Abstract: An entry/exit management system includes a reader at an entry gate for reading personal information of a user, a storage recording the read personal information, a database in which personal information for authentication is recorded in advance, and an authenticator for authenticating the recorded personal information by collation with the personal information for authentication recorded in the database. The entry/exit management system has a first operation mode in which the reader reads the personal information of the user to allow the entry gate to permit the entry of the user having the read personal information. In the first operation mode, after permitting the entry of the user, the authenticator authenticates the personal information recorded in the storage and does not give permission for exit of the user until the personal information recorded in the storage is successfully authenticated.

Abstract: An electronic device includes a high-frequency transmission line member and a housing. The high-frequency transmission line member includes a flexible substrate, a signal conductor, and a ground conductor along the signal conductor. The housing is defined by a member separate from the high-frequency transmission line member and located at one principal surface side of the high-frequency transmission line member. The high-frequency transmission line member includes a first portion along the housing to face the housing, and a second portion spaced apart from the housing more than the first portion. The ground conductor is not provided at one principal surface side of the signal conductor in the first portion and is provided at least in the second portion.

Abstract: The semiconductor device includes a first conductive layer, semiconductor elements bonded to the upper surface of the first conductive layer, a second conductive layer separated from the first conductive layer, a control terminal bonded to the second conductive layer, a control resistor bonded to the upper surface of the second conductive layer, a control-resistor pin bonded to the upper surface of the control resistor and a wiring board having a control-wiring layer for electrically connecting the semiconductor elements and the control-resistor pin.

Abstract: A wireless module includes a substrate that includes a first portion, a second portion, and a first flexible portion connecting the first portion and the second portion to each other. The first portion includes a circuit element that is mounted on the first main surface and a circuit including at least the circuit element. The second portion includes a first coil connected to the circuit. The first portion and the second portion face each other. A magnetic sheet is disposed on a second main surface of the second portion, and a battery is disposed between the second main surface of the first portion and the magnetic layer.

Abstract: To realize an insulating busbar that has both low inductance and high withstand voltage, provided is an insulating busbar that connects to a module on which is mounted a semiconductor chip, including a plurality of circuit conductors; a plurality of connection terminals that respectively electrically connect the circuit conductors to the module; and an insulating resin portion that is formed integrally between each of the circuit conductors and at least a portion of a region around each connection terminal and does not have any gaps between the circuit semiconductors.

Abstract: A semiconductor device encompasses a cooler made of ceramics, having a first main face and a second main face, being parallel and opposite to the first main face, defined by two opposite side faces perpendicular to the first and second main faces, a plurality of conductive-pattern layers delineated on the first main face, a semiconductor chip mounted on the first main face via one of the plurality of conductive-pattern layers, and a seal member configured to seal the semiconductor chip.

Abstract: A semiconductor device including semiconductor units 20A to 20C that each include semiconductor elements 12 and 13, a unit case 11 sealing the semiconductor elements, and a first unit terminal 16 exposed inside a first recessed portion 11a provided in a top surface of the unit case; a first unit connection portion 40a including, in correspondence with each of the semiconductor units, a first connection terminal 43S connected to the first unit terminal, a first connection conductor 43S0 connected between a plurality of the first connection terminals, and a first connection conductor sealing portion 40a0 sealing the first connection conductor while exposing the first connection terminals; and first recessed sealing portions 45a that each, in correspondence with each of the semiconductor units, seal each connection portion between the first unit terminal and the first connection terminal inside a recess of the first recessed portion.

Abstract: An antenna device that includes a planar conductor with a first side and a second side. The antenna device includes multiple coil antennas that each includes a coil conductor wound around a winding axis that extends in a direction of the planar conductor. Moreover, two or more of the coil antennas have respective coil openings positioned adjacent to the first side of the planar conductor.

Abstract: A semiconductor device including semiconductor units 20A to 20C that each include semiconductor elements 12 and 13, a unit case 11 sealing the semiconductor elements, and a first unit terminal 16 exposed inside a first recessed portion 11a provided in a top surface of the unit case; a first unit connection portion 40a including, in correspondence with each of the semiconductor units, a first connection terminal 43S connected to the first unit terminal, a first connection conductor 43S0 connected between a plurality of the first connection terminals, and a first connection conductor sealing portion 40a0 sealing the first connection conductor while exposing the first connection terminals; and first recessed sealing portions 45a that each, in correspondence with each of the semiconductor units, seal each connection portion between the first unit terminal and the first connection terminal inside a recess of the first recessed portion.

Abstract: An antenna device that includes a coil antenna with a coil conductor wound around a winding axis. The device further includes a planar conductor with a surface and an edge end portion, where the surface extends in the direction of the winding axis and the edge end portion is adjacent to a coil opening of the coil conductor. A booster antenna is also provided and includes a looped or spiral coil conductor and is coupled to the planar conductor and/or the coil antenna.

Abstract: In antenna device, a coil conductor of an antenna coil module and a conductor layer at least partially overlap. A current flows in the conductor layer to block a magnetic field generated by a current flowing in the coil conductor. A current flows along the periphery of a slit and around the periphery of the conductor layer due to a cut-edge effect. Since magnetic flux does not pass through the conductor layer, magnetic flux attempts to bypass the conductor layer along a path in which the conductor opening of the conductor layer is on the inside and the outer edge of the conductor layer is on the outside. As a result, the magnetic flux generates large loops that link the inside and the outside of a coil conductor of an antenna on a reader/writer side to couple an antenna device and the antenna on the reader/writer side.

