Patents by Inventor Katsumi Hisano

Katsumi Hisano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040070940
    Abstract: An electronic apparatus includes a first housing and a second housing. The first housing incorporates a pump. The second housing incorporates a heat-radiating portion. The pump has a heat-receiving portion. A circulation path for circulating liquid coolant connects the pump and the heat-radiating portion. The circulation path has two pipes. The first pipe connects the pump to the coolant inlet port of the heat-radiating portion. The second pipe connects the pump to the coolant outlet port of the heat-radiating portion. The first and second pipes extend from two adjacent points on the pump, toward a midpoint between the coolant inlet port and coolant outlet port.
    Type: Application
    Filed: August 29, 2003
    Publication date: April 15, 2004
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Kentaro Tomioka, Katsumi Hisano, Tomonao Takamatsu, Mitsuyoshi Tanimoto, Hiroyuki Kusaka, Teruo Kinoshita
  • Publication number: 20040070934
    Abstract: An electronic apparatus comprising a housing, a display panel provided in the housing and having a back wall, and a heat-radiating portion provided in the housing to radiate the heat generated by a heat-generating component. The heat-radiating portion opposes the back wall of the display panel. The display panel and the heat-radiating portion are coupled to each other by support members. The support members hold the display panel and the heat-radiating portion at specific positions in the housing.
    Type: Application
    Filed: August 29, 2003
    Publication date: April 15, 2004
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Kentaro Tomioka, Katsumi Hisano, Tomonao Takamatsu, Mitsuyoshi Tanimoto, Hiroyuki Kusaka, Teruo Kinoshita
  • Publication number: 20040057207
    Abstract: An electronic apparatus comprises a housing for accommodating a heat generating component and a display unit supported by the housing. A heat receiving head thermally connected to the heat generating component is accommodated inside the housing. A heat radiator is disposed in the display unit. A heat receiving head and the heat radiator are connected to each other through a circulating path for circulating cooling medium. The circulating path is provided with an intermediate cooling unit. Before cooling medium heated by heat transfer by the heat receiving head reaches the heat radiator, the intermediate cooling unit forces cooling medium to be cooled.
    Type: Application
    Filed: September 25, 2003
    Publication date: March 25, 2004
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Kenichi Ishikawa, Katsumi Hisano
  • Publication number: 20040042174
    Abstract: An electronic apparatus includes a heat-generating component, a heat receiving portion thermally connected to the heat-generating component, a heat radiating portion to radiate heat generated y the heat-generating component, and a circulation path to circulate a liquid coolant between the heat receiving and radiating portions. The heat radiating portion has a circulation passage defined therein, a first region including a coolant inlet port, and a second region including a coolant outlet port. The circulation passage has first and second circulation passages. The first circulation passage extends from the coolant inlet port in the first region to a position distant from the coolant inlet port, and reaches the second region after passing beside the coolant inlet port again. The second circulation passage extends between the first circulation passage and the coolant outlet port in the second region.
    Type: Application
    Filed: August 29, 2003
    Publication date: March 4, 2004
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Kentaro Tomioka, Katsumi Hisano
  • Publication number: 20040042171
    Abstract: An electronic apparatus is provided with a main body having a heat generating component, a heat receiving portion thermally connected to the heat generating component, a display unit supported by the main body and having a display panel, a heat radiating portion contained in the display unit, and a circulation path which circulates a liquid refrigerant between the heat receiving portion and the heat radiating portion. The display unit contains a fan. The fan supplies cooling air to the heat radiating portion to cool the heat radiating portion by force.
    Type: Application
    Filed: April 29, 2003
    Publication date: March 4, 2004
    Inventors: Tomonao Takamatsu, Katsumi Hisano, Hideo Iwasaki, Kentaro Tomioka
  • Publication number: 20040008487
    Abstract: A cooling device is applied to cooling an electronic element producing concentrated heat in a case where the electronic element is housed in a portable electronic device such as a notebook PC. The cooling device is provided with an active heat transport element provided with a heat intake portion and a heat outlet portion, which conducts heat from the heat intake portion to the heat outlet portion, a first flow channel disposed upstream of the electronic element in flow of the cooling medium, a second flow channel disposed downstream of the electronic element in the flow of the cooling medium. The heat is by-passed by means of the active heat transport element so that the electronic element is exposed to flow of the cooled cooling medium and effectively cooled thereby.
