Abstract: A spectrometer includes a support having a bottom wall part in which a depression including a concave curved inner surface and a peripheral part adjacent to the depression are provided, and a side wall part disposed on a side on which the depression is open with respect to the bottom wall part, a light detection element supported by the side wall part while opposing the depression, and a dispersive part disposed on the inner surface of the depression. A length of the depression in a second direction in which a plurality of grating grooves included in the dispersive part is aligned is larger than a length of the depression in a third direction orthogonal to the second direction when viewed in a first direction in which the depression and the light detection element oppose each other. An area of the peripheral part adjacent to the depression in the second direction is larger than an area of the peripheral part adjacent to the depression in the third direction when viewed in the first direction.

Abstract: A semiconductor device includes a semiconductor substrate in which a through hole is formed, a first wiring that is provided on a first surface of the semiconductor substrate, an insulating layer provided on an inner surface of the through hole and a second surface of the semiconductor substrate, and a second wiring that is provided on a surface of the insulating layer and electrically connected to the first wiring in an opening. The surface of the insulating layer includes a first region, a second region, a third region, a fourth region that is curved to continuously connect the first and the second regions, and a fifth region that is curved to continuously connect the second and the third regions. An average inclination angle of the second region is smaller than that of the first region and is smaller than that of the inner surface.

Abstract: A light detection device includes: a package including an opening configured to allow light to enter therefrom; a light transmitting unit arranged on an inner surface of the package so as to close the opening; a Fabry-Perot interference filter arranged in the package and configured to transmit light transmitted by the light transmitting unit; and a light detector arranged in the package and configured to detect the light transmitted by the Fabry-Perot interference filter. The light transmitting unit is integrally configured by including: a band pass filter arranged in the package and configured to transmit the light to be incident on the Fabry-Perot interference filter; and at least one lens unit configured to condense the light to be incident on the Fabry-Perot interference filter.

Abstract: A Fabry-Perot interference filter includes a fixed mirror and a movable mirror disposed opposite to the fixed mirror via a gap, distance between the fixed mirror and the movable in a light transmission region being adjusted by electrostatic force. A plurality of first annular grooves surrounding the light transmission region and a plurality of first through-holes opening to the gap side and the opposite side are formed at a surrounding portion surrounding the light transmission region in the movable mirror.

Abstract: A light detector includes: a substrate; and a membrane, in which the membrane includes a first wiring layer and a second wiring layer which are opposite each other with a gap extending along a line interposed therebetween, a resistance layer which is electrically connected to each of the first wiring layer and the second wiring layer and has an electric resistance depending on a temperature, a light absorption layer, and a separation layer which is disposed between each of the first wiring layer and the second wiring layer and the light absorption layer, and in which the light absorption layer includes a first region which spreads to the side opposite to the second wiring layer with respect to the first wiring layer and a second region which spreads to the side opposite to the first wiring layer with respect to the second wiring layer.

Abstract: A light detector includes: a substrate; and a membrane which is supported on a surface of the substrate so that a space is formed between the surface of the substrate and the membrane, in which the membrane includes a first wiring layer and a second wiring layer which are opposite each other with a gap extending along a line having a curved portion interposed therebetween and a resistance layer which is electrically connected to each of the first wiring layer and the second wiring layer and has an electric resistance depending on a temperature, and in which a first edge portion at the side of the line in the first wiring layer and a second edge portion at the side of the line in the second wiring layer respectively continuously extend.

Abstract: A spectral sensor includes a wiring substrate which has a principal surface; a light detector which is disposed on the principal surface of the wiring substrate and is electrically connected to the wiring substrate; spacer which is disposed around the light detector, on the principal surface of the wiring substrate; and a Fabry-Perot interference filter which has a light transmission region and is disposed on the principal surface of the wiring substrate with the spacer therebetween. The spacer support the Fabry-Perot interference filter in a surrounding region of the light transmission region and the spacer is arranged to form opening communicating with an inner side of the surrounding region and an outer side of the surrounding region, when viewed from a light transmission direction in the light transmission region.

Abstract: A light module includes an optical element and a base on which the optical element is mounted. The optical element has an optical portion which has an optical surface; an elastic portion which is provided around the optical portion such that an annular region is formed; and a pair of support portions which is provided such that the optical portion is sandwiched in a first direction along the optical surface and in which an elastic force is applied and a distance therebetween is able to be changed in accordance with elastic deformation of the elastic portion. The base has a main surface, and a mounting region in which an opening communicating with the main surface is provided. The support portions are inserted into the opening in a state where an elastic force of the elastic portion is applied.

Abstract: A spectrometer includes a light detection element having a substrate made of a semiconductor material, a light passing part provided in the substrate, and a light detection part put in the substrate, a support having a base wall part opposing the light detection element, and side wall parts integrally formed with the base wall part, the light detection element being fixed to the side wall parts, the support being provided with a wiring electrically connected to the light detection part, and a dispersive part provided on a surface of the base wall part on a side of a space. An end part of the wiring is connected to a terminal of die light detection element. An end part of the wiring is positioned on a surface in the base wall part on an opposite side from the side of the space.

