Patents by Inventor Katsumi Watanabe
Katsumi Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20040220293Abstract: The present invention provides a fluororubber molded article obtained by a process comprising subjecting a fluororubber composition to crosslinking by irradiation of ionizing radiation, wherein the fluororubber composition comprises: (i) a raw rubber which comprises a tetrafluoroethylene-propylene copolymer and which has a metal element content of 1.5% by weight or less; and (ii) silica which has a primary particle size of 0.5 &mgr;m or less and which has been treated to have a hydrophobic surface. Also disclosed is a method for producing the fluororubber molded article.Type: ApplicationFiled: March 23, 2004Publication date: November 4, 2004Applicant: Nichias CorporationInventors: Naoya Kuzawa, Katsumi Watanabe, Mitsuyuki Nakano
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Publication number: 20040194884Abstract: A compact high-pressure process apparatus is provided, which ensures an easy loading of a material to be process to a process chamber, as well as a high reliable operation and a high productivity. For this purpose, an opening 9 is disposed in a pressure vessel 7 including a process chamber 4, and a lid member 10 for closing the opening 9 may be pressed there against by means of a press apparatus 15. In this case, a moving mechanism for moving the lid member 10 relative to the opening 9 in the direction parallel to a contact surface of the lid menber 10 and the pressure vessel 7 is further provided.Type: ApplicationFiled: April 27, 2004Publication date: October 7, 2004Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd)Inventors: Yoshihiko Sakashita, Katsumi Watanabe, Yoichi Inoue, Hideshi Yamane
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Publication number: 20040194842Abstract: A high-pressure processing apparatus includes a processing vessel including a processing chamber formed therein to perform a certain process onto an object in the processing chamber; fluid feeding means which feeds a high-pressure fluid into the processing chamber; fluid discharging means which discharges the high-pressure fluid from the processing chamber; an agitating unit which is arranged in the processing chamber and is operative to flow the high-pressure fluid over the object by relative rotation to the processing vessel; a communicating channel which is formed in the processing vessel to communicate inside and outside of the processing chamber; a rotary driving member which is coupled to the agitating unit via a shaft portion provided in the communicating channel; and a sealing portion which is provided between the shaft portion: and the processing vessel to disconnect the processing chamber from the rotary driving member.Type: ApplicationFiled: April 19, 2004Publication date: October 7, 2004Applicants: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd), DAINIPPON SCREEN MFG. CO., LTD.Inventors: Yoshihiko Sakashita, Katsumi Watanabe, Hisanori Oshiba, Shogo Sarumaru, Yusuke Muraoka, Kimitsugu Saito, Ikuo Mizobata, Ryuji Kitakado
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Patent number: 6799735Abstract: The present invention is directed to a gas supply nozzle plate constructed by laminating a plurality of metal members each having a fluid path and branch. A fluid nozzle plate member provided by the invention has high sealing at a joined part, and high reliability even when used in high vacuum or at a high temperature. The fluid nozzle plate member comprises a plurality of plate-like metal members each having a fluid path and/or a branch. In this case, the plurality of plate-like metal members are laminated, and the laminated surfaces thereof are joined together by press forging.Type: GrantFiled: June 18, 2001Date of Patent: October 5, 2004Assignee: Furukawa-Sky Aluminum Corp.Inventors: Katsumi Watanabe, Akira Fukuchi
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Publication number: 20040188955Abstract: In order to provide a ring-shaped metal gasket that can secure a uniform sealing property over the entire surfaces of flanges regardless of the position of a bolt and a nut for tightening a clamp, a ring-shaped metal gasket is composed of an annular main body having a square cross section, a pair of annular arm portions projecting circumferentially outwardly of the annular main body in a bugle state at a predetermined angle, and an annular projecting portion bulging circumferentially inwardly with a height larger than the axial height of the annular main body. The annular projection portion acts as a positioning means. When a flange portion is tightened by a wedge action achieved by tightening a clamp, the pair of annular arm portions are elastically deformed and come into pressure contact with the flange surfaces by the elastic repulsive force thereof.Type: ApplicationFiled: March 22, 2004Publication date: September 30, 2004Inventors: Kenichi Takahiro, Hideaki Mori, Katsumi Watanabe, Kanji Hanashima
