the coolant inlet port in the first region to a position distant from the coolant inlet port, and reaches the second region after passing beside the coolant inlet port again. The second circulation passage extends between the first circulation passage and the coolant outlet port in the second region.Type: ApplicationFiled: August 29, 2003Publication date: March 4, 2004Applicant: Kabushiki Kaisha ToshibaInventors: Kentaro Tomioka, Katsumi Hisano
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Publication number: 20040042171Abstract: An electronic apparatus is provided with a main body having a heat generating component, a heat receiving portion thermally connected to the heat generating component, a display unit supported by the main body and having a display panel, a heat radiating portion contained in the display unit, and a circulation path which circulates a liquid refrigerant between the heat receiving portion and the heat radiating portion. The display unit contains a fan. The fan supplies cooling air to the heat radiating portion to cool the heat radiating portion by force.Type: ApplicationFiled: April 29, 2003Publication date: March 4, 2004Inventors: Tomonao Takamatsu, Katsumi Hisano, Hideo Iwasaki, Kentaro Tomioka
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Publication number: 20040008487Abstract: A cooling device is applied to cooling an electronic element producing concentrated heat in a case where the electronic element is housed in a portable electronic device such as a notebook PC. The cooling device is provided with an active heat transport element provided with a heat intake portion and a heat outlet portion, which conducts heat from the heat intake portion to the heat outlet portion, a first flow channel disposed upstream of the electronic element in flow of the cooling medium, a second flow channel disposed downstream of the electronic element in the flow of the cooling medium. The heat is by-passed by means of the active heat transport element so that the electronic element is exposed to flow of the cooled cooling medium and effectively cooled thereby.Type: ApplicationFiled: July 10, 2003Publication date: January 15, 2004Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Katsumi Hisano, Tomonao Takamatsu, Hideo Iwasaki
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Publication number: 20030182758Abstract: A battery-powered vacuum cleaner is provided with a battery pack that generates heat and is capable of efficiently cooling the battery pack. The battery pack of the battery-powered vacuum cleaner is cooled by a vacuum cleaner cooling method.Type: ApplicationFiled: March 17, 2003Publication date: October 2, 2003Applicant: Kabushiki Kaisha ToshibaInventors: Katsumi Hisano, Hideo Iwasaki, Hideyuki Kanai, Motoya Kanda
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Publication number: 20030142476Abstract: An electronic apparatus is provided with a housing containing a heat generating component, and a blower unit contained in the housing and used to cool the heat generating component. The blower unit includes an impeller, and a casing containing the impeller. The casing has suction ports, a chamber located around the impeller and a discharge port located at the downstream end of the chamber. The chamber has a depth gradually increased radially away from the impeller.Type: ApplicationFiled: December 26, 2002Publication date: July 31, 2003Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Kentaro Tomioka, Kenichi Ishikawa, Katsumi Hisano, Kei Matsuoka, Hideyuki Toma
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Publication number: 20030134189Abstract: The invention provides a battery pack comprising an outer case, and a plurality of cylindrical lithium ion secondary batteries accommodated in the outer case in vertical N rows and lateral M rows (N rows≦M rows), with a gap between the secondary batteries, wherein the outer case has a draft port opened in a first wall facing an outer circumferential surface of the secondary batteries in the first vertical row, and an exhaust port opened in a second wall positioned at the opposite side of the first wall, in each secondary battery in the first vertical row and the second vertical row, a part of the outer circumferential surface, which is at a shorter distance from the first wall than any other parts, faces the draft port of the outer case.Type: ApplicationFiled: December 24, 2002Publication date: July 17, 2003Inventors: Hideyuki Kanai, Motoya Kanda, Katsumi Hisano, Hideo Iwasaki
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Patent number: 6579642Abstract: A battery device designed so that a plurality of battery modules (1) are arranged in rows at given spaces in a enclosure (2). Turbulence accelerators (5), such as dummy battery units or the like, are provided in a position on the uppermost-stream side of the enclosure in which air flows in the direction of arrangement of the battery modules. The heat transfer ability for the battery modules in the upper-stream position is enhanced by the turbulence accelerators which disorders the airflow introduced into the enclosure. Auxiliary coolant intake ports (7) for the introduction of a coolant are provided in the middle of an airflow path, whereby the heat transfer ability on the lower-stream side is enhanced, so that battery temperature differences between the battery units arranged in the enclosure can be restrained. Thus, a simple-construction battery device is realized enjoying improved quality and operation stability.Type: GrantFiled: October 31, 2001Date of Patent: June 17, 2003Assignees: Toshiba Battery Co., Ltd., Kabushiki Kaisha ToshibaInventors: Tetsuya Yamane, Katsumi Hisano, Tsutomu Matsui, Kei Matsuoka, Hideo Iwasaki
