Patents by Inventor Katsumi Kikuchi

Katsumi Kikuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11448565
    Abstract: To reduce erroneous determinations of detecting a leak, a measurement time determination device is provided with: a degree-of-ease calculation unit configured to calculate degree-of-ease of detecting a leak in piping, based on vibration propagating through the piping or a fluid flowing through the piping when the piping is vibrated; and a determination unit configured to determine a measurement time necessary for detecting the leak, based on the degree-of-ease.
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: September 20, 2022
    Assignee: NEC CORPORATION
    Inventors: Hirofumi Inoue, Katsumi Kikuchi, Shigeki Shinoda, Shin Tominaga
  • Patent number: 11402290
    Abstract: A leakage inspection device according to an aspect of the present disclosure includes: at least one memory storing a set of instructions; and at least one processor configured to execute the set of instructions to: determine a measurement time; measure vibration waveforms for the measurement time by using at least two sensors set to a pipe; calculate a cross-correlation function of the measured vibration waveforms; detect peaks of the cross-correlation function at least twice in the measurement time; and determine that leakage occurs in a case where the peaks are repeatedly detected in the measurement time.
    Type: Grant
    Filed: June 13, 2019
    Date of Patent: August 2, 2022
    Assignee: NEC CORPORATION
    Inventors: Shigeki Shinoda, Hirofumi Inoue, Junichiro Mataga, Takahiro Kumura, Katsumi Kikuchi
  • Publication number: 20210408354
    Abstract: To provide a quantum device capable of preventing a connection member connecting a quantum chip with an interposer from being broken. The quantum device 1 includes at least one quantum chip 10, at least one interposer 20 on which the at least one quantum chip 10 is mounted, and a plurality of connection members 30 formed of a conductor. The plurality of connection members 30 are disposed between the quantum chip 10 and the interposer 20, and connect the quantum chip 10 with the interposer 20. The size of the connection member 30 on the surface along the mounting surface 20s of the interposer 20 is changed according to the position thereof relative to the quantum chip 10.
    Type: Application
    Filed: June 24, 2021
    Publication date: December 30, 2021
    Applicant: NEC Corporation
    Inventors: Katsumi KIKUCHI, Akira MIYATA, Suguru WATANABE, Takanori NISHI, Hideyuki SATOU, Kenji NANBA, Ayami YAMAGUCHI
  • Publication number: 20210408358
    Abstract: A quantum device (100) includes: an interposer (112); a quantum chip (111); a first connection part (130) that is provided between the interposer (112) and the quantum chip (111) and electrically connects a wiring layer of the interposer (112) to a wiring layer of the quantum chip (111); a predetermined signal line (w1) arranged in the wiring layer of the quantum chip (111); first shield wires (ws1) arranged in the wiring layer of the quantum chip (111) along the predetermined signal line (w1); a second shield wire (ws2) arranged in the wiring layer of the interposer (112); and a second connection part (150) that is provided between the interposer (112) and the quantum chip (111) so as to contact the first shield wires (ws1) and the second shield wire (ws2).
    Type: Application
    Filed: June 23, 2021
    Publication date: December 30, 2021
    Applicant: NEC Corporation
    Inventors: Kenji Nanba, Ayami Yamaguchi, Akira Miyata, Katsumi Kikuchi, Suguru Watanabe, Takanori Nishi, Hideyuki Satou
  • Publication number: 20210407928
    Abstract: A quantum device (100) includes an interposer (112), a quantum chip (111) mounted on the interposer (112), and a shield part (150) provided so as to surround a quantum circuit region of the interposer (112) and the quantum chip (111). Accordingly, the quantum device (100) is able to prevent interference in the quantum circuit region due to exogenous noise.
    Type: Application
    Filed: June 24, 2021
    Publication date: December 30, 2021
    Applicant: NEC Corporation
    Inventors: Kenji NANBA, Ayami YAMAGUCHI, Akira MIYATA, Katsumi KIKUCHI, Suguru WATANABE, Takanori NISHI, Hideyuki SATOU
  • Publication number: 20210399196
    Abstract: A quantum device capable of securing terminals for external connection is provided. A quantum device according to an example embodiment includes a quantum chip 10, an interposer 20 on which the quantum chip 10 is mounted, and a socket 40 disposed so as to be opposed to the interposer 20, the socket 40 comprising a movable pin 47 and a housing 45 supporting the movable pin 47, in which at least one end of the movable pin 47, which includes the one end and the other end opposite to the one end, is movable relative to the housing 45, the one end being in electrical contact with a terminal of the interposer 20, and the other end is in an electrical contact with a terminal of a board 50 on which a connector 51 is formed, the connector 51 being configured to serve as an external input/output.