    Type: Application
    Filed: July 10, 2003
    Publication date: January 15, 2004
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Katsumi Hisano, Tomonao Takamatsu, Hideo Iwasaki
  • Publication number: 20030182758
    Abstract: A battery-powered vacuum cleaner is provided with a battery pack that generates heat and is capable of efficiently cooling the battery pack. The battery pack of the battery-powered vacuum cleaner is cooled by a vacuum cleaner cooling method.
    Type: Application
    Filed: March 17, 2003
    Publication date: October 2, 2003
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Katsumi Hisano, Hideo Iwasaki, Hideyuki Kanai, Motoya Kanda
  • Publication number: 20030142476
    Abstract: An electronic apparatus is provided with a housing containing a heat generating component, and a blower unit contained in the housing and used to cool the heat generating component. The blower unit includes an impeller, and a casing containing the impeller. The casing has suction ports, a chamber located around the impeller and a discharge port located at the downstream end of the chamber. The chamber has a depth gradually increased radially away from the impeller.
    Type: Application
    Filed: December 26, 2002
    Publication date: July 31, 2003
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Kentaro Tomioka, Kenichi Ishikawa, Katsumi Hisano, Kei Matsuoka, Hideyuki Toma
  • Publication number: 20030134189
    Abstract: The invention provides a battery pack comprising an outer case, and a plurality of cylindrical lithium ion secondary batteries accommodated in the outer case in vertical N rows and lateral M rows (N rows≦M rows), with a gap between the secondary batteries, wherein the outer case has a draft port opened in a first wall facing an outer circumferential surface of the secondary batteries in the first vertical row, and an exhaust port opened in a second wall positioned at the opposite side of the first wall, in each secondary battery in the first vertical row and the second vertical row, a part of the outer circumferential surface, which is at a shorter distance from the first wall than any other parts, faces the draft port of the outer case.
    Type: Application
    Filed: December 24, 2002
    Publication date: July 17, 2003
    Inventors: Hideyuki Kanai, Motoya Kanda, Katsumi Hisano, Hideo Iwasaki
  • Patent number: 6579642
    Abstract: A battery device designed so that a plurality of battery modules (1) are arranged in rows at given spaces in a enclosure (2). Turbulence accelerators (5), such as dummy battery units or the like, are provided in a position on the uppermost-stream side of the enclosure in which air flows in the direction of arrangement of the battery modules. The heat transfer ability for the battery modules in the upper-stream position is enhanced by the turbulence accelerators which disorders the airflow introduced into the enclosure. Auxiliary coolant intake ports (7) for the introduction of a coolant are provided in the middle of an airflow path, whereby the heat transfer ability on the lower-stream side is enhanced, so that battery temperature differences between the battery units arranged in the enclosure can be restrained. Thus, a simple-construction battery device is realized enjoying improved quality and operation stability.
    Type: Grant
    Filed: October 31, 2001
    Date of Patent: June 17, 2003
    Assignees: Toshiba Battery Co., Ltd., Kabushiki Kaisha Toshiba
    Inventors: Tetsuya Yamane, Katsumi Hisano, Tsutomu Matsui, Kei Matsuoka, Hideo Iwasaki
  • Publication number: 20030072134
    Abstract: An electronic apparatus comprises a housing for accommodating a heat generating component and a display unit supported by the housing. A heat receiving head thermally connected to the heat generating component is accommodated inside the housing. A heat radiator is disposed in the display unit. A heat receiving head and the heat radiator are connected to each other through a circulating path for circulating cooling medium. The circulating path is provided with an intermediate cooling unit. Before cooling medium heated by heat transfer by the heat receiving head reaches the heat radiator, the intermediate cooling unit forces cooling medium to be cooled.
