Abstract: A three-dimensional mounting method for successively laminating N number of upper-layer joining materials includes positioning a first upper-layer joining material relative to a lowermost-layer joining material by recognizing an alignment position of the lowermost-layer joining material and a lower face alignment position of the first upper-layer joining material by a two-field image recognition unit, storing positional coordinates of the alignment position of the lowermost-layer joining material, positioning an (n+1)-th upper-layer joining material relative to an n-th upper-layer joining material by recognizing an upper face alignment position of the n-th upper-layer joining material and a lower face alignment position of the (n+1)-th upper-layer joining material, storing positional coordinates of the upper face alignment position of the n-th upper-layer joining material, recognizing an upper face alignment position of the N-th uppermost-layer joining material, and storing positional coordinates of the upper

Abstract: A projection display device includes an optical modulation element configured to modulate light outputting from a light source, and a projection unit configured to project light modulated by the optical modulation element on a projection screen. The projection display device includes an element control unit that controls the optical modulation element to display a test pattern image, an acquiring unit that acquires an image obtained by capturing the test pattern image from an image capture element that captures the test pattern image projected on the projection screen, and an adjusting unit that adjusts an image projected on the projection screen on the basis of the capture image acquired by the acquiring unit. The element control unit controls the optical modulation element such that a guidance image that guides focus adjustment of the image projected on the projection screen is displayed.

Abstract: A projection display device includes an optical modulation element configured to modulate light outputting from a light source, and a projection unit configured to project light modulated by the optical modulation element on a projection screen. The projection display device includes an element control unit that controls the optical modulation element to display a test pattern image, an acquiring unit that acquires an image obtained by capturing the test pattern image from an image capture element that captures the test pattern image projected on the projection screen, and an adjusting unit that adjusts an image projected on the projection screen on the basis of the capture image acquired by the acquiring unit. The element control unit controls the optical modulation element such that a guidance image that guides focus adjustment of the image projected on the projection screen is displayed.

Abstract: Provided is a mounting apparatus which mounts a chip component on a circuit pattern on a circuit board having a plurality of circuit patterns formed thereon. The mounting apparatus is provided with a plurality of bonding tools each of which mounts the chip component on each of the circuit patterns on the circuit board. Each bonding tool is provided with, within a region on the circuit board where the chip component is to be mounted, an exclusive mounting region where only each bonding tool can mount the chip component, and a common mounting region where both the bonding tool and the adjacent bonding tool can mount the chip component. A mounting method is also provided. The mounting tact time of the chip components can be shortened even in case where a plurality of circuit patterns are formed on the circuit board and a failure circuit pattern is included among the circuit patterns which have been formed.

Abstract: The object of the present invention is to prevent the adhesion of paint to the jig which supports an article to be coated, and to attain the object, the present invention provides a masking member made of a polymer alloy consisting of 20 to 80% by weight of polyphenylene ether and 80 to 20% by weight of polyamide, or a polymer alloy consisting of 100 parts by weight of a polymer mixture into which polyphenylene ether and polyamide are mixed in a weight ratio of between 20:80 and 80:20, and 0 to 50 parts by weight of a styrene group resin and 0 to 50 parts by weight of styrene group elastomer, the article 31 being supported by the jig, and spray coated.

Abstract: The object of the present invention is to provide a door seal member which is easily fitted into the door of a car. A door seal member 13 is fitted between the door panel 11 and the door trim board 12, wherein the door seal member 13 is manufactured by the vacuum and/or pressure forming or cold working of a foamed sheet, the door seal member 13 being molded into a cubic shape corresponding to that of the door trim board 12.

Abstract: A dispensing device (4) for charging underfill agent into a gap between a substrate (K) and a chip (C) includes means for storing underfill agent (66, 67), a chamber (52) provided for containing substrate (K) to be charged with underfill agent and capable of being opened/closed, a dispenser (73) provided in the chamber (52) and discharging underfill agent introduced from the storing means (66, 67) into the gap between the substrate (K) and the chip (C), and a first pressure reducing means (46) for reducing the pressure in the chamber (52) at a predetermined vacuum pressure prior to the discharge of underfill agent by the dispenser (73). The dispensing device (4) can supply underfill agent with no bubbles to the substrate (K). A mounting system using this dispensing device (4) is also provided by the invention.

