Patents by Inventor Katsumi Kikuchi
Katsumi Kikuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250098550Abstract: A quantum device using a quantum state, including a quantum chip, a wiring component having a wiring layer, and a laminated substrate installed so that at least the surface of the wiring component on which the quantum chip is mounted is exposed, wherein a wiring layer of the laminated substrate and the wiring layer of the wiring component are connected by an integrated conductor pattern.Type: ApplicationFiled: May 22, 2024Publication date: March 20, 2025Applicant: NEC CorporationInventors: Katsumi KIKUCHI, Satoshi TSUKIYAMA, Tomohiro NISHIYAMA
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Publication number: 20250081861Abstract: A quantum device includes a quantum chip, a first interposer which faces the quantum chip, and bumps provided at locations between the first interposer and the quantum chip, the bumps including first bumps and second bumps, wherein the first bumps contain at least a superconducting material, and the second bumps are made of a different material from the first bumps.Type: ApplicationFiled: June 25, 2024Publication date: March 6, 2025Applicant: NEC CorporationInventors: Satoshi TSUKIYAMA, Katsumi Kikuchi
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Patent number: 12243310Abstract: An article determination apparatus (10) is used with two image capture units (20). One image capture unit (20), an article shelf (40), and the other image capture unit (20) are arranged in this order. The acquisition unit (110) acquires images generated by the two image capture units (20). The image processing unit (120) generates first size data and second size data by processing the images acquired by the acquisition unit (110). The first size data and the second size data indicate the size of an area in which an article is captured in an image generated by one image capture unit (20) and by the other image capture unit (20), respectively. The determination unit (130) determines that an estimation result of the article name of the article by image processing is correct when a relation between the first size data and the second size data satisfies a criterion.Type: GrantFiled: February 20, 2020Date of Patent: March 4, 2025Assignee: NEC CORPORATIONInventors: Yu Nabeto, Katsumi Kikuchi, Soma Shiraishi, Takami Sato
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Patent number: 12230293Abstract: An information processing device 1X mainly includes a slow motion video generation means 16X and a digest candidate generation means 18X. The slow motion video generation means 16X generates a slow motion video SL being video data in which a playback speed of the first candidate video data Cd1 is slower than a normal speed, with respect to first candidate video data Cd1 being video data corresponding to a segment of a portion selected from video material data Dm. Here, the digest candidate generation means 18X generates digest candidate Cd being a candidate of a digest of the video material data Dm based on the video material data Dm and the slow motion video SL.Type: GrantFiled: May 26, 2020Date of Patent: February 18, 2025Assignee: NEC CORPORATIONInventors: Yu Nabeto, Katsumi Kikuchi, Soma Shiraishi, Haruna Watanabe
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Patent number: 12217501Abstract: In an object identification apparatus, a foreground extraction unit performs a foreground extraction with respect to input images, and generates a foreground extraction result. A state extraction unit extracts a state for each foreground based on the foreground extraction result. An identification model selection unit selects one or more identification models based on the extracted state for each foreground by using a selection model. An identification unit identifies a moving object included in the input images using the selected identification model.Type: GrantFiled: December 24, 2019Date of Patent: February 4, 2025Assignee: NEC CORPORATIONInventors: Hideaki Sato, Katsumi Kikuchi, Kyota Higa
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Patent number: 12211228Abstract: The information processing device 4 includes an acquisition unit 40A, a structural feature point extraction unit 41A, a common coordinate system transformation unit 42A, and a structural feature point integration unit 43A. The acquisition unit 40A is configured to acquire captured images Im generated by plural image acquisition devices 5 and positional relation information Ip indicative of a positional relation among the plural image acquisition device 5. The structural feature point extraction unit 41A is configured to extract, from each of the captured images Im, intra-image coordinate values Pi for structural feature points, which are structural feature points of a target structure of observation through a display device, the display device displaying a virtual object superimposed on a view.Type: GrantFiled: December 26, 2019Date of Patent: January 28, 2025Assignee: NEC CORPORATIONInventors: Akane Aruga, Yasunori Babazaki, Katsumi Kikuchi
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Patent number: 12192632Abstract: An installation assistance apparatus (100) includes a first image capture unit and a second image capture unit that are placed in such a way as to face each other in a plan view, an acquisition unit (102) acquiring a first image from the first image capture unit, a detection unit (104) detecting a position of at least part of the second image capture unit in the first image by processing the first image, a determination unit (106) determining whether the position of the second image capture unit satisfies a criterion, and an output processing unit (108) causing a determination result by the determination unit (106) to be output.Type: GrantFiled: May 21, 2020Date of Patent: January 7, 2025Assignee: NEC CORPORATIONInventors: Katsumi Kikuchi, Soma Shiraishi, Yu Nabeto, Takami Sato