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Publication number: 20030072134Abstract: An electronic apparatus comprises a housing for accommodating a heat generating component and a display unit supported by the housing. A heat receiving head thermally connected to the heat generating component is accommodated inside the housing. A heat radiator is disposed in the display unit. A heat receiving head and the heat radiator are connected to each other through a circulating path for circulating cooling medium. The circulating path is provided with an intermediate cooling unit. Before cooling medium heated by heat transfer by the heat receiving head reaches the heat radiator, the intermediate cooling unit forces cooling medium to be cooled.Type: ApplicationFiled: November 19, 2002Publication date: April 17, 2003Applicant: KABUSHIKI KAISHA TOHSIBAInventors: Kenichi Ishikawa, Katsumi Hisano
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Patent number: 6510052Abstract: An electronic apparatus comprises a housing for accommodating a heat generating component and a display unit supported by the housing. A heat receiving head thermally connected to the heat generating component is accommodated inside the housing. A heat radiator is disposed in the display unit. A heat receiving head and the heat radiator are connected to each other through a circulating path for circulating cooling medium. The circulating path is provided with an intermediate cooling unit. Before cooling medium heated by heat transfer by the heat receiving head reaches the heat radiator, the intermediate cooling unit forces cooling medium to be cooled.Type: GrantFiled: September 19, 2001Date of Patent: January 21, 2003Assignee: Kabushiki Kaisha ToshibaInventors: Kenichi Ishikawa, Katsumi Hisano
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Patent number: 6442025Abstract: A cooling unit for cooling a semiconductor package has a heat sink and an electric fan device. The heat sink includes a heat receiving portion for heat generated by the semiconductor package, and a heat exchange portion thermally connected to the heat receiving portion. The heat exchange portion is located adjacent to the heat receiving portion and separate from the semiconductor package. The heat sink is movable toward and away from the semiconductor package, and always urged by a plate spring toward the semiconductor package. The electric fan device sends cooling air at least to the heat exchange portion of the heat sink.Type: GrantFiled: January 3, 2001Date of Patent: August 27, 2002Assignees: Kabushiki Kaisha Toshiba, Toshiba Home Techno Co., Ltd.Inventors: Hiroshi Nakamura, Katsumi Hisano, Kentaro Tomioka, Hiroshi Aoki, Katsuhiko Yamamoto
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Publication number: 20020053421Abstract: The present invention is intended to improve the heat radiating performance of an electronic apparatus provided with semiconductor devices which generate heat at a high rate. An air passage (20) is formed in a case 10, and a fan (6) produces air currents in the air passage (20). Heat generated by a heat-generative part (1) mounted on a circuit board (2) is transferred to a wall (21) included in walls defining the air passage (20) by a heat transfer member (3), such as a heat pipe, and is carried outside the case 10 by cooling air flowing through the air passage (20).Type: ApplicationFiled: December 20, 2001Publication date: May 9, 2002Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Katsumi Hisano, Hideo Iwasaki, Yutaka Sata, Hiroshi Ubukata, Sadao Makita, Kentaro Tomioka
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Publication number: 20020039279Abstract: An electronic apparatus comprises a housing for accommodating a heat generating component and a display unit supported by the housing. A heat receiving head thermally connected to the heat generating component is accommodated inside the housing. A heat radiator is disposed in the display unit. A heat receiving head and the heat radiator are connected to each other through a circulating path for circulating cooling medium. The circulating path is provided with an intermediate cooling unit. Before cooling medium heated by heat transfer by the heat receiving head reaches the heat radiator, the intermediate cooling unit forces cooling medium to be cooled.Type: ApplicationFiled: September 19, 2001Publication date: April 4, 2002Inventors: Kenichi Ishikawa, Katsumi Hisano
