Patents by Inventor Katsumi Kikuchi
Katsumi Kikuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240136274Abstract: A quantum device capable of effectively cooling a quantum chip and an area (e.g., a space) therearound is provided. A quantum device includes a quantum chip and an interposer on which the quantum chip is located. The interposer includes an interposer substrate and an interposer wiring layer. The interposer wiring layer is disposed on a surface of the interposer substrate on a side on which the quantum chip is located. The interposer wiring layer includes, in at least a part thereof, a superconducting material layer formed of a superconducting material and a non-superconducting material layer formed of a non-superconducting material.Type: ApplicationFiled: July 26, 2023Publication date: April 25, 2024Applicant: NEC CorporationInventors: Katsumi KIKUCHI, Akira MIYATA, Suguru WATANABE, Takanori NISHI, Hideyuki SATOU, Kenji NANBA, Ayami YAMAGUCHI
-
Patent number: 11947070Abstract: A housing device (20) includes a housing portion (22), a light source (200), and an optical sensor (300). The housing portion (22) includes a holding body (100). An article is housed in the housing portion (22). The holding body (100) extends in one direction. The light source (200) is attached to the holding body (100) along the one direction. The light source (200) applies light toward at least a part of a space (S) located on a side of the holding body (100) with respect to the one direction of the holding body (100), a front of the space (S), and a back of the space (S). The optical sensor (300) is attached to the holding body (100). At least a part of a visual field of the optical sensor (300) faces in at least a part of the space (S), the front of the space (S), and the back of the space (S).Type: GrantFiled: January 23, 2020Date of Patent: April 2, 2024Assignee: NEC CORPORATIONInventors: Soma Shiraishi, Katsumi Kikuchi, Takami Sato, Yu Nabeto
-
Patent number: 11941858Abstract: An object recognition device (10) includes a holding body (100), a light source (200), and an optical sensor (300). The holding body (100) extends in one direction. The light source (200) is attached to the holding body (100) along the one direction. The light source (200) applies light toward at least a part of a space (S) located on a side of the holding body (100) with respect to the one direction of the holding body (100), a front of the space (S), and a back of the space (S). The optical sensor (300) is attached to the holding body (100). At least a part of a visual field of the optical sensor (300) faces in at least a part of the space (S), the front of the space (S), and the back of the space (S).Type: GrantFiled: January 23, 2020Date of Patent: March 26, 2024Assignee: NEC CORPORATIONInventors: Soma Shiraishi, Katsumi Kikuchi, Takami Sato, Yu Nabeto
-
Patent number: 11935373Abstract: An image acquisition unit (11) acquires a recognition processing image. A recognition unit (12) recognizes a product in the recognition processing image based on an estimation model. A registration unit (13) registers a result of the recognition in recognized product information. An output unit (14) outputs a result of the recognition. A correction reception unit (16) receives an input for correcting a result of the recognition. A correction unit (17) changes a result of the recognition to a result of the recognition after a correction, and also stores correction information in which a result of the recognition after a correction and the recognition processing image are associated with each other. A learning unit (18) performs relearning by using the recognition processing image stored as the correction information and updates the estimation model, when a number of the recognition processing image stored exceeds a predetermined value.Type: GrantFiled: May 20, 2020Date of Patent: March 19, 2024Assignee: NEC CORPORATIONInventors: Yu Nabeto, Soma Shiraishi, Takami Sato, Katsumi Kikuchi
-
Publication number: 20240079281Abstract: A quantum device includes a quantum chip including a superconducting quantum circuit; an interposer including mounting the quantum chip on a first surface thereof; a housing having openings penetrating from a first surface of the housing opposing a second surface of the interposer to a second surface of the housing with probe pins housed in the opening, a board with a first surface facing the second surface of the housing; and one or more spacers between the first surface of the housing and the second surface of the interposer to ensure a clearance between the first surface of the housing and the second surface of the interposer facing the first surface of the housing.Type: ApplicationFiled: August 29, 2023Publication date: March 7, 2024Applicant: NEC CorporationInventors: Suguru WATANABE, Kunihiko ISHIHARA, Katsumi KIKUCHI