    Type: Application
    Filed: November 19, 2002
    Publication date: April 17, 2003
    Applicant: KABUSHIKI KAISHA TOHSIBA
    Inventors: Kenichi Ishikawa, Katsumi Hisano
  • Patent number: 6510052
    Abstract: An electronic apparatus comprises a housing for accommodating a heat generating component and a display unit supported by the housing. A heat receiving head thermally connected to the heat generating component is accommodated inside the housing. A heat radiator is disposed in the display unit. A heat receiving head and the heat radiator are connected to each other through a circulating path for circulating cooling medium. The circulating path is provided with an intermediate cooling unit. Before cooling medium heated by heat transfer by the heat receiving head reaches the heat radiator, the intermediate cooling unit forces cooling medium to be cooled.
    Type: Grant
    Filed: September 19, 2001
    Date of Patent: January 21, 2003
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kenichi Ishikawa, Katsumi Hisano
  • Patent number: 6442025
    Abstract: A cooling unit for cooling a semiconductor package has a heat sink and an electric fan device. The heat sink includes a heat receiving portion for heat generated by the semiconductor package, and a heat exchange portion thermally connected to the heat receiving portion. The heat exchange portion is located adjacent to the heat receiving portion and separate from the semiconductor package. The heat sink is movable toward and away from the semiconductor package, and always urged by a plate spring toward the semiconductor package. The electric fan device sends cooling air at least to the heat exchange portion of the heat sink.
    Type: Grant
    Filed: January 3, 2001
    Date of Patent: August 27, 2002
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Home Techno Co., Ltd.
    Inventors: Hiroshi Nakamura, Katsumi Hisano, Kentaro Tomioka, Hiroshi Aoki, Katsuhiko Yamamoto
  • Publication number: 20020053421
    Abstract: The present invention is intended to improve the heat radiating performance of an electronic apparatus provided with semiconductor devices which generate heat at a high rate. An air passage (20) is formed in a case 10, and a fan (6) produces air currents in the air passage (20). Heat generated by a heat-generative part (1) mounted on a circuit board (2) is transferred to a wall (21) included in walls defining the air passage (20) by a heat transfer member (3), such as a heat pipe, and is carried outside the case 10 by cooling air flowing through the air passage (20).
    Type: Application
    Filed: December 20, 2001
    Publication date: May 9, 2002
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Katsumi Hisano, Hideo Iwasaki, Yutaka Sata, Hiroshi Ubukata, Sadao Makita, Kentaro Tomioka
  • Publication number: 20020039279
    Abstract: An electronic apparatus comprises a housing for accommodating a heat generating component and a display unit supported by the housing. A heat receiving head thermally connected to the heat generating component is accommodated inside the housing. A heat radiator is disposed in the display unit. A heat receiving head and the heat radiator are connected to each other through a circulating path for circulating cooling medium. The circulating path is provided with an intermediate cooling unit. Before cooling medium heated by heat transfer by the heat receiving head reaches the heat radiator, the intermediate cooling unit forces cooling medium to be cooled.
    Type: Application
    Filed: September 19, 2001
    Publication date: April 4, 2002
    Inventors: Kenichi Ishikawa, Katsumi Hisano
  • Publication number: 20020028376
    Abstract: A battery device designed so that a plurality of battery modules (1) are arranged in rows at given spaces in a enclosure (2). Turbulence accelerators (5), such as dummy battery units or the like, are provided in a position on the uppermost-stream side of the enclosure in which air flows in the direction of arrangement of the battery modules. The heat transfer ability for the battery modules in the upper-stream position is enhanced by the turbulence accelerators which disorders the airflow introduced into the enclosure. Auxiliary coolant intake ports (7) for the introduction of a coolant are provided in the middle of an airflow path, whereby the heat transfer ability on the lower-stream side is enhanced, so that battery temperature differences between the battery units arranged in the enclosure can be restrained. Thus, a simple-construction battery device is realized enjoying improved quality and operation stability.
    Type: Application
    Filed: October 31, 2001
    Publication date: March 7, 2002
    Applicant: TOSHIBA BATTERY CO., LTD.