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Publication number: 20240429309Abstract: A quantum device includes a first chip including a quantum bit including a band-shaped pattern extending in a first direction, and a second chip including a band-shaped readout pad extending in a second direction different from the first direction, wherein the readout pad faces and intersects with the band-shaped pattern.Type: ApplicationFiled: June 3, 2024Publication date: December 26, 2024Applicant: NEC CorporationInventors: Kunihiko ISHIHARA, Yuichi Igarashi, Katsumi Kikuchi
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Patent number: 12108690Abstract: A quantum device capable of securing terminals for external connection is provided. A quantum device according to an example embodiment includes a quantum chip 10, an interposer 20 on which the quantum chip 10 is mounted, and a socket 40 disposed so as to be opposed to the interposer 20, the socket 40 comprising a movable pin 47 and a housing 45 supporting the movable pin 47, in which at least one end of the movable pin 47, which includes the one end and the other end opposite to the one end, is movable relative to the housing 45, the one end being in electrical contact with a terminal of the interposer 20, and the other end is in an electrical contact with a terminal of a board 50 on which a connector 51 is formed, the connector 51 being configured to serve as an external input/output.Type: GrantFiled: June 15, 2021Date of Patent: October 1, 2024Assignee: NEC CORPORATIONInventors: Katsumi Kikuchi, Akira Miyata, Suguru Watanabe, Takanori Nishi, Hideyuki Satou, Kenji Nanba, Ayami Yamaguchi
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Patent number: 12094812Abstract: A quantum device capable of improving a cooling effect while securing the number of terminals is provided. A quantum device according to an example embodiment includes a quantum chip 10, and an interposer 20 on which the quantum chip 10 is mounted, in which the interposer 20 includes a conductive wiring line CL1 electrically connected to the quantum chip 10, and a metal film 70 disposed in a part of the interposer 20 that is in contact with a sample stage 30 having a cooling function, and a mounting surface 21 of the interposer 20 on which the quantum chip 10 is mounted or an opposite surface 22 opposite to the mounting surface 21 includes a first area AR11 and a second area AR12 different from the first area AR11 as viewed in a direction perpendicular to the mounting surface 21 or the opposite surface 22.Type: GrantFiled: June 11, 2021Date of Patent: September 17, 2024Assignee: NEC CORPORATIONInventors: Katsumi Kikuchi, Akira Miyata, Suguru Watanabe, Takanori Nishi, Hideyuki Satou, Kenji Nanba, Ayami Yamaguchi
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Patent number: 12072496Abstract: The information processing device 4 includes an acquisition unit 41A and a structure matching unit 43A. The acquisition unit 41A is configured to acquire, from a captured image captured by a photographing unit 15A of a display device configured to display a virtual object superimposed on a view, multiple combinations of classification information of a structural feature point that is a feature point, in structure, of a target structure and position information of the structural feature point.Type: GrantFiled: December 24, 2019Date of Patent: August 27, 2024Assignee: NEC CORPORATIONInventors: Yasunori Babazaki, Akane Aruga, Katsumi Kikuchi
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Publication number: 20240242577Abstract: An image acquisition unit (11) acquires a recognition processing image. A recognition unit (12) recognizes a product in the recognition processing image based on an estimation model. A registration unit (13) registers a result of the recognition in recognized product information. An output unit (14) outputs a result of the recognition. A correction reception unit (16) receives an input for correcting a result of the recognition. A correction unit (17) changes a result of the recognition to a result of the recognition after a correction, and also stores correction information in which a result of the recognition after a correction and the recognition processing image are associated with each other. A learning unit (18) performs relearning by using the recognition processing image stored as the correction information and updates the estimation model, when a number of the recognition processing image stored exceeds a predetermined value.Type: ApplicationFiled: February 7, 2024Publication date: July 18, 2024Applicant: NEC CorporationInventors: Yu NABETO, Soma SHIRAISHI, Takami SATO, Katsumi KIKUCHI
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Publication number: 20240234293Abstract: A quantum device capable of effectively cooling a quantum chip and an area (e.g., a space) therearound is provided. A quantum device includes a quantum chip and an interposer on which the quantum chip is located. The interposer includes an interposer substrate and an interposer wiring layer. The interposer wiring layer is disposed on a surface of the interposer substrate on a side on which the quantum chip is located. The interposer wiring layer includes, in at least a part thereof, a superconducting material layer formed of a superconducting material and a non-superconducting material layer formed of a non-superconducting material.Type: ApplicationFiled: July 27, 2023Publication date: July 11, 2024Applicant: NEC CorporationInventors: Katsumi KIKUCHI, Akira MIYATA, Suguru WATANABE, Takanori NISHI, Hideyuki SATOU, Kenji NANBA, Ayami YAMAGUCHI
