Patents by Inventor Katsumi Midorikawa

Katsumi Midorikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11266952
    Abstract: First and second laser beams having respective first and second wavelengths respectively excite palladium isotopes at a ground level to a first excited level then to a second excited level. At first and second excitation steps, palladium isotopes having an odd mass number are selectively excited to the second excited level, with the identity of the ion core state of each of the palladium isotopes retained between the first excited level and the second excited level. The first wavelength and the second wavelength are selected to allow the second excited level to be an autoionization level or, in a case where the second excited level is not the autoionization level, the first wavelength, the second wavelength, and a third wavelength are selected to excite the palladium isotopes at the second excited level to the autoionization level with a third laser beam having the third wavelength at a third excitation step.
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: March 8, 2022
    Assignee: RIKEN
    Inventors: Tohru Kobayashi, Katsumi Midorikawa
  • Publication number: 20180290105
    Abstract: First and second laser beams having respective first and second wavelengths respectively excite palladium isotopes at a ground level to a first excited level then to a second excited level. At first and second excitation steps, palladium isotopes having an odd mass number are selectively excited to the second excited level, with the identity of the ion core state of each of the palladium isotopes retained between the first excited level and the second excited level. The first wavelength and the second wavelength are selected to allow the second excited level to be an autoionization level or, in a case where the second excited level is not the autoionization level, the first wavelength, the second wavelength, and a third wavelength are selected to excite the palladium isotopes at the second excited level to the autoionization level with a third laser beam having the third wavelength at a third excitation step.
    Type: Application
    Filed: June 14, 2018
    Publication date: October 11, 2018
    Applicant: RIKEN
    Inventors: Tohru KOBAYASHI, Katsumi MIDORIKAWA
  • Patent number: 8049138
    Abstract: An apparatus for processing a three-dimensional structure having a fine three-dimensional shape and a smooth surface is disclosed in which the three-dimensional structure is usable for an optical device. The process method includes depositing a thin layer for absorption of laser light on a flat substrate; depositing a transparent layer on the thin layer for absorption of laser light; and irradiating a process laser light, passing through the transparent layer; in which pulse injection energy of the process laser light is set to be the same as or smaller than the maximum pulse injection energy capable of exposing a surface of the thin layer in front in the incident direction of the process laser light, and to be set the same as or greater than the minimum pulse injection energy capable of removing the transparent layer in rear in the incident direction of the process laser light.
    Type: Grant
    Filed: April 27, 2004
    Date of Patent: November 1, 2011
    Assignees: Ricoh Company, Ltd., Riken
    Inventors: Yasufumi Yamada, Katsumi Midorikawa, Hiroshi Kumagai
  • Patent number: 7482052
    Abstract: A laser processing method where laser beam for processing is irradiated on a processing object and the laser beam for processing directly removes a part of the processing object. The processing object is made of a glass substrate, metal thin film having high absorption to laser beam for processing is formed on a surface of glass substrate, into which laser beam for processing is made incident, the laser beam for processing is irradiated from a surface of metal thin film, and matter is directly removed by irradiation of laser beam onto the processing object in order to form a region finer than an irradiation region of laser beam for processing on the processing object.
    Type: Grant
    Filed: July 6, 2005
    Date of Patent: January 27, 2009
    Assignees: Ricoh Company, Ltd., Riken
    Inventors: Yasufumi Yamada, Katsumi Midorikawa, Hiroshi Kumagai
  • Patent number: 7411151
    Abstract: A shape with a substantially perfect circle is obtained as a processed shape such as a modified shape or a worked shape at a light focus point in a cross-section in a direction parallel to an advance direction of a femtosecond laser light beam. A section in a direction perpendicular to an advance direction of a laser light beam emitted from a femtosecond laser (10) is formed in a predetermined shaped. The laser light of which sectional shape in the direction perpendicular to the advance direction is formed in the predetermined shape is entered into a lens (14). The light is focused by the lens inside a transparent material (100) and processes the inside of the transparent material.
    Type: Grant
    Filed: May 15, 2003
    Date of Patent: August 12, 2008
    Assignee: Riken
    Inventors: Koji Sugioka, Ya Cheng, Katsumi Midorikawa
  • Patent number: 7067198
    Abstract: Disclosed is a method for processing a three-dimensional structure having a fine three-dimensional shape and a smooth surface is disclosed in which the three-dimensional structure is usable for an optical device. The process method comprises the steps of depositing a thin layer for absorption of laser light on a flat substrate; depositing a transparent layer on the thin layer for absorption of laser light; and irradiating a process laser light, passing through the transparent layer; in which pulse injection energy of the process laser light is set to be the same as or smaller than the maximum pulse injection energy capable of exposing a surface of the thin layer in front in the incident direction of the process laser light, and to be set the same as or greater than the minimum pulse injection energy capable of removing the transparent layer in rear in the incident direction of the process laser light.