    Inventors: Tetsuya Yamane, Katsumi Hisano, Tsutomu Matsui, Kei Matsuoka, Hideo Iwasaki
  • Patent number: 6335116
    Abstract: A battery device designed so that a plurality of battery modules (1) are arranged in rows at given spaces in a enclosure (2). Turbulence accelerators (5), such as dummy battery units or the like, are provided in a position on the uppermost-stream side of the enclosure in which air flows in the direction of arrangement of the battery modules. The heat transfer ability for the battery modules in the upper-stream position is enhanced by the turbulence accelerators which disorders the airflow introduced into the enclosure. Auxiliary coolant intake ports (7) for the introduction of a coolant are provided in the middle of an airflow path, whereby the heat transfer ability on the lower-stream side is enhanced, so that battery temperature differences between the battery units arranged in the enclosure can be restrained. Thus, a simple-construction battery device is realized enjoying improved quality and operation stability.
    Type: Grant
    Filed: January 21, 2000
    Date of Patent: January 1, 2002
    Assignees: Toshiba Battery Co., Ltd., Kabushiki Kaisha Toshiba
    Inventors: Tetsuya Yamane, Katsumi Hisano, Tsutomu Matsui, Kei Matsuoka, Hideo Iwasaki
  • Publication number: 20010017764
    Abstract: A cooling unit for cooling a semiconductor package has a heat sink and an electric fan device. The heat sink includes a heat receiving portion for heat generated by the semiconductor package, and a heat exchange portion thermally connected to the heat receiving portion. The heat exchange portion is located adjacent to the heat receiving portion and separate from the semiconductor package. The heat sink is movable toward and away from the semiconductor package, and always urged by a plate spring toward the semiconductor package. The electric fan device sends cooling air at least to the heat exchange portion of the heat sink.
    Type: Application
    Filed: January 3, 2001
    Publication date: August 30, 2001
    Inventors: Hiroshi Nakamura, Katsumi Hisano, Kentaro Tomioka, Hiroshi Aoki, Katsuhiko Yamamoto
  • Patent number: 5660917
    Abstract: A thermal conductivity sheet is provided which is superior all in heat radiating characteristics (thermal conductivity) in the direction of sheet thickness, close-contact with respect to parts to be cooled, and electrical insulation. In a thermal conductivity sheet 1 in which a plurality of highly thermally conductive insulators 3 are dispersed in a matrix insulator 2, the highly thermally conductive insulators 3 are oriented obliquely or erectly in the direction of thickness of the thermal conductivity sheet 1 such that at least one end faces of the highly thermally conductive insulators 3 are exposed to a surface of the matrix insulator 2. Preferably, a ratio of the total sectional area of the highly thermally conductive insulators 3 to the total surface area of the thermal conductivity sheet 1 is set to be equal to or larger than 1%.
    Type: Grant
    Filed: April 3, 1995
    Date of Patent: August 26, 1997
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshinori Fujimori, Jun Momma, Tomiya Sasaki, Hideo Iwasaki, Toshiya Sakamoto, Hiroshi Endo, Katsumi Hisano, Naoyuki Sori, Kazumi Shimotori, Noriaki Yagi, Hiromi Shizu, Takashi Sano
  • Patent number: 5506755
    Abstract: A multi-layer wiring substrate includes an aluminum nitride ceramic substrate, a multi-layer wiring part having an electric insulating layer of an organic polymer, a die pad for mounting thereon an electronic part, and a thermal via of a column shape for effectively dissipating heat generated in the mounted electric part. The multi-layer wiring part is integrally formed on the ceramic substrate. The die pad is provided on a surface of the multi-layer wiring part. One end of the thermal via connects to the die pad, while the other end of the thermal via passes through the multi-layer wiring part and extends at least to the ceramic substrate. The thermal via is electrically insulated from the multi-layer wiring part. In the second multi-layer wiring substrate, at least one of end portions of the above thermal via is wider than a section of the other portion of the thermal via, resulting in further improvement of the heat dissipating property.
    Type: Grant
    Filed: August 18, 1994
    Date of Patent: April 9, 1996
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Takeshi Miyagi, Kazuhiro Matsumoto, Tomiya Sasaki, Hideo Iwasaki, Katsumi Hisano