Abstract: A quantum device according to an example embodiment includes: a quantum chip with a first surface and a second surface located on a side opposite to the first surface, in the quantum chip, at least a part of a qubit circuit being provided on the second surface; a first interposer with a third surface and a fourth surface located on a side opposite to the third surface, the first interposer being connected to the quantum chip in such a manner that the second surface of the quantum chip is opposed to the third surface of the first interposer; and a second interposer with a fifth surface and a sixth surface located on a side opposite to the fifth surface, the second interposer being connected to the first interposer in such a manner that the fourth surface of the first interpose is opposed to the fifth surface of the second interposer.

Abstract: To reduce erroneous determinations of detecting a leak, a measurement time determination device is provided with: a degree-of-ease calculation unit configured to calculate degree-of-ease of detecting a leak in piping, based on vibration propagating through the piping or a fluid flowing through the piping when the piping is vibrated; and a determination unit configured to determine a measurement time necessary for detecting the leak, based on the degree-of-ease.

Abstract: A leakage inspection device according to an aspect of the present disclosure includes: at least one memory storing a set of instructions; and at least one processor configured to execute the set of instructions to: determine a measurement time; measure vibration waveforms for the measurement time by using at least two sensors set to a pipe; calculate a cross-correlation function of the measured vibration waveforms; detect peaks of the cross-correlation function at least twice in the measurement time; and determine that leakage occurs in a case where the peaks are repeatedly detected in the measurement time.

Abstract: To provide a quantum device capable of preventing a connection member connecting a quantum chip with an interposer from being broken. The quantum device 1 includes at least one quantum chip 10, at least one interposer 20 on which the at least one quantum chip 10 is mounted, and a plurality of connection members 30 formed of a conductor. The plurality of connection members 30 are disposed between the quantum chip 10 and the interposer 20, and connect the quantum chip 10 with the interposer 20. The size of the connection member 30 on the surface along the mounting surface 20s of the interposer 20 is changed according to the position thereof relative to the quantum chip 10.

Abstract: A quantum device (100) includes: an interposer (112); a quantum chip (111); a first connection part (130) that is provided between the interposer (112) and the quantum chip (111) and electrically connects a wiring layer of the interposer (112) to a wiring layer of the quantum chip (111); a predetermined signal line (w1) arranged in the wiring layer of the quantum chip (111); first shield wires (ws1) arranged in the wiring layer of the quantum chip (111) along the predetermined signal line (w1); a second shield wire (ws2) arranged in the wiring layer of the interposer (112); and a second connection part (150) that is provided between the interposer (112) and the quantum chip (111) so as to contact the first shield wires (ws1) and the second shield wire (ws2).

Abstract: A quantum device (100) includes an interposer (112), a quantum chip (111) mounted on the interposer (112), and a shield part (150) provided so as to surround a quantum circuit region of the interposer (112) and the quantum chip (111). Accordingly, the quantum device (100) is able to prevent interference in the quantum circuit region due to exogenous noise.

Abstract: A quantum device capable of securing terminals for external connection is provided. A quantum device according to an example embodiment includes a quantum chip 10, an interposer 20 on which the quantum chip 10 is mounted, and a socket 40 disposed so as to be opposed to the interposer 20, the socket 40 comprising a movable pin 47 and a housing 45 supporting the movable pin 47, in which at least one end of the movable pin 47, which includes the one end and the other end opposite to the one end, is movable relative to the housing 45, the one end being in electrical contact with a terminal of the interposer 20, and the other end is in an electrical contact with a terminal of a board 50 on which a connector 51 is formed, the connector 51 being configured to serve as an external input/output.

Abstract: A quantum device according to an example embodiment includes a quantum chip 10, and an interposer 20 on which the quantum chip 10 is mounted, in which the interposer 20 includes a conductive wiring line CL1 electrically connected to the quantum chip 10, a mounting surface 21 of the interposer 20 on which the quantum chip 10 is mounted or an opposite surface 22 opposite to the mounting surface 21 includes a first area AR11 and a second area AR12 different from the first area AR11 as viewed in a direction perpendicular to the mounting surface 21 or the opposite surface 22, the conductive wiring line CL1 is disposed in the first area AR11 on the mounting surface 21 or the opposite surface 22, and a movable member 60 is in contact with the second area AR12 of the interposer 20.

Abstract: A quantum device capable of improving a cooling effect while securing the number of terminals is provided. A quantum device according to an example embodiment includes a quantum chip 10, and an interposer 20 on which the quantum chip 10 is mounted, in which the interposer 20 includes a conductive wiring line CL1 electrically connected to the quantum chip 10, and a metal film 70 disposed in a part of the interposer 20 that is in contact with a sample stage 30 having a cooling function, and a mounting surface 21 of the interposer 20 on which the quantum chip 10 is mounted or an opposite surface 22 opposite to the mounting surface 21 includes a first area AR11 and a second area AR12 different from the first area AR11 as viewed in a direction perpendicular to the mounting surface 21 or the opposite surface 22.

Abstract: A quantum device (100) includes: an interposer (112); a quantum chip (111); and a connection part (130) that is provided between the interposer (112) and the quantum chip (111) and electrically connects a wiring layer of the interposer (112) to a wiring layer of the quantum chip (111), in which the connection part (130) includes: a plurality of pillars (131) arranged on a main surface of the interposer (112); and a metal film (132) provided on a surface of the plurality of pillars (131) in such a way that it contacts the wiring layer of the quantum chip (111) and the thickness of the metal film at outer peripheral parts of the tip of each of the plurality of pillars (131) becomes larger than the thickness of the metal film at a center part of the tip of each of the plurality of pillars (131).