-
Publication number: 20240065116Abstract: A quantum device includes a quantum chip; an interposer flip chip mounting the quantum chip; and a socket including a housing has opening housing signal probe pins and ground probe pins. An inner wall of the opening housing the ground probe pin is covered with a metal layer, at least a part of the ground probe pin is thermally in contact with the metal layer of the inner wall which continues to a metal layer formed on at least a partial region of at least one of the first surface and the second surface of the housing.Type: ApplicationFiled: August 15, 2023Publication date: February 22, 2024Applicant: NEC CorporationInventors: Kunihiko Ishihara, Suguru Watanabe, Katsumi Kikuchi
-
Patent number: 11871682Abstract: A quantum device (100) includes: an interposer (112); a quantum chip (111); a first connection part (130) that is provided between the interposer (112) and the quantum chip (111) and electrically connects a wiring layer of the interposer (112) to a wiring layer of the quantum chip (111); and a second connection part (140) that is provided on a main surface of the interposer (112) where the first connection part (130) is arranged and is connected to a cooling plate (115).Type: GrantFiled: June 16, 2021Date of Patent: January 9, 2024Assignee: NEC CORPORATIONInventors: Kenji Nanba, Ayami Yamaguchi, Akira Miyata, Katsumi Kikuchi, Suguru Watanabe, Takanori Nishi, Hideyuki Satou
-
Publication number: 20230368535Abstract: A product identification apparatus (20) includes an acquisition unit (210), and an image processing unit (220). The acquisition unit (210) acquires a plurality of images captured by an image capturing apparatus (10). These plurality of images are generated by capturing an image of a same product shelf (40) while changing a parameter. The image processing unit (220) determines a product (50) located on the product shelf (40) by processing these plurality of images, and outputs a result of the determination. The determination result is, for example, the one in which product identification information (e.g., a JAN code) of the product (50), and a position of the product (50) on the product shelf (40) are associated with each other.Type: ApplicationFiled: May 14, 2022Publication date: November 16, 2023Applicant: NEC CorporationInventors: Yaeko YONEZAWA, Katsumi KIKUCHI, Soma SHIRAISHI, Yu NABETO
-
Publication number: 20230352052Abstract: An information processing device 1X mainly includes a slow motion video generation means 16X and a digest candidate generation means 18X. The slow motion video generation means 16X generates a slow motion video SL being video data in which a playback speed of the first candidate video data Cd1 is slower than a normal speed, with respect to first candidate video data Cd1 being video data corresponding to a segment of a portion selected from video material data Dm. Here, the digest candidate generation means 18X generates digest candidate Cd being a candidate of a digest of the video material data Dm based on the video material data Dm and the slow motion video SL.Type: ApplicationFiled: May 26, 2020Publication date: November 2, 2023Applicant: NEC CorporationInventors: Yu Nabeto, Katsumi Kikuchi, Soma Shiraishi, Haruna Watanabe
-
Patent number: 11805708Abstract: A quantum device according to an example embodiment includes a quantum chip 10, and an interposer 20 on which the quantum chip 10 is mounted, in which the interposer 20 includes a conductive wiring line CL1 electrically connected to the quantum chip 10, a mounting surface 21 of the interposer 20 on which the quantum chip 10 is mounted or an opposite surface 22 opposite to the mounting surface 21 includes a first area AR11 and a second area AR12 different from the first area AR11 as viewed in a direction perpendicular to the mounting surface 21 or the opposite surface 22, the conductive wiring line CL1 is disposed in the first area AR11 on the mounting surface 21 or the opposite surface 22, and a movable member 60 is in contact with the second area AR12 of the interposer 20.Type: GrantFiled: June 15, 2021Date of Patent: October 31, 2023Assignee: NEC CORPORATIONInventors: Katsumi Kikuchi, Akira Miyata, Suguru Watanabe, Takanori Nishi, Hideyuki Satou, Kenji Nanba, Ayami Yamaguchi
-