    Type: Grant
    Filed: December 30, 2003
    Date of Patent: June 27, 2006
    Assignees: Ricoh Company, Ltd., RIKEN
    Inventors: Yasufumi Yamada, Katsumi Midorikawa, Hiroshi Kumagai
  • Publication number: 20060124618
    Abstract: A shape with a substantially perfect circle is obtained as a processed shape such as a modified shape or a worked shape at a light focus point in a cross-section in a direction parallel to an advance direction of a femtosecond laser light beam. A section in a direction perpendicular to an advance direction of a laser light beam emitted from a femtosecond laser (10) is formed in a predetermined shaped. The laser light of which sectional shape in the direction perpendicular to the advance direction is formed in the predetermined shape is entered into a lens (14). The light is focused by the lens inside a transparent material (100) and processes the inside of the transparent material.
    Type: Application
    Filed: May 15, 2003
    Publication date: June 15, 2006
    Applicant: RIKEN
    Inventors: Koji Sugioka, Ya Cheng, Katsumi Midorikawa
  • Publication number: 20060091122
    Abstract: A shape with a substantially perfect sphere, or a cross-sectional shape with a substantially perfect circle in a direction parallel to an advance direction of a femtosecond laser light beam, is obtained as a processed shape such as a modified shape of a worked shape. Rays of femtosecond laser light (L1, L2) are entered into lenses (16, 20), respectively, and the rays of laser light are focused inside a transparent material (100) by the lenses such that each of the optical axes of the rays has a predetermined angle. The light focus positions of the rays of femtosecond laser light are superposed inside the transparent material and the inside of the material is processed.
    Type: Application
    Filed: May 15, 2003
    Publication date: May 4, 2006
    Applicant: HOYA CANEO OPTRONICS CORPORATION
    Inventors: Koji Sugioka, Ya Cheng, Katsumi Midorikawa, Kazuhiko Shihoyama
  • Publication number: 20050244622
    Abstract: A laser processing method where laser beam for processing is irradiated on a processing object and the laser beam for processing directly removes a part of the processing object. The processing object is made of a glass substrate, metal thin film having high absorption to laser beam for processing is formed on a surface of glass substrate, into which laser beam for processing is made incident, the laser beam for processing is irradiated from a surface of metal thin film, and matter is directly removed by irradiation of laser beam onto the processing object in order to form a region finer than an irradiation region of laser beam for processing on the processing object.
    Type: Application
    Filed: July 6, 2005
    Publication date: November 3, 2005
    Inventors: Yasufumi Yamada, Katsumi Midorikawa, Hiroshi Kumagai
  • Patent number: 6949215
    Abstract: A laser processing method capable of performing fine and highly accurate processing by low energy is obtained. The invention relates to the laser processing method where laser beam for processing (4) is irradiated on a processing object (2) and the laser beam for processing (4) directly removes a part of the processing object (2). The processing object (2) is made of a glass substrate, metal thin film (3) having high absorption to laser beam for processing (4) is formed on a surface of glass substrate, into which laser beam for processing (4) is made incident, the laser beam for processing (4) is irradiated from a surface of metal thin film (3), and matter is directly removed by irradiation of laser beam onto the processing object (2) in order to form a region finer than an irradiation region of laser beam for processing (4) on the processing object (2).
    Type: Grant
    Filed: February 21, 2003
    Date of Patent: September 27, 2005
    Assignees: Ricoh Company, Ltd., Riken
    Inventors: Yasufumi Yamada, Katsumi Midorikawa, Hiroshi Kumagai
  • Patent number: 6822221
    Abstract: A method for cooling atoms, having a plurality of magnetic sublevels, involves a laser. Specifically, multiple polarized coherent light sources of a predetermined wavelength are sequentially emitted to atoms to move the electrons of the atoms to a lower magnetic sublevels, hence cooling the atoms. The sequentially emitted laser light can be applied at predetermined time intervals, whereby it becomes possible to laser-cool a variety of atoms including semiconductor atoms, such as silicon and germanium.
    Type: Grant
    Filed: January 29, 2002
    Date of Patent: November 23, 2004
    Assignee: Riken
    Inventors: Hiroshi Kumagai, Katsumi Midorikawa
  • Publication number: 20040200818
    Abstract: A method for processing a three-dimensional structure having a fine three-dimensional shape and a smooth surface is disclosed in which the three-dimensional structure is usable for an optical device. The process method includes depositing a thin layer for absorption of laser light on a flat substrate; depositing a transparent layer on the thin layer for absorption of laser light; and irradiating a process laser light, passing through the transparent layer; in which pulse injection energy of the process laser light is set to be the same as or smaller than the maximum pulse injection energy capable of exposing a surface of the thin layer in front in the incident direction of the process laser light, and to be set the same as or greater than the minimum pulse injection energy capable of removing the transparent layer in rear in the incident direction of the process laser light.
