Abstract: A cover member includes a transparent substrate, a lamination, and a stain resistant coating. The lamination is disposed on at least a part of a surface of the substrate. The lamination serves as an antireflection coating that has a layer made of silicon nitride and a layer made of silicon oxide. The content of silicon nitride in the region to a depth of 150 nm from the outside surface of the lamination is 30-50 vol %. The stain resistant coating is made of a fluorinated organosilicon compound. The stain resistant coating is disposed on a surface of the lamination. The cover member is provided to a mechanical timepiece.

Abstract: A film forming apparatus according to an embodiment includes: a film forming chamber configured to house therein a substrate to perform film forming processing; a gas supplier located in an upper part of the film forming chamber and configured to supply a process gas onto the substrate; and a heater configured to heat the substrate, wherein the film forming chamber has a temperature-increase suppression region being a lower part of the gas supplier and suppressing a temperature increase of the gas supplied to an upper part of the heater.

Abstract: A film forming apparatus according to an embodiment includes: a film forming chamber capable of housing a substrate therein; a gas supplier located in an upper part of the film forming chamber and having a plurality of nozzles supplying gases onto a film forming face of the substrate; a heater configured to heat the substrate; and a first protection cover having a plurality of opening parts at positions corresponding to the nozzles of the gas supplier, respectively.

Abstract: The present invention relates to a light diffusion plate including a glass plate having a first main surface and a second main surface opposed to the first main surface, in which the glass plate has a thermal expansion coefficient of ?100×10?7/° C. or more and 500×10?7/° C. or less, and light incident on the first main surface is transmitted from the second main surface while being diffused.

Abstract: A glass includes a first surface; and a second surface that is opposite to the first surface, wherein an absorption coefficient of the glass at light of wavelength 550 nm is less than or equal to 1 m?1, and a ratio (?max /?min) of a maximum value ?max (m?1) to a minimum value ?min (m?1) of absorption coefficients of the glass at light within a range of wavelengths from 400 nm to 700 nm is less than or equal to 10, and wherein a two-dimensional arithmetical mean height of a selectable area of 1790 ?m×1330 ?m of the first surface is less than or equal to 1 nm.

Abstract: There are provided a row of external permanent magnets and a row of internal permanent magnets; a floating output ring is provided on which is wound a 3-phase coil, between these rows. The floating output ring has no mechanical restraining relationship with any other member in the linear motor). Instead, a controller that controls a PWM inverter that injects AC exciting current into the 3-phase coil brings the central axes of the double cylinder and the floating output ring into coincidence by generating supporting force with respect to the floating output ring by magnetism, by controlling the d axis current component of the exciting current.

Abstract: A light transmissive member includes a substrate having a light transmission property, wherein on one surface of the substrate, an antireflection layer in which a low-refractive index layer composed mainly of silicon oxide (SiO2) and a high-refractive index layer composed mainly of silicon nitride (SiN) are alternately stacked is formed, and on the other surface of the substrate, an antistatic layer including at least a transparent electrically conductive film layer is formed.

Abstract: The invention provides a contact probe and a semiconductor element socket provided with the same, the contact probe capable of smooth inspection of a device while securing good conductivity. A contact probe has an upper plunger having a contact stem portion, a lower plunger having an insertion hole with which the contact stem portion is capable of coming into contact, and a coil spring connected to the upper plunger and the lower plunger in such a way as to cover the contact stem portion. The coil spring is configured by helically winding a wiring, and includes a guide portion wound tight in the axial direction of the coil spring by the wire, the guide portion located on the lower plunger side of the coil spring and also includes the upper plunger side portion than an upper end portion of the insertion hole.

Abstract: A method of manufacturing a semiconductor device includes: forming a first trench in a first area of a drift layer that has a surface including the first area and a second area; growing a crystal of a p-type base layer on a surface of the drift layer after forming the first trench; and growing a crystal of an n-type source layer on a surface of the base layer. Material of the drift layer, the base layer, and the source layer are a wide-gap semiconductor.

Abstract: An optical component includes a base material and a film containing silica particles and conductive transparent metal oxide particles. The conductive transparent metal oxide particles are preferably composed of SnO2. The number-based average particle diameter of the conductive transparent metal oxide particles is preferably 0.8 nm or more and 5.0 nm or less. When the content of the silica particles in the film is represented by Xs (vol %) and the content of the conductive transparent metal oxide particles in the film is represented by Xc (vol %), it is preferred to satisfy the following relationship: 0.003?Xc/Xs?0.12.

Abstract: An inspection probe 16Ai is formed by subjecting a thin sheet material made of a copper alloy to press working. The inspection probe 16Ai includes: a device side plunger 16A having a contact point which selectively comes into contact with an electrode portion DVb of a semiconductor device DV; a board side plunger 16B having a contact point which selectively comes into contact with a contact pad of a printed wiring board 18; a spring portion 16D which biases the device side plunger 16A and the board side plunger 16B in a direction away from each other; and a cylindrical support stem 16C being disposed inside the spring portion 16D, making the spring portion 16D slidable thereon, and being configured to retain straight advancing property of the spring portion 16D.