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Patent number: 12010371Abstract: An information processing apparatus generates structural information of a digest video from a video material. In the information processing apparatus, a video acquisition means acquires a video material. A condition acquisition means acquires a generation condition for generating the digest video from the creator. A generation means generates structural information indicating a structure of the digest video that is generated based on the video material based on the generation condition, and outputs the generated structural information.Type: GrantFiled: May 18, 2020Date of Patent: June 11, 2024Assignee: NEC CORPORATIONInventors: Katsumi Kikuchi, Haruna Watanabe, Yu Nabeto, Soma Shiraishi
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Publication number: 20240160982Abstract: A quantum device includes a first chip and a second chip that are assembled to configure a three-dimensional wiring structure. The first chip includes a protruding region protruded from a side edge of an outer periphery of the second chip and includes terminals on the protruding region.Type: ApplicationFiled: November 10, 2023Publication date: May 16, 2024Applicant: NEC CorporationInventors: Katsumi KIKUCHI, Akira Miyata
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Publication number: 20240136274Abstract: A quantum device capable of effectively cooling a quantum chip and an area (e.g., a space) therearound is provided. A quantum device includes a quantum chip and an interposer on which the quantum chip is located. The interposer includes an interposer substrate and an interposer wiring layer. The interposer wiring layer is disposed on a surface of the interposer substrate on a side on which the quantum chip is located. The interposer wiring layer includes, in at least a part thereof, a superconducting material layer formed of a superconducting material and a non-superconducting material layer formed of a non-superconducting material.Type: ApplicationFiled: July 26, 2023Publication date: April 25, 2024Applicant: NEC CorporationInventors: Katsumi KIKUCHI, Akira MIYATA, Suguru WATANABE, Takanori NISHI, Hideyuki SATOU, Kenji NANBA, Ayami YAMAGUCHI
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Patent number: 11947070Abstract: A housing device (20) includes a housing portion (22), a light source (200), and an optical sensor (300). The housing portion (22) includes a holding body (100). An article is housed in the housing portion (22). The holding body (100) extends in one direction. The light source (200) is attached to the holding body (100) along the one direction. The light source (200) applies light toward at least a part of a space (S) located on a side of the holding body (100) with respect to the one direction of the holding body (100), a front of the space (S), and a back of the space (S). The optical sensor (300) is attached to the holding body (100). At least a part of a visual field of the optical sensor (300) faces in at least a part of the space (S), the front of the space (S), and the back of the space (S).Type: GrantFiled: January 23, 2020Date of Patent: April 2, 2024Assignee: NEC CORPORATIONInventors: Soma Shiraishi, Katsumi Kikuchi, Takami Sato, Yu Nabeto
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Patent number: 11941858Abstract: An object recognition device (10) includes a holding body (100), a light source (200), and an optical sensor (300). The holding body (100) extends in one direction. The light source (200) is attached to the holding body (100) along the one direction. The light source (200) applies light toward at least a part of a space (S) located on a side of the holding body (100) with respect to the one direction of the holding body (100), a front of the space (S), and a back of the space (S). The optical sensor (300) is attached to the holding body (100). At least a part of a visual field of the optical sensor (300) faces in at least a part of the space (S), the front of the space (S), and the back of the space (S).Type: GrantFiled: January 23, 2020Date of Patent: March 26, 2024Assignee: NEC CORPORATIONInventors: Soma Shiraishi, Katsumi Kikuchi, Takami Sato, Yu Nabeto
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Patent number: 11935373Abstract: An image acquisition unit (11) acquires a recognition processing image. A recognition unit (12) recognizes a product in the recognition processing image based on an estimation model. A registration unit (13) registers a result of the recognition in recognized product information. An output unit (14) outputs a result of the recognition. A correction reception unit (16) receives an input for correcting a result of the recognition. A correction unit (17) changes a result of the recognition to a result of the recognition after a correction, and also stores correction information in which a result of the recognition after a correction and the recognition processing image are associated with each other. A learning unit (18) performs relearning by using the recognition processing image stored as the correction information and updates the estimation model, when a number of the recognition processing image stored exceeds a predetermined value.Type: GrantFiled: May 20, 2020Date of Patent: March 19, 2024Assignee: NEC CORPORATIONInventors: Yu Nabeto, Soma Shiraishi, Takami Sato, Katsumi Kikuchi
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Publication number: 20240079281Abstract: A quantum device includes a quantum chip including a superconducting quantum circuit; an interposer including mounting the quantum chip on a first surface thereof; a housing having openings penetrating from a first surface of the housing opposing a second surface of the interposer to a second surface of the housing with probe pins housed in the opening, a board with a first surface facing the second surface of the housing; and one or more spacers between the first surface of the housing and the second surface of the interposer to ensure a clearance between the first surface of the housing and the second surface of the interposer facing the first surface of the housing.Type: ApplicationFiled: August 29, 2023Publication date: March 7, 2024Applicant: NEC CorporationInventors: Suguru WATANABE, Kunihiko ISHIHARA, Katsumi KIKUCHI