Abstract: The object of the present invention is to protect a member from damage when a part is fit to the member. To attain the object, in the present invention, a protector 8 consisting of a hole inner side protective section 9, to protect the inside of the part fitting hole 2 of the member, and a surrounding protective section 10, to protect the surroundings of the part fitting hole, is provided, the two sections 9, 10 integrally making up the protector 8. The protector 8 is fit into the part fitting hole 2, following which a part 12 is fit thereinto.

Abstract: A chip mounting apparatus is provided with a drive control means. The drive control means is provided with a tool holder whereupon a tool for applying pressure to a chip is mounted, a holder supporting means for supporting the tool holder to be vertically moved, a drive means for vertically moving the holder supporting means, and a position detecting means for detecting a relative position of the tool holder to the holder supporting means. The drive control means controls the height and the pressurizing force of the tool, based on the position of the tool holder when the tool and the chip are one over another and brought into contact with a substrate. A chip mounting method is also provided. Short-circuit failures between adjacent solder bumps can be prevented and chips can be mounted with high yield and reliability.

Abstract: A mounting system is provided with a substrate loader section, a chip mounting section, and a substrate unloader section for sequentially taking out substrates whereupon chips are mounted. The mounting system is characterized in that the substrate loader section is provided with an oven capable of heat insulating a substrate together with a substrate magazine capable of containing a plurality of substrates, a stage heater for heating/heat insulating a substrate is provided, respectively, at a substrate conveying portion from a substrate waiting stage for the chip mounting section to the chip mounting section, at the chip mounting section, and at a substrate conveying portion from the chip mounting section to the substrate unloader section, and the substrate unloader section is provided with an oven capable of heat insulating a substrate together with a substrate magazine capable of containing a plurality of substrates whereupon chips are mounted.

Abstract: The object of the present invention is to attach a part firmly to a component. A part attaching seat 7 of the component to which the part is to be attached, and a plural number of stud bolts 4,4 are covered with a masking member 9. The masking member 9 consists of a panel shaped seat covering part 10 and a bolt covering part 11, and the seat covering part 10 covers the part attaching seat 7 and the bolt covering part 11 covers the stud bolts 4,4 to protect the part attaching seat 7 and the stud bolts 4,4 from coating.

Abstract: A light source comprises a lamp such as an ultra-high pressure mercury lamp or a metal halide lamp and its irradiated light is emitted after being parallelized by a parabolic reflector. The parabolic reflector is made by pressing metal such as stainless and its light exit side aperture is covered with a transparent plate made of glass, etc. The transparent plate prevents fragments of glass of the lamp and the like from scattering when the lamp bursts. The parabolic reflector does not have an aperture (cut-out) for ventilation, but heat radiation fins are formed on the outer surface of it.

Abstract: A mounting system is provided with a substrate loader section, a chip mounting section, and a substrate unloader section for sequentially taking out substrates whereupon chips are mounted. The mounting system is characterized in that the substrate loader section is provided with an oven capable of heat insulating a substrate together with a substrate magazine capable of containing a plurality of substrates, a stage heater for heating/heat insulating a substrate is provided, respectively, at a substrate conveying portion from a substrate waiting stage for the chip mounting section to the chip mounting section, at the chip mounting section, and at a substrate conveying portion from the chip mounting section to the substrate unloader section, and the substrate unloader section is provided with an oven capable of heat insulating a substrate together with a substrate magazine capable of containing a plurality of substrates whereupon chips are mounted.