Publication number: 20230345844Abstract: Provided is a quantum device capable of improving cooling performance. A quantum device includes a quantum chip configured to perform information processing using a quantum state, and an interposer on which the quantum chip is mounted, and the quantum chip is arranged inside a recess 31 formed in a sample stage having a cooling function, and a part of the interposer is in contact with the sample stage. The quantum chip may have a first surface mounted on the interposer and a second surface opposite to the first surface, and at least a part of the second surface may be in contact with an inner surface of the recess.Type: ApplicationFiled: June 5, 2020Publication date: October 26, 2023Applicant: NEC CorporationInventors: Katsumi KIKUCHI, Akira MIYATA, Suguru WATANABE, Takanori NISHI, Hideyuki SATOU, Kenji NANBA, Ayami YAMAGUCHI
-
Patent number: 11798895Abstract: A quantum device (100) includes an interposer (112), a quantum chip (111) mounted on the interposer (112), and a shield part (150) provided so as to surround a quantum circuit region of the interposer (112) and the quantum chip (111). Accordingly, the quantum device (100) is able to prevent interference in the quantum circuit region due to exogenous noise.Type: GrantFiled: June 24, 2021Date of Patent: October 24, 2023Assignee: NEC CORPORATIONInventors: Kenji Nanba, Ayami Yamaguchi, Akira Miyata, Katsumi Kikuchi, Suguru Watanabe, Takanori Nishi, Hideyuki Satou
-
Publication number: 20230325138Abstract: An image capturing apparatus includes an image acquisition unit, a display processing unit, and a storage processing unit. The display processing unit displays, on a display, an image acquired by the image acquisition unit. After the storage processing unit stores a first image in an image storage unit, the display processing unit repeatedly displays a latest image (a real-time image) generated by an image capturing unit, in a second display region being adjacent to a first display region, which is a part of the display, of the display, while displaying at least an edge of the first image in the first display region. Then, the storage processing unit performs processing for storing the real-time image or an image generated thereafter, in the image storage unit as a second image, when continuity of an edge of the first image and the real-time image in the display satisfies a criterion.Type: ApplicationFiled: May 14, 2020Publication date: October 12, 2023Applicant: NEC CorporationInventors: Yaeko YONEZAWA, Katsumi KIKUCHI, Soma SHIRAISHI, Yu NABETO
-
Publication number: 20230309419Abstract: A quantum device includes a chip including a superconducting circuit, a first wiring substrate, a second wiring substrate, first connection portions connecting the chip and a wiring layer on a first surface of the first wiring substrate and second connection portions connecting the second wiring substrate and a wiring layer on a second surface of the first wiring substrate, wherein one or more second connection portions arranged in a first row as viewed from the edge of the first substrate are provided at positions corresponding respectively to one or more of the first connection portions arranged in a first row as viewed from the edge and are arranged closer to the edge than the first connection portions arranged in the first row.Type: ApplicationFiled: March 17, 2023Publication date: September 28, 2023Applicant: NEC CorporationInventors: Katsumi KIKUCHI, Akira Miyata, Takanori Nishi, Kenji Nanba, Ayami Yamaguchi
-
Publication number: 20230276717Abstract: Provided are an oscillator and a quantum computer capable of suppressing an occupied area of a circuit. An oscillator (300) includes a resonator (100) including a plurality of loop circuits in which a first superconducting line (112a), a first Josephson junction (111a), a second superconducting line (112b), and a second Josephson junction (111b) are annularly connected, and a magnetic field application circuit (200) including an electrode that goes around in a predetermined shape and configured to apply a magnetic field to the loop circuit, in which the electrode is arranged so as to face at least two of the loop circuits.Type: ApplicationFiled: June 5, 2020Publication date: August 31, 2023Applicant: NEC CorporationInventors: Akira MIYATA, Katsumi KIKUCHI, Suguru WATANABE, Takanori NISHI, Hideyuki SATOU, Tomohiro YAMAJI, Tsuyoshi YAMAMOTO, Yoshihito HASHIMOTO
-