Abstract: A SERS unit comprises an integrally formed handling board and a SERS element secured within a container space provided in the handling board so as to open to one side in a thickness direction of the handling board. The SERS element has a substrate arranged on an inner surface of the container space and an optical function part formed on the substrate, for generating surface-enhanced Raman scattering.

Abstract: Provided a semiconductor light detection element including: a semiconductor portion having a front surface including a light reception region that receives incident light and photoelectrically converting the incident light incident on the light reception region; a metal portion provided on the front surface; and a carbon nanotube film provided on the light reception region and formed by depositing a plurality of carbon nanotubes. The carbon nanotube film extends over an upper surface of the metal portion from an upper surface of the light reception region.

Abstract: A spectrometer includes a support having a bottom wall part in which a depression including a concave curved inner surface and a peripheral part adjacent to the depression are provided, and a side wall part disposed on a side on which the depression is open with respect to the bottom wall part, a light detection element supported by the side wall part while opposing the depression, and a dispersive part disposed on the inner surface of the depression. A length of the depression in a second direction in which a plurality of grating grooves included in the dispersive part is aligned is larger than a length of the depression in a third direction orthogonal to the second direction when viewed in a first direction in which the depression and the light detection element oppose each other. An area of the peripheral part adjacent to the depression in the second direction is larger than an area of the peripheral part adjacent to the depression in the third direction when viewed in the first direction.

Abstract: A spectrometer includes a light detection element having a substrate made of a semiconductor material, a light passing part provided in the substrate, and a light detection part put in the substrate, a support having a base wall part opposing the light detection element, and side wall parts integrally formed with the base wall part, the light detection element being fixed to the side wall parts, the support being provided with a wiring electrically connected to the light detection part, and a dispersive part provided on a surface of the base wall part on a side of a space. An end part of the wiring is connected to a terminal of the light detection element. An end part of the wiring is positioned on a surface in the base wall part on an opposite side from the side of the space.

Abstract: A method of manufacturing a semiconductor device includes a first process in which a first wiring 3 is provided on a first surface 2a of a semiconductor substrate 2; a second process in which a light transmitting substrate 5 is attached to the first surface 2a; a third process in which the semiconductor substrate 2 is thinned so that the thickness of the semiconductor substrate 2 is smaller than the thickness of the light transmitting substrate 5; a fourth process in which a through hole 7 is formed in the semiconductor substrate 2; a fifth process in which a dip coating method is performed using a first resin material and thus a resin insulating layer 10 is provided; a sixth process in which a contact hole 16 is formed in the resin insulating layer 10; and a seventh process in which a second wiring 8 is provided on a surface 10b of the resin insulating layer 10, and the first wiring 3 and the second wiring 8 are electrically connected via a contact hole 16.

Abstract: A surface-enhanced Raman scattering element comprises a substrate having a principal surface; a molded layer having a support part formed on the principal surface of the substrate so as to extend along the principal surface and a fine structure part formed on the support part; a frame part formed on the principal surface of the substrate so as to surround the support part and fine structure part along the principal surface; and a conductor layer formed on at least the fine structure part and constituting an optical functional part for generating surface-enhanced Raman scattering; while the fine structure part are formed integrally with the support part.

Abstract: A spectrometer includes a support having a bottom wall part in which a depression is provided and a side wall part, a light detection element supported by the side wall part while opposing the depression, a resin layer disposed at least on an inner surface of the depression, and a dispersive part provided in the resin layer on the inner surface of the depression. The resin layer is in contact with an inner surface of the side wall part. A thickness of the resin layer in a first direction in which the depression and the light detection element oppose each other is larger in a part in contact with the inner surface of the side wall part than in a part disposed on the inner surface of the depression.

Abstract: A method includes a first process in which a first wiring is provided on a surface of a semiconductor substrate; a second process in which a light transmitting substrate is attached to the surface; a third process in which the semiconductor substrate is thinned so that the thickness of the semiconductor substrate is smaller than the thickness of the light transmitting substrate; a fourth process in which a through hole is formed in the semiconductor substrate; a fifth process in which a dip coating method is performed using a resin material and thus a resin insulating layer is provided; a sixth process in which a contact hole is formed in the resin insulating layer; and a seventh process in which a second wiring is provided on a surface of the resin insulating layer, and the first wiring and the second wiring are electrically connected via a contact hole.

Abstract: An SERS element includes a substrate, a fine structure portion formed on a surface of the substrate and having a plurality of pillars, and a conductor layer formed on the fine structure portion and constituting an optical functional portion that causes surface-enhanced Raman scattering. A groove is provided in an outer surface of each pillar. A plurality of gaps are formed in the conductor layer by forming the conductor layer on the outer surface of each pillar in a state in which at least a portion of an inner surface of the groove is exposed.