Abstract: In antenna device, a coil conductor of an antenna coil module and a conductor layer at least partially overlap. A current flows in the conductor layer to block a magnetic field generated by a current flowing in the coil conductor. A current flows along the periphery of a slit and around the periphery of the conductor layer due to a cut-edge effect. Since magnetic flux does not pass through the conductor layer, magnetic flux attempts to bypass the conductor layer along a path in which the conductor opening of the conductor layer is on the inside and the outer edge of the conductor layer is on the outside. As a result, the magnetic flux generates large loops that link the inside and the outside of a coil conductor of an antenna on a reader/writer side to couple an antenna device and the antenna on the reader/writer side.

Abstract: An antenna device that includes a coil antenna with a coil conductor wound around a winding axis. The device further includes a planar conductor with a surface and an edge end portion, where the surface extends in the direction of the winding axis and the edge end portion is adjacent to a coil opening of the coil conductor. A booster antenna is also provided and includes a looped or spiral coil conductor and is coupled to the planar conductor and/or the coil antenna.

Abstract: An electronic apparatus includes an antenna device, a circuit board, and a housing containing the antenna device and the circuit board. The inner surface of the housing is spaced apart from the circuit board. The antenna device includes an antenna unit, a matching circuit unit connected to the antenna unit, a transmission line unit connected to the matching circuit unit, and a connecting portion included in the transmission line unit. The antenna device is disposed along the inner surface of the housing. The connecting portion is connected to a circuit of the circuit board. The antenna device includes a ground connection portion in the matching circuit unit in a region where the antenna device is disposed along the inner surface of the housing. The ground connection portion electrically connects a second ground conductor of the antenna device to a first ground conductor on the housing.

Abstract: A semiconductor device has a configuration in which a stacked assembly and a resin case are combined. The stacked assembly includes a semiconductor element, a stacked substrate on which the semiconductor element is mounted, and a metal substrate on which the stacked substrate is mounted. In the resin case, a notch groove is provided at a corner portion for reducing a stress. At least one of a width and a length of the notch groove is 2 mm or more.

Abstract: A manufacturing method for a magnetic recording medium which includes a magnetic layer, a lower protective layer, an upper protective layer and a lubricating layer on a substrate, and in which the total film thickness of the lower protective layer and the upper protective layer is 2.5 nm or less, includes: 1) depositing the lower protective layer; 2) performing oxygen plasma treatment on the lower protective layer; 3) depositing the upper protective layer; and 4) performing nitrogen plasma treatment on the upper protective layer. It is preferable that the lower protective layer and the upper protective layer are formed of a carbon-based material, and it is further more preferable that the lower protective layer and the upper protective layer are formed of diamond-like carbon. Moreover, it is preferable that the contact angle of the lower protective layer with respect to water in the atmosphere is 25° or less.

Abstract: In an antenna module, a main portion includes a plurality of insulating sheets made of a flexible material and laminated on each other. An antenna configured to transmit/receive a high-frequency signal is disposed in the main portion. A connection portion is disposed in the main portion and is connected to an electronic device that inputs/outputs the high-frequency signal. A signal transmission line is disposed in the main portion and has a strip line structure or a microstrip line structure to transmit the high-frequency signal. An impedance matching circuit is disposed in the main portion and between the antenna and end of a signal transmission line facing in a negative x direction. An impedance matching circuit is disposed in the main portion and between the connection portion and an end of the signal transmission line facing in a positive x direction.

Abstract: An electronic device includes a high-frequency transmission line member and a housing. The high-frequency transmission line member includes a flexible substrate, a signal conductor, and a ground conductor along the signal conductor. The housing is defined by a member separate from the high-frequency transmission line member and located at one principal surface side of the high-frequency transmission line member. The high-frequency transmission line member includes a first portion along the housing to face the housing, and a second portion spaced apart from the housing more than the first portion. The ground conductor is not provided at one principal surface side of the signal conductor in the first portion and is provided at least in the second portion.

Abstract: In antenna device, a coil conductor of an antenna coil module and a conductor layer at least partially overlap. A current flows in the conductor layer to block a magnetic field generated by a current flowing in the coil conductor. A current flows along the periphery of a slit and around the periphery of the conductor layer due to a cut-edge effect. Since magnetic flux does not pass through the conductor layer, magnetic flux attempts to bypass the conductor layer along a path in which the conductor opening of the conductor layer is on the inside and the outer edge of the conductor layer is on the outside. As a result, the magnetic flux generates large loops that link the inside and the outside of a coil conductor of an antenna on a reader/writer side to couple an antenna device and the antenna on the reader/writer side.

Abstract: In antenna device, a coil conductor of an antenna coil module and a conductor layer at least partially overlap. A current flows in the conductor layer to block a magnetic field generated by a current flowing in the coil conductor. A current flows along the periphery of a slit and around the periphery of the conductor layer due to a cut-edge effect. Since magnetic flux does not pass through the conductor layer, magnetic flux attempts to bypass the conductor layer along a path in which the conductor opening of the conductor layer is on the inside and the outer edge of the conductor layer is on the outside. As a result, the magnetic flux generates large loops that link the inside and the outside of a coil conductor of an antenna on a reader/writer side to couple an antenna device and the antenna on the reader/writer side.