    Type: Application
    Filed: June 15, 2021
    Publication date: December 23, 2021
    Applicant: NEC Corporation
    Inventors: Katsumi KIKUCHI, Akira MIYATA, Suguru WATANABE, Takanori NISHI, Hideyuki SATOU, Kenji NANBA, Ayami YAMAGUCHI
  • Publication number: 20210399194
    Abstract: A quantum device (100) includes: an interposer (112); a quantum chip (111); and a connection part (130) that is provided between the interposer (112) and the quantum chip (111) and electrically connects a wiring layer of the interposer (112) to a wiring layer of the quantum chip (111), in which the connection part (130) includes: a plurality of pillars (131) arranged on a main surface of the interposer (112); and a metal film (132) provided on a surface of the plurality of pillars (131) in such a way that it contacts the wiring layer of the quantum chip (111) and the thickness of the metal film at outer peripheral parts of the tip of each of the plurality of pillars (131) becomes larger than the thickness of the metal film at a center part of the tip of each of the plurality of pillars (131).
    Type: Application
    Filed: June 16, 2021
    Publication date: December 23, 2021
    Applicant: NEC Corporation
    Inventors: Kenji NANBA, Ayami YAMAGUCHI, Akira MIYATA, Katsumi KIKUCHI, Suguru WATANABE, Takanori NISHI, Hideyuki SATOU
  • Publication number: 20210399195
    Abstract: A quantum device capable of effectively cooling a quantum chip and an area (e.g., a space) therearound is provided. A quantum device 1 includes a quantum chip 10 and an interposer 20 on which the quantum chip 10 is located. The interposer 20 includes an interposer substrate 22 and an interposer wiring layer 30. The interposer wiring layer 30 is disposed on a surface 22a of the interposer substrate 22 on a side on which the quantum chip 10 is located. The interposer wiring layer 30 includes, in at least a part thereof, a superconducting material layer 32 formed of a superconducting material and a non-superconducting material layer 34 formed of a non-superconducting material.
    Type: Application
    Filed: June 9, 2021
    Publication date: December 23, 2021
    Applicant: NEC Corporation
    Inventors: Katsumi KIKUCHI, Akira MIYATA, Suguru WATANABE, Takanori NISHI, Hideyuki SATOU, Kenji NANBA, Ayami YAMAGUCHI
  • Publication number: 20210399193
    Abstract: A quantum device (100) includes: an interposer (112); a quantum chip (111); a first connection part (130) that is provided between the interposer (112) and the quantum chip (111) and electrically connects a wiring layer of the interposer (112) to a wiring layer of the quantum chip (111); and a second connection part (140) that is provided on a main surface of the interposer (112) where the first connection part (130) is arranged and is connected to a cooling plate (115).
    Type: Application
    Filed: June 16, 2021
    Publication date: December 23, 2021
    Applicant: NEC Corporation
    Inventors: Kenji NANBA, Ayami YAMAGUCHI, Akira MIYATA, Katsumi KIKUCHI, Suguru WATANABE, Takanori NISHI, Hideyuki SATOU
  • Publication number: 20210399197
    Abstract: A quantum device according to an example embodiment includes a quantum chip 10, and an interposer 20 on which the quantum chip 10 is mounted, in which the interposer 20 includes a conductive wiring line CL1 electrically connected to the quantum chip 10, a mounting surface 21 of the interposer 20 on which the quantum chip 10 is mounted or an opposite surface 22 opposite to the mounting surface 21 includes a first area AR11 and a second area AR12 different from the first area AR11 as viewed in a direction perpendicular to the mounting surface 21 or the opposite surface 22, the conductive wiring line CL1 is disposed in the first area AR11 on the mounting surface 21 or the opposite surface 22, and a movable member 60 is in contact with the second area AR12 of the interposer 20.