Abstract: A quantum device (100) includes: an interposer (112); a quantum chip (111); a first connection part (130) that is provided between the interposer (112) and the quantum chip (111) and electrically connects a wiring layer of the interposer (112) to a wiring layer of the quantum chip (111); and a second connection part (140) that is provided on a main surface of the interposer (112) where the first connection part (130) is arranged and is connected to a cooling plate (115).

Abstract: A quantum device capable of effectively cooling a quantum chip and an area (e.g., a space) therearound is provided. A quantum device 1 includes a quantum chip 10 and an interposer 20 on which the quantum chip 10 is located. The interposer 20 includes an interposer substrate 22 and an interposer wiring layer 30. The interposer wiring layer 30 is disposed on a surface 22a of the interposer substrate 22 on a side on which the quantum chip 10 is located. The interposer wiring layer 30 includes, in at least a part thereof, a superconducting material layer 32 formed of a superconducting material and a non-superconducting material layer 34 formed of a non-superconducting material.

Abstract: A fluid leakage diagnosing device includes: when fluid leakage relating to a pipeline is being diagnosed by employing adaptive signal processing to suppress a component of a disturbance vibration contained in a vibration measured at a prescribed location in the pipeline, an acquiring unit that acquires distribution information that is associated with a characteristic of the pipeline and represents an actual distribution result of a value of a parameter in the adaptive signal processing when performance of suppressing the component of the disturbance vibration satisfies a criterion; an estimating unit that, based on the distribution information, estimates a probability density at which the value of the parameter with which the performance satisfies the criterion exists; and a determining unit that, based on the probability density estimated by the estimating unit, determines a range to search for the value of the parameter in the adaptive signal processing.

Abstract: A fluid leakage diagnosis device includes: an identification unit for using wave measurement information expressing a wave measured in a pipe to identify a position of an origin of the wave; a detection unit for using structural information of the pipe to detect a structural factor of the wave at the position of the origin identified by the identification unit; a determination unit for determining whether a time shift in the wave measurement information satisfies a condition; and a diagnosis unit for diagnosing fluid leakage in the pipe based on a detection result from the detection unit and a determination result from the determination unit, and this fluid leakage diagnosis device enhances the accuracy of fluid leakage diagnosis for a pipe accomplished through measurement of a wave produced in the pipe.

Abstract: In order to provide an estimating device and the like capable of easily estimating the strength of a pipe, this estimating device is provided with a frequency response calculating unit, a pipe rigidity variable estimating unit, and a strength estimating unit. The frequency response calculating unit calculates a frequency response function of the pipe on the basis of excitation force data representing an excitation force when the pipe is excited, and response data obtained by measuring vibrations propagating through the pipe. The pipe rigidity variable estimating unit estimates a parameter relating to the rigidity of the pipe on the basis of a frequency response function model, which is a model representing the frequency response of the pipe, and the frequency response function. The strength estimating unit estimates the strength of the pipe on the basis of a relationship between the parameter and the strength of the pipe.

Abstract: Provided are an analyzing device and the like capable of suppressing erroneous determination. This analyzing device is provided with: a cross correlation calculating unit that obtains a cross correlation function with respect to vibrations detected at two points contained in a measurement sector of a pipeline; an estimating unit that estimates a cause of the vibrations, on the basis of the continuity of peaks in the cross correlation function; and an analyzing unit that analyzes the actual generation location of the vibrations and cause of the vibrations on the basis of an estimated generation location of the vibrations and cause of the vibrations and information relating to the configuration of a pipeline network.

Abstract: To acquire information relating to degradation of a pipe on the basis of information that can be acquired using a simple method. The analysis device according to one embodiment is provided with: a determining unit for determining whether or not the accuracy of a pipe network model based on information that includes a parameter that changes in value in accordance with degradation of a pipe satisfies a predetermined criterion; and a derivation unit for deriving information relating to degradation of the pipe, based on the parameter, if the accuracy satisfies the predetermined criterion.

Abstract: A leakage inspection device according to an aspect of the present disclosure includes: at least one memory storing a set of instructions; and at least one processor configured to execute the set of instructions to: determine a measurement time; measure vibration waveforms for the measurement time by using at least two sensors set to a pipe; calculate a cross-correlation function of the measured vibration waveforms; detect peaks of the cross-correlation function at least twice in the measurement time; and determine that leakage occurs in a case where the peaks are repeatedly detected in the measurement time.

Abstract: A vehicle includes an acquisition unit and a position determination unit. The acquisition unit is configured to acquire at least one of conditions including an order of getting out of the vehicle, a possibility of manual driving, and a combination of positions of sub-mobility devices in a vehicle compartment, and the position determination unit configured to determine the positions of the sub-mobility devices in the vehicle compartment, on a basis of a combination of the conditions.

Abstract: A system identification device 1 includes an analysis unit 105 that calculates a self-frequency response function on the basis of an input signal and an output signal measured by a measurement unit 103 at a position where a subject physical system 106 has been excited by a vibrating unit 102. The analysis unit 105 performs system identification of the subject physical system 106 by using an impulse response function obtained from the calculated self-frequency response function and an impulse response function of a virtual two-degrees-of-freedom model modeling the subject physical system 106 that is the subject of analysis. This makes it possible to perform system identification of systems with close eigenvalues.