    Type: Application
    Filed: April 27, 2004
    Publication date: October 14, 2004
    Inventors: Yasufumi Yamada, Katsumi Midorikawa, Hiroshi Kumagai
  • Patent number: 6803540
    Abstract: Disclosed is a method for processing a three-dimensional structure having a fine three-dimensional shape and a smooth surface is disclosed in which the three-dimensional structure is usable for an optical device. The process method comprises the steps of depositing a thin layer for absorption of laser light on a flat substrate; depositing a transparent layer on the thin layer for absorption of laser light; and irradiating a process laser light, passing through the transparent layer; in which pulse injection energy of the process laser light is set to be the same as or smaller than the maximum pulse injection energy capable of exposing a surface of the thin layer in front in the incident direction of the process laser light, and to be set the same as or greater than the minimum pulse injection energy capable of removing the transparent layer in rear in the incident direction of the process laser light.
    Type: Grant
    Filed: December 18, 2002
    Date of Patent: October 12, 2004
    Assignees: Ricoh Company, Ltd., Riken
    Inventors: Yasufumi Yamada, Katsumi Midorikawa, Hiroshi Kumagai
  • Publication number: 20040149705
    Abstract: Disclosed is a method for processing a three-dimensional structure having a fine three-dimensional shape and a smooth surface is disclosed in which the three-dimensional structure is usable for an optical device.
    Type: Application
    Filed: December 30, 2003
    Publication date: August 5, 2004
    Inventors: Yasufumi Yamada, Katsumi Midorikawa, Hiroshi Kumagai
  • Patent number: 6707021
    Abstract: The transparent medium processing device comprises: a light control section 2 for performing variable control for the status of the laser beam emitted from the light source section 1, and a light status measurement section 4 for measuring the status of the laser beam inside the processing target TG. The light control section is adjusted based on the output of the light status measurement section so that the status of the laser beam inside the processing target becomes a desired status. Since the status of the laser beam inside the processing target, which is made of such a transparent medium as glass, is measured by the light status measurement section, and is fed back to the light control section, laser processing can be executed while maintaining an optimum status at a processing point inside the processing target.
    Type: Grant
    Filed: March 18, 2002
    Date of Patent: March 16, 2004
    Assignee: Hamamatsu Photonics K.K.
    Inventors: Masatoshi Fujimoto, Shinichiro Aoshima, Hiroshi Kumagai, Katsumi Midorikawa
  • Publication number: 20030213770
    Abstract: A laser processing method capable of performing fine and highly accurate processing by low energy is obtained.
    Type: Application
    Filed: February 21, 2003
    Publication date: November 20, 2003
    Inventors: Yasufumi Yamada, Katsumi Midorikawa, Hiroshi Kumagai
  • Publication number: 20030152756
    Abstract: Disclosed is a method for processing a three-dimensional structure having a fine three-dimensional shape and a smooth surface is disclosed in which the three-dimensional structure is usable for an optical device.
    Type: Application
    Filed: December 18, 2002
    Publication date: August 14, 2003
    Inventors: Yasufumi Yamada, Katsumi Midorikawa, Hiroshi Kumagai
  • Publication number: 20020130245
    Abstract: The transparent medium processing device comprises: a light control section 2 for performing variable control for the status of the laser beam emitted from the light source section 1, and a light status measurement section 4 for measuring the status of the laser beam inside the processing target TG. The light control section is adjusted based on the output of the light status measurement section so that the status of the laser beam inside the processing target becomes a desired status. Since the status of the laser beam inside the processing target, which is made of such a transparent medium as glass, is measured by the light status measurement section, and is fed back to the light control section, laser processing can be executed while maintaining an optimum status at a processing point inside the processing target.
    Type: Application
    Filed: March 18, 2002
    Publication date: September 19, 2002
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Masatoshi Fujimoto, Shinichiro Aoshima, Hiroshi Kumagai, Katsumi Midorikawa
  • Publication number: 20020117612
    Abstract: A method for laser cooling of atoms for laser-cooling atoms each involving a plurality of magnetic subsidiary levels as its cooling lower level being in a ground state in energy level wherein each coherent light of a predetermined wavelength containing a plurality of different polarized light is emitted sequentially to the atoms in response to the plurality of magnetic subsidiary levels being the cooling lower level in the ground level in an atom, which is an object to be laser-cooled, while keeping a predetermined time interval, whereby it becomes possible to laser-cool a variety of atoms including semiconductor atoms such as silicon and germanium.
    Type: Application
    Filed: January 29, 2002
    Publication date: August 29, 2002
    Inventors: Hiroshi Kumagai, Katsumi Midorikawa
  • Patent number: 6432848
    Abstract: A process for the formation of a cap layer for semiconductors with a low degree of contamination wherein the cap layer is easily formed on the surface of a semiconductor, and binding force thereof with the surface of the semiconductor is strong and stabilized, besides only the cap layer is selectively removed easily, comprises the steps of introducing nitrogen atom into a surface of a semiconductor; combining a component element of the semiconductor in the vicinity of the surface of the semiconductor into which the nitrogen atom has been introduced with the nitrogen atom to form a nitride compound being a compound of the component element of the semiconductor and the nitrogen atom; and utilizing the nitride compound as a cap layer for the surface of the semiconductor.
    Type: Grant
    Filed: January 26, 2001
    Date of Patent: August 13, 2002
    Assignee: Riken
    Inventors: Toshimitsu Akane, Koji Sugioka, Katsumi Midorikawa, Jan J. Dubowski