Publication number: 20230237687Abstract: A product identification apparatus (20) includes an acquisition unit (210), an image processing unit (220), and a storage processing unit (230). The acquisition unit (210) acquires an image generated by an image capturing apparatus 10. The image includes a product shelf (40) and a product (50). The image processing unit (220) determines a position where continuity of the product shelf (40) is broken by processing the image acquired by the acquisition unit (210), and divides the product shelf (40) into a unit region by using the position. Further, the image processing unit (220) determines a kind and a product name of the product (50) by processing the image acquired by the acquisition unit (210). The storage processing unit (230) causes a storage unit (240) to store product identification information of the product (50) located in the unit region, for each unit region of the product shelf (40).Type: ApplicationFiled: May 14, 2020Publication date: July 27, 2023Applicant: NEC CorporationInventors: Yaeko YONEZAWA, Katsumi KIKUCHI, Soma SHIRAISHI, Yu NABETO
-
Publication number: 20230237362Abstract: Provided is a quantum device capable of suppressing reduction in performance of quantum bit even when a quantum chip is flip-chip mounted on an interposer. A quantum chip (10) is flip-chip mounted on an interposer (20) by a bump (30). A coplanar line (12) coupling adjacent quantum bits is formed on the quantum chip (10). A gap (22) is provided, in the interposer (20), at a location facing a center conductor (12a) of the coplanar line (12). A second ground electrode (24) is formed around gap (22). The interposer (20) has a connection electrode (40) connecting the second ground electrode (24) around the gap (22). A bump (30A) formed in the vicinity of the connection electrode (40) is connected to the first ground electrode (12b) and the second ground electrode (24).Type: ApplicationFiled: June 5, 2020Publication date: July 27, 2023Applicant: NEC CorporationInventors: Akira MIYATA, Katsumi KIKUCHI, Suguru WATANABE, Takanori NISHI, Hideyuki SATOU, Tomohiro YAMAJI, Tsuyoshi YAMAMOTO, Yoshihito HASHIMOTO
-
Patent number: 11703189Abstract: A fluid leakage diagnosing device includes: when fluid leakage relating to a pipeline is being diagnosed by employing adaptive signal processing to suppress a component of a disturbance vibration contained in a vibration measured at a prescribed location in the pipeline, an acquiring unit that acquires distribution information that is associated with a characteristic of the pipeline and represents an actual distribution result of a value of a parameter in the adaptive signal processing when performance of suppressing the component of the disturbance vibration satisfies a criterion; an estimating unit that, based on the distribution information, estimates a probability density at which the value of the parameter with which the performance satisfies the criterion exists; and a determining unit that, based on the probability density estimated by the estimating unit, determines a range to search for the value of the parameter in the adaptive signal processing.Type: GrantFiled: September 2, 2019Date of Patent: July 18, 2023Assignee: NEC CORPORATIONInventors: Hirofumi Inoue, Shigeki Shinoda, Junichiro Mataga, Katsumi Kikuchi
-
Publication number: 20230222802Abstract: The present invention provides a processing apparatus (10) including: an object region detection unit (11) that detects, from an image, an object region being a region including an object; a reliability computation unit (12) that computes, for each product, reliability in which each of the products is included in an image of the object region; an image parameter computation unit (13) that computes an image parameter related to an image of the object region; a threshold value setting unit (14) that sets a threshold value of the reliability, based on the image parameter; and a product determination unit (15) that determines, based on the reliability of each of the products and the threshold value, the product included in an image of the object region.Type: ApplicationFiled: May 29, 2020Publication date: July 13, 2023Applicant: NEC CorporationInventors: Yu Nabeto, Soma Shiraishi, Takami Sato, Katsumi Kikuchi
-
Publication number: 20230222803Abstract: The present invention provides a processing apparatus (10) including: an acquisition unit (11) that acquires a product pickup image indicating a scene of picking up a product from a first product shelf by a customer; a determination unit (12) that determines a product group displayed on the first product shelf, based on shelf-based display information indicating a product displayed on each product shelf; and a first recognition unit (13) that recognizes a product included in the product pickup image by recognition processing in which the determined product group is set as a collation target among pieces of product feature value information indicating a feature value of an external appearance of a plurality of products.Type: ApplicationFiled: June 3, 2020Publication date: July 13, 2023Applicant: NEC CorporationInventors: Yu NABETO, Katsumi Kikuchi, Takami Sato, Soma Shiraishi