    Type: Application
    Filed: June 15, 2021
    Publication date: December 23, 2021
    Applicant: NEC Corporation
    Inventors: Katsumi KIKUCHI, Akira MIYATA, Suguru WATANABE, Takanori NISHI, Hideyuki SATOU, Kenji NANBA, Ayami YAMAGUCHI
  • Publication number: 20210398893
    Abstract: A quantum device capable of improving a cooling effect while securing the number of terminals is provided. A quantum device according to an example embodiment includes a quantum chip 10, and an interposer 20 on which the quantum chip 10 is mounted, in which the interposer 20 includes a conductive wiring line CL1 electrically connected to the quantum chip 10, and a metal film 70 disposed in a part of the interposer 20 that is in contact with a sample stage 30 having a cooling function, and a mounting surface 21 of the interposer 20 on which the quantum chip 10 is mounted or an opposite surface 22 opposite to the mounting surface 21 includes a first area AR11 and a second area AR12 different from the first area AR11 as viewed in a direction perpendicular to the mounting surface 21 or the opposite surface 22.
    Type: Application
    Filed: June 11, 2021
    Publication date: December 23, 2021
    Applicant: NEC Corporation
    Inventors: Katsumi KIKUCHI, Akira MIYATA, Suguru WATANABE, Takanori NISHI, Hideyuki SATOU, Kenji NANBA, Ayami YAMAGUCHI
  • Publication number: 20210325005
    Abstract: A fluid leakage diagnosing device includes: when fluid leakage relating to a pipeline is being diagnosed by employing adaptive signal processing to suppress a component of a disturbance vibration contained in a vibration measured at a prescribed location in the pipeline, an acquiring unit that acquires distribution information that is associated with a characteristic of the pipeline and represents an actual distribution result of a value of a parameter in the adaptive signal processing when performance of suppressing the component of the disturbance vibration satisfies a criterion; an estimating unit that, based on the distribution information, estimates a probability density at which the value of the parameter with which the performance satisfies the criterion exists; and a determining unit that, based on the probability density estimated by the estimating unit, determines a range to search for the value of the parameter in the adaptive signal processing.
    Type: Application
    Filed: September 2, 2019
    Publication date: October 21, 2021
    Applicant: NEC Corporation
    Inventors: Hirofumi INOUE, Shigeki SHINODA, Junichiro MATAGA, Katsumi KIKUCHI
  • Publication number: 20210262886
    Abstract: A fluid leakage diagnosis device includes: an identification unit for using wave measurement information expressing a wave measured in a pipe to identify a position of an origin of the wave; a detection unit for using structural information of the pipe to detect a structural factor of the wave at the position of the origin identified by the identification unit; a determination unit for determining whether a time shift in the wave measurement information satisfies a condition; and a diagnosis unit for diagnosing fluid leakage in the pipe based on a detection result from the detection unit and a determination result from the determination unit, and this fluid leakage diagnosis device enhances the accuracy of fluid leakage diagnosis for a pipe accomplished through measurement of a wave produced in the pipe.
    Type: Application
    Filed: September 17, 2019
    Publication date: August 26, 2021
    Applicant: NEC Corporation
    Inventors: Junichiro MATAGA, Shigeki SHINODA, Katsumi KIKUCHI
  • Publication number: 20210181057
    Abstract: In order to provide an estimating device and the like capable of easily estimating the strength of a pipe, this estimating device is provided with a frequency response calculating unit, a pipe rigidity variable estimating unit, and a strength estimating unit. The frequency response calculating unit calculates a frequency response function of the pipe on the basis of excitation force data representing an excitation force when the pipe is excited, and response data obtained by measuring vibrations propagating through the pipe. The pipe rigidity variable estimating unit estimates a parameter relating to the rigidity of the pipe on the basis of a frequency response function model, which is a model representing the frequency response of the pipe, and the frequency response function. The strength estimating unit estimates the strength of the pipe on the basis of a relationship between the parameter and the strength of the pipe.