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Publication number: 20040178886Abstract: A radio-frequency identification system includes (a) responders each having a unique identification number, (b) an interrogator making an inquiry to and receiving a response from each of the responders, and (c) a host computer controlling communication made between the responders and the interrogator, and binary-searching a number space of the identification number of each of the responders for identifying a responder(s) existing in a communication area in which the responders and the interrogator can make communication with each other. The host computer has a function of acting as a discriminator for generating a control signal in accordance with first to N-th (N≧2) communication areas in each of which the responders and the interrogator can make communication with each other, binary-searching the number space in each of the first to N-th communication areas one by one to identify a responder(s) existing therein, and inactivating the thus identified responder(s).Type: ApplicationFiled: February 27, 2004Publication date: September 16, 2004Applicant: NEC Electronics CorporationInventors: Katsumi Watanabe, Yuji Sato
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Publication number: 20040123484Abstract: Disclosed is a high pressure processing method for subjecting a processing object to a high pressure processing using a high pressure fluid. In this method, the high pressure fluid is brought into collision with the surface of the processing object placed in a high pressure processing chamber, and then distributed along the surface of the processing object in an outward direction beyond the processing object.Type: ApplicationFiled: October 21, 2003Publication date: July 1, 2004Applicants: KABUSHIKI KAISHA KOBE SEIKO SHO, DAINIPPON SCREEN MFG. CO., LTD.Inventors: Tetsuya Yoshikawa, Yoichi Inoue, Katsumi Watanabe, Kaoru Masuda, Katsuyuki Iijima, Tomomi Iwata, Yusuke Muraoka, Kimitsugu Saito, Ikuo Mizobata
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Publication number: 20040105936Abstract: After subjected to a developing process, a rinsing process and a replacing process in this order in a developing unit 10A, 10B, a substrate W wet with an anti-drying solution is wet-transported to a supercritical drying unit 20 by a primary transport robot 30. The supercritical drying unit 20 performs a high-pressure drying process (supercritical drying process) in a dedicated manner. Accordingly, by virtue of the presence of the anti-drying solution, the substrate W is effectively prevented from becoming air-dry during the transportation of the substrate W.Type: ApplicationFiled: November 3, 2003Publication date: June 3, 2004Applicant: Dainippon Screen Mfg. Co. Ltd.Inventors: Yusuke Muraoka, Kimitsugu Saito, Tomomi Iwata, Eiji Fukatsu, Ikuo Mizobata, Hiroyuki Ueno, Yasuo Okuyama, Takashi Gama, Yoshihiko Sakashita, Katsumi Watanabe, Jun Munemasa, Hisanori Oshiba, Shogo Sarumaru
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Publication number: 20040069111Abstract: A high-pressure processing apparatus for supplying a pressure medium into a high-pressure processing chamber 4, which is formed in a pressure vessel 1 to treat a workpiece at a high pressure, is provided. The pressure vessel 1 includes a first vessel section 2 and a second vessel section 3, which can be separated from each other in the axial direction, wherein the high-pressure processing chamber 4 is formed between the first and second vessel sections 2 and 3. Furthermore, a face seal section 5 for tightly sealing the high-pressure processing chamber 4 is formed in the abutment of the first and second vessel sections 2 and 3. A press apparatus 7 for providing an axial force to the face seal section 5 is disposed and the press apparatus 7 has a space 15 for storing a supplementary apparatus, such as a stirrer or the like at a position corresponding to the axial center of the pressure vessel 1.Type: ApplicationFiled: July 24, 2003Publication date: April 15, 2004Applicant: Kabushiki Kaisha Kobe Seiko Sho(Kobe Steel, Ltd.)Inventors: Katsumi Watanabe, Takahiko Ishii, Shogo Sarumaru, Hideshi Yamane