Abstract: A mounting method includes the steps of, after positioning objects being bonded relative to each other, moving a movable wall positioned there around until coming into contact with one object holding means to form a local chamber having a local enclosed space, enclosing both objects in the chamber, reducing the pressure in the chamber, moving the object holding means in a direction for reducing the volume of the chamber and moving the movable wall following the movement of the object holding means, and bonding both objects to each other by pressing. Since the bonding part and the vicinity of the bonding part can be locally and efficiently enclosed from the surroundings, and the local chamber can vary the shape of the enclosed space with the bonding operation while maintaining the enclosed state even at the time of bonding.

Abstract: A dispensing device (4) for charging underfill agent into a gap between a substrate (K) and a chip (C) includes means for storing underfill agent (66, 67), a chamber (52) provided for containing substrate (K) to be charged with underfill agent and capable of being opened/closed, a dispenser (73) provided in the chamber (52) and discharging underfill agent introduced from the storing means (66, 67) into the gap between the substrate (K) and the chip (C), and a first pressure reducing means (46) for reducing the pressure in the chamber (52) at a predetermined vacuum pressure prior to the discharge of underfill agent by the dispenser (73). The dispensing device (4) can supply underfill agent with no bubbles to the substrate (K). A mounting system using this dispensing device (4) is also provided by the invention.

Abstract: A video signal processing circuit inputs a video signal to perform processing such as frequency conversion as well as processing for generating data representing the APL (Average Picture Level) of a frame video for each frame period. A microcomputer functions as a dimmer arithmetic block to perform processing for generating dimmer data upon receipt of APL data, and functions as a lamp driver control block to perform processing for sending out a dimmer command to a lamp driver. The lamp driver receives the dimmer command, to control an amount of light emitted from a light source (a lamp).

Abstract: A mounting method and a mounting device, the mounting method comprising the steps of, after positioning objects being bonded relative to each other, moving a movable wall positioned therearound until coming into contact with one object holding means to form a local chamber having a local enclosed space, enclosing both objects in the chamber, reducing the pressure in the chamber, moving the object holding means in a direction for reducing the volume of the chamber and moving the movable wall following the movement of the object holding means, and bonding both objects to each other by pressing, whereby, since the part to be bonded and its vicinity can be locally and efficiently enclosed separably from surroundings, and the local chamber capable of properly varying the shape of the enclosed space can be formed interlockingly with the bonding operation while maintaining the enclosed state even at the time of bonding, a specified mounting can be easily performed by a small device.

Abstract: A mounting device including a plurality of heads, each holding a chip, arranged on a circle, is used to realize accurate and high-speed mounting. A mounting device comprises a plurality of heads with calibration marks, first recognition mechanism fixed in a chip mounting position, and second recognition mechanism fixed in another position. Prior to mounting operation, the first recognition mechanism and the second recognition mechanism recognize and store the positions of the calibration marks of the heads. In mounting operation, the first recognition mechanism recognizes the positions of a substrate and the calibration marks of the heads, whereas the second recognition mechanism recognizes the positions of chips attracted on the heads. The heads are moved vertically to adjust plane to be recognized. The chip and the substrate are aligned according to the position information obtained by the recognition mechanisms, and the chips are mounted.

Abstract: A light source comprises a lamp such as an ultra-high pressure mercury lamp or a metal halide lamp and its irradiated light is emitted after being parallelized by a parabolic reflector. The parabolic reflector is made by pressing metal such as stainless and its light exit side aperture is covered with a transparent plate made of glass, etc. The transparent plate prevents fragments of glass of the lamp and the like from scattering when the lamp bursts. The parabolic reflector does not have an aperture (cut-out) for ventilation, but heat radiation fins are formed on the outer surface of it.

Abstract: A video signal processing circuit inputs a video signal to perform processing such as frequency conversion as well as processing for generating data representing the APL (Average Picture Level) of a frame video for each frame period. A microcomputer functions as a dimmer arithmetic block to perform processing for generating dimmer data upon receipt of APL data, and functions as a lamp driver control block to perform processing for sending out a dimmer command to a lamp driver. The lamp driver receives the dimmer command, to control an amount of light emitted from a light source (a lamp).