    Type: Application
    Filed: November 6, 2018
    Publication date: June 17, 2021
    Applicant: NEC Corporation
    Inventors: Hirofumi INOUE, Soichiro TAKATA, Shigeki SHINODA, Katsumi KIKUCHI
  • Publication number: 20210164859
    Abstract: Provided are an analyzing device and the like capable of suppressing erroneous determination. This analyzing device is provided with: a cross correlation calculating unit that obtains a cross correlation function with respect to vibrations detected at two points contained in a measurement sector of a pipeline; an estimating unit that estimates a cause of the vibrations, on the basis of the continuity of peaks in the cross correlation function; and an analyzing unit that analyzes the actual generation location of the vibrations and cause of the vibrations on the basis of an estimated generation location of the vibrations and cause of the vibrations and information relating to the configuration of a pipeline network.
    Type: Application
    Filed: July 23, 2018
    Publication date: June 3, 2021
    Applicant: NEC Corporation
    Inventors: Shigeki SHINODA, Hirofumi INOUE, Takahiro KUMURA, Katsumi KIKUCHI
  • Patent number: 10996202
    Abstract: To acquire information relating to degradation of a pipe on the basis of information that can be acquired using a simple method. The analysis device according to one embodiment is provided with: a determining unit for determining whether or not the accuracy of a pipe network model based on information that includes a parameter that changes in value in accordance with degradation of a pipe satisfies a predetermined criterion; and a derivation unit for deriving information relating to degradation of the pipe, based on the parameter, if the accuracy satisfies the predetermined criterion.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: May 4, 2021
    Assignee: NEC CORPORATION
    Inventors: Manabu Kusumoto, Katsumi Kikuchi, Takahiro Kumura
  • Publication number: 20210116323
    Abstract: A leakage inspection device according to an aspect of the present disclosure includes: at least one memory storing a set of instructions; and at least one processor configured to execute the set of instructions to: determine a measurement time; measure vibration waveforms for the measurement time by using at least two sensors set to a pipe; calculate a cross-correlation function of the measured vibration waveforms; detect peaks of the cross-correlation function at least twice in the measurement time; and determine that leakage occurs in a case where the peaks are repeatedly detected in the measurement time.
    Type: Application
    Filed: June 13, 2019
    Publication date: April 22, 2021
    Applicant: NEC CORPORATION
    Inventors: Shigeki SHINODA, Hirofumi INOUE, Junichiro MATAGA, Takahiro KUMURA, Katsumi KIKUCHI
  • Patent number: 10942035
    Abstract: A vehicle includes an acquisition unit and a position determination unit. The acquisition unit is configured to acquire at least one of conditions including an order of getting out of the vehicle, a possibility of manual driving, and a combination of positions of sub-mobility devices in a vehicle compartment, and the position determination unit configured to determine the positions of the sub-mobility devices in the vehicle compartment, on a basis of a combination of the conditions.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: March 9, 2021
    Assignee: SUBARU CORPORATION
    Inventors: Yuji Aiuchi, Katsumi Kikuchi
  • Publication number: 20210010980
    Abstract: A system identification device 1 includes an analysis unit 105 that calculates a self-frequency response function on the basis of an input signal and an output signal measured by a measurement unit 103 at a position where a subject physical system 106 has been excited by a vibrating unit 102. The analysis unit 105 performs system identification of the subject physical system 106 by using an impulse response function obtained from the calculated self-frequency response function and an impulse response function of a virtual two-degrees-of-freedom model modeling the subject physical system 106 that is the subject of analysis. This makes it possible to perform system identification of systems with close eigenvalues.
    Type: Application
    Filed: February 18, 2019
    Publication date: January 14, 2021
    Applicant: NEC Corporation
    Inventors: Soichiro TAKATA, Hirofumi INOUE, Shigeki SHINODA, Katsumi KIKUCHI
  • Publication number: 20200401971
    Abstract: An asset management device according to an exemplary aspect of the present disclosure includes: at least one memory storing a set of instructions; and at least one processor configured to execute the set of instructions to: receive an input of information on a pipe being a diagnostic target as pipe information; set, based on the pipe information that is commonly shared by the pipes being diagnostic targets, an evaluation item for the pipes; calculate a priority level of a response for each of the pipes being diagnostic targets with respect to the evaluation item; and compare, among the pipes being diagnostic targets, calculated priority levels.
    Type: Application
    Filed: December 17, 2018
    Publication date: December 24, 2020
    Applicant: NEC Corporation
    Inventors: Shin TOMINAGA, Katsumi KIKUCHI, Masatake TAKAHASHI