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Patent number: 6703316Abstract: A method and system for processing a substrate includes performing a wet process by supplying a working liquid to a substrate in a wet processing apparatus, transferring the substrate in a non-dry state from the wet processing apparatus to a drying apparatus, and subjecting the substrate to a supercritical drying by a supercritical fluid in the drying apparatus.Type: GrantFiled: April 26, 2002Date of Patent: March 9, 2004Assignees: Kabushiki Kaisha Kobe Seiko Sho, Dainippon Screen Mfg. Co., Ltd.Inventors: Yoichi Inoue, Yoshihiko Sakashita, Katsumi Watanabe, Nobuyuki Kawakami, Takahiko Ishii, Yusuke Muraoka, Kimitsugu Saito, Tomomi Iwata, Ikuo Mizobata, Takashi Miyake, Ryuji Kitakado
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Patent number: 6699026Abstract: An injection molding apparatus comprises a cell assembly that has a tiered frame. The tiered frame is provided with lower unit storage sections and upper unit storage sections. The lower unit storage sections are provided with holders, individually, and injection molding machine units are mounted on the holders, individually. The upper unit storage sections are provided with holders, individually, and injection molding machine units are mounted on the holders, individually. Material supply pipes, temperature control piping, etc. of the injection molding machine units are arranged in a layout space on the side of a back portion of the cell assembly.Type: GrantFiled: April 17, 2003Date of Patent: March 2, 2004Assignee: Toshiba Machine Co., Ltd.Inventors: Tatsuhiko Maru, Jun Koike, Katsumi Watanabe, Fumiyuki Katoh, Makoto Nishizawa, Hajime Kitamura
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Publication number: 20040031441Abstract: A processing fluid is not only supplied toward a surface side of a substrate (W) from supply nozzles (13, 13), but also flow directions (R1, R1) of the processing fluid supplied from the respective supply nozzles 13 deviate from each other within the surface of the substrate (W). Therefore, a whirling flow (TF) of the processing fluid is formed over the surface of the substrate (W) and the processing fluid comes into contact with the surface of the substrate (W), thereby performing a predetermined surface treatment (e.g. cleaning, first rinsing, second rinsing and drying).Type: ApplicationFiled: March 14, 2003Publication date: February 19, 2004Inventors: Yusuke Muraoka, Takashi Miyake, Kimitsugu Saito, Takahiko Ishii, Yoshihiko Sakashita, Katsumi Watanabe
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Patent number: 6638564Abstract: A method of electroless plating for processing a plating surface to form a barrier layer being capable of uniformly forming a barrier layer and reducing the consumption of a processing solution, comprising a step of feeding a processing solution used in at least one of the pre-processing steps of the electroless plating and the electroless plating step to the plating surface for puddling treatment, or, using a processing solution at least containing, with respect to one mole of a first metallic material supplying a main ingredient of the barrier layer, three or more moles of a completing agent and three or more moles of reducing agent and having a pH value adjusted to 9 or more and stored in an atmosphere of an inert gas or ammonia gas, and a corresponding electroless plating apparatus.Type: GrantFiled: April 9, 2001Date of Patent: October 28, 2003Assignee: Sony CorporationInventors: Yuji Segawa, Akira Yoshio, Masatoshi Suzuki, Katsumi Watanabe, Shuzo Sato
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Publication number: 20030198701Abstract: An injection molding apparatus comprises a cell assembly that has a tiered frame. The tiered frame is provided with lower unit storage sections and upper unit storage sections. The lower unit storage sections are provided with holders, individually, and injection molding machine units are mounted on the holders, individually. The upper unit storage sections are provided with holders, individually, and injection molding machine units are mounted on the holders, individually. Material supply pipes, temperature control piping, etc. of the injection molding machine units are arranged in a layout space on the side of a back portion of the cell assembly.Type: ApplicationFiled: April 17, 2003Publication date: October 23, 2003Applicant: TOSHIBA MACHINE CO., LTD.Inventors: Tatsuhiko Maru, Jun Koike, Katsumi Watanabe, Fumiyuki Katoh, Makoto Nishizawa, Hajime Kitamura