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Publication number: 20020028376Abstract: A battery device designed so that a plurality of battery modules (1) are arranged in rows at given spaces in a enclosure (2). Turbulence accelerators (5), such as dummy battery units or the like, are provided in a position on the uppermost-stream side of the enclosure in which air flows in the direction of arrangement of the battery modules. The heat transfer ability for the battery modules in the upper-stream position is enhanced by the turbulence accelerators which disorders the airflow introduced into the enclosure. Auxiliary coolant intake ports (7) for the introduction of a coolant are provided in the middle of an airflow path, whereby the heat transfer ability on the lower-stream side is enhanced, so that battery temperature differences between the battery units arranged in the enclosure can be restrained. Thus, a simple-construction battery device is realized enjoying improved quality and operation stability.Type: ApplicationFiled: October 31, 2001Publication date: March 7, 2002Applicant: TOSHIBA BATTERY CO., LTD.Inventors: Tetsuya Yamane, Katsumi Hisano, Tsutomu Matsui, Kei Matsuoka, Hideo Iwasaki
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Patent number: 6335116Abstract: A battery device designed so that a plurality of battery modules (1) are arranged in rows at given spaces in a enclosure (2). Turbulence accelerators (5), such as dummy battery units or the like, are provided in a position on the uppermost-stream side of the enclosure in which air flows in the direction of arrangement of the battery modules. The heat transfer ability for the battery modules in the upper-stream position is enhanced by the turbulence accelerators which disorders the airflow introduced into the enclosure. Auxiliary coolant intake ports (7) for the introduction of a coolant are provided in the middle of an airflow path, whereby the heat transfer ability on the lower-stream side is enhanced, so that battery temperature differences between the battery units arranged in the enclosure can be restrained. Thus, a simple-construction battery device is realized enjoying improved quality and operation stability.Type: GrantFiled: January 21, 2000Date of Patent: January 1, 2002Assignees: Toshiba Battery Co., Ltd., Kabushiki Kaisha ToshibaInventors: Tetsuya Yamane, Katsumi Hisano, Tsutomu Matsui, Kei Matsuoka, Hideo Iwasaki
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Publication number: 20010017764Abstract: A cooling unit for cooling a semiconductor package has a heat sink and an electric fan device. The heat sink includes a heat receiving portion for heat generated by the semiconductor package, and a heat exchange portion thermally connected to the heat receiving portion. The heat exchange portion is located adjacent to the heat receiving portion and separate from the semiconductor package. The heat sink is movable toward and away from the semiconductor package, and always urged by a plate spring toward the semiconductor package. The electric fan device sends cooling air at least to the heat exchange portion of the heat sink.Type: ApplicationFiled: January 3, 2001Publication date: August 30, 2001Inventors: Hiroshi Nakamura, Katsumi Hisano, Kentaro Tomioka, Hiroshi Aoki, Katsuhiko Yamamoto
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Patent number: 5660917Abstract: A thermal conductivity sheet is provided which is superior all in heat radiating characteristics (thermal conductivity) in the direction of sheet thickness, close-contact with respect to parts to be cooled, and electrical insulation. In a thermal conductivity sheet 1 in which a plurality of highly thermally conductive insulators 3 are dispersed in a matrix insulator 2, the highly thermally conductive insulators 3 are oriented obliquely or erectly in the direction of thickness of the thermal conductivity sheet 1 such that at least one end faces of the highly thermally conductive insulators 3 are exposed to a surface of the matrix insulator 2. Preferably, a ratio of the total sectional area of the highly thermally conductive insulators 3 to the total surface area of the thermal conductivity sheet 1 is set to be equal to or larger than 1%.Type: GrantFiled: April 3, 1995Date of Patent: August 26, 1997Assignee: Kabushiki Kaisha ToshibaInventors: Yoshinori Fujimori, Jun Momma, Tomiya Sasaki, Hideo Iwasaki, Toshiya Sakamoto, Hiroshi Endo, Katsumi Hisano, Naoyuki Sori, Kazumi Shimotori, Noriaki Yagi, Hiromi Shizu, Takashi Sano
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Patent number: 5506755Abstract: A multi-layer wiring substrate includes an aluminum nitride ceramic substrate, a multi-layer wiring part having an electric insulating layer of an organic polymer, a die pad for mounting thereon an electronic part, and a thermal via of a column shape for effectively dissipating heat generated in the mounted electric part. The multi-layer wiring part is integrally formed on the ceramic substrate. The die pad is provided on a surface of the multi-layer wiring part. One end of the thermal via connects to the die pad, while the other end of the thermal via passes through the multi-layer wiring part and extends at least to the ceramic substrate. The thermal via is electrically insulated from the multi-layer wiring part. In the second multi-layer wiring substrate, at least one of end portions of the above thermal via is wider than a section of the other portion of the thermal via, resulting in further improvement of the heat dissipating property.Type: GrantFiled: August 18, 1994Date of Patent: April 9, 1996Assignee: Kabushiki Kaisha ToshibaInventors: Takeshi Miyagi, Kazuhiro Matsumoto, Tomiya Sasaki, Hideo Iwasaki, Katsumi Hisano