Patents by Inventor Katsumi Hisano

Katsumi Hisano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5381859
    Abstract: A heat sink according to the invention comprises a multilayered body prepared by laying one upon the other a plurality of heat sink fin elements having pin-fin sections formed by cutting a number of slits through thin plates of a thermally conductive material with spacers, each being inserted between two adjacent heat sink fin elements to separate them by a given distance.
    Type: Grant
    Filed: June 7, 1993
    Date of Patent: January 17, 1995
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Ko Minakami, Toshinori Terashima, Toshio Maeda, Tomiya Sasaki, Katsumi Hisano, Hideo Iwasaki, Koichiro Kawano
  • Patent number: 5198889
    Abstract: A cooling apparatus for cooling a heat generating member by removing heat produced in the member comprises a cooling stud which is thermally jointed to the heat generating member, a woking fluid for removing the heat transmitted to the cooling stud by utilizing vaporization thereof, a condenser for condensing the vaporized fluid and providing the liquid phase fluid to the cooling stud, and a passage through which the liquid phase fluid passes while vaporizing to remove the heat, the liquid phase fluid being provided to the passage in the cooling stud by the condenser device.
    Type: Grant
    Filed: June 28, 1991
    Date of Patent: March 30, 1993
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Katsumi Hisano, Tomiya Sasaki, Masaru Ishizuka