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Patent number: 6612751Abstract: An optical repeating device with a monitoring function comprises first optical propagation means for propagating a lightwave signal through an optical transmission line, second optical propagation means butted against the first optical propagation means, for propagating the lightwave signal, optical branching means provided on a butting face between the first optical propagation means, and the second optical propagation means, and photodetection means. All the means described are assembled into a housing, and integrated therewith. Consequently, it is possible to downsize the optical repeating device with the monitoring function. A large portion of the lightwave signal propagated between the first optical propagation means and the second optical propagation means is allowed to pass through the optical branching means, however, a portion of the lightwave signal is reflected in a given direction by the optical branching means.Type: GrantFiled: March 29, 2000Date of Patent: September 2, 2003Assignees: Tohoku Electric Power Co., Inc., Sankosha CorporationInventors: Katsumi Watanabe, Fumika Kawahara, Takayuki Okawa
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Patent number: 6604377Abstract: A chill blow-off port is provided on a front surface side within a refrigerating compartment, and a chill return port is provided on a back wall of the refrigerating compartment, so that a chill generated by a heat exchanger flows from the front surface side within the refrigerating compartment toward the rear in the depth. Thereby, temperature unevenness within the refrigerating compartment is effectively eliminated and a cooling rate of a preserved food is enhanced.Type: GrantFiled: July 19, 2001Date of Patent: August 12, 2003Assignee: Fujitsu General LimitedInventors: Katsumi Watanabe, Yutaka Kameda, Masataka Eto, Susumu Oagu, Shinjiro Asakura, Kentaro Shiozaki, Kenji Haruyama, Youichi Higashionna
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Publication number: 20030142436Abstract: The center of rotation of a disk medium 1 when servo information is written thereto coincides as accurately as possible with its center of rotation in the drive into which the disk medium 1 is assembled.Type: ApplicationFiled: November 27, 2002Publication date: July 31, 2003Applicant: Hitachi, Ltd.Inventors: Hiroshi Kawaguchi, Shizuo Yamazaki, Makoto Horisaki, Katsumi Watanabe, Kenji Tomida, Youichi Kusagaya
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Patent number: 6557747Abstract: A method of manufacturing a hermetically sealed chamber, including preparing two aluminum or aluminum alloy material members which face each other, forming a first extending convex portion on a surface to be metal-bonded of one of the two aluminum or aluminum alloy material members, where the first convex portion extends in a manner to make an enclosure, forming a second extending convex portion on a surface to be metal-bonded of the other of the two aluminum or aluminum alloy material members, where the second convex portion extends in a manner to make a corresponding enclosure, and receiving internally packaged parts therebetween, fitting the first extending convex portion and the second extending convex portion, and causing the first extending convex portion and the second extending convex portion to be metal-bonded by press-forging.Type: GrantFiled: November 20, 2001Date of Patent: May 6, 2003Assignee: The Furukawa Electric Co., Ltd.Inventor: Katsumi Watanabe
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Patent number: 6552311Abstract: A method of manufacturing a hermetically sealed chamber, including preparing two aluminum or aluminum alloy material members which face each other, forming at least one extending groove portion on a surface to be metal-bonded of one of the two aluminum or aluminum alloy material members, wherein the groove portion extends in a manner to make an enclosure, forming at least one corresponding extending protruding portions on a surface to be metal-bonded of the other of the two aluminum or aluminum alloy material members, where the protruding portion extends in a manner to make a corresponding enclosure, forming an extending convex portion outside the groove portion and/or outside the protruding portion, wherein the convex portion extends in a manner to make an enclosure, and receiving internally packaged parts therebetween, inserting the at least one extending protruding portion into the at least one corresponding extending groove portion and fitting the extending convex portion, and causing the at least one extType: GrantFiled: November 20, 2001Date of Patent: April 22, 2003Assignee: The Furukawa Electric Co., Ltd.Inventor: Katsumi Watanabe