Abstract: An optical component includes a base material and an antireflection film containing silica particles, wherein the porosity of the antireflection film is 15% by volume or more and 36% by volume or less. The number-based average particle diameter of the silica particles is preferably 0.5 nm or more and 4.0 nm or less. The antireflection film is preferably formed by using a composition containing the silica particles and a dispersion medium for dispersing the silica particles. The thickness of the antireflection film is preferably 50 nm or more and 120 nm or less.

Abstract: A resurf layer and a guard ring are formed in a peripheral region in a position at the surface of the semiconductor substrate. The guard ring is formed more deeply than the resurf layer. When the guard ring is shallow and the impurity concentration of the resurf layer is low, the potential distribution at the deep portion of the resurf layer becomes unstable, and the resurf layer does not sufficiently exhibit the effect of improving the withstand voltage. When the guard ring is deep, the impurity concentration of the guard ring is high, the potential distribution at the deep portion of the resurf layer is regulated by the guard ring and the resurf layer sufficiently exhibits the effect of improving the withstand voltage.

Abstract: In a method for manufacturing a semiconductor device, when a second conductive type impurity layer is formed to provide a deep layer having a second conductive type in a first concavity and to provide a channel layer having the second conductive type on a surface of a drift layer, an epitaxial growth is performed under a growth condition that a contact trench provided by a recess is formed on a surface of a part of the second conductive type impurity layer corresponding to a center position of the first concavity, and a contact region is formed by ion-implanting a second conductive type impurity on a bottom of the contact trench.

Abstract: The present invention provides a crosslinked foam having an excellent balance of various physical properties in terms of lightness, flexibility, permanent compression set, tear strength, impact resilience, and molding stability; a shoe midsole; and a crosslinkable and foamable composition that provides the crosslinked foam and shoe midsole. A crosslinkable and foamable composition comprising (A) an ethylene-based copolymer; (B) a copolymer comprising a vinyl aromatic monomer unit and an unsaturated bond-containing a conjugated diene monomer unit; (C) an organic peroxide; and (D) a foaming agent; a mass ratio of the component (A) to the component (B), (A/B), being from 97/3 to 50/50; and the component (B) comprising 5 mass % or more and 80 mass % or less of the vinyl aromatic monomer unit, and 5 mass % or more and 55 mass % or less of the conjugated diene monomer unit.

Abstract: A cover glass for a pen input device has a haze value of less than 1%, and a Martens hardness within a range from 2000 N/mm2 to 4000 N/mm2. When a moving member receiving a load of 150 gf (1.47 N) is moved in one direction, at 10 mm/sec, at room temperature, on the surface of the cover glass, a coefficient of kinetic friction ?k of a kinetic frictional force Fk (N) exerted by the cover glass surface within a region where an approximately linear relationship is established between the kinetic frictional force Fk (N) and the time is 0.14˜0.50, and a standard deviation ? (N) of the kinetic frictional force Fk (N) is no more than 0.03. The moving member is a pen that includes a pen tip made of polyacetal resin with a Rockwell hardness of M90 and having a radius of curvature of 700 ?m.

Abstract: A crosslinked composition is obtained by crosslinking a composition, containing: 1 to 99 parts by mass of a vinyl aromatic copolymer rubber (I) comprising 5 to 70% by mass of a vinyl aromatic monomer unit and 0.1 to 30% by mass of a conjugated diene monomer unit and having one or more tan ? peak temperatures between 75° C. and 125° C.; 99 to 1 parts by mass of an ethylenic copolymer rubber (II); 10 to 100 parts by mass of an olefinic resin (III) based on 100 parts by mass of a total amount of the vinyl aromatic copolymer rubber (I) and the ethylenic copolymer rubber (II); and 0.01 to 50 parts by mass of a crosslinking agent (IV) based on 100 parts by mass of the total amount of the vinyl aromatic copolymer rubber (I) and the ethylenic copolymer rubber (II).

Abstract: An optical component includes a base material and an antireflection film containing silica particles, wherein the silica particles have a first local maximum in the range of 1.5 nm or more and 2.5 nm or less (a first range), a second local maximum in the range of 3.5 nm or more and 4.5 nm or less (a second range), and a third local maximum in the range of 7.5 nm or more and 8.5 nm or less (a third range) in a number-based particle size distribution. It is preferred that the silica particles have a fourth local maximum in the range of 5.5 nm or more and 6.5 nm or less in the number-based particle size distribution.

Abstract: An optical component includes a base material and a film containing silica particles and conductive transparent metal oxide particles. The conductive transparent metal oxide particles are preferably composed of SnO2. The number-based average particle diameter of the conductive transparent metal oxide particles is preferably 0.8 nm or more and 5.0 nm or less. When the content of the silica particles in the film is represented by Xs (vol %) and the content of the conductive transparent metal oxide particles in the film is represented by Xc (vol %), it is preferred to satisfy the following relationship: 0.003?Xc/Xs?0.12.

Abstract: An optical component includes a base material and an antireflection film containing silica particles, wherein the porosity of the antireflection film is 15% by volume or more and 36% by volume or less. The number-based average particle diameter of the silica particles is preferably 0.5 nm or more and 4.0 nm or less. The antireflection film is preferably formed by using a composition containing the silica particles and a dispersion medium for dispersing the silica particles. The thickness of the antireflection film is preferably 50 nm or more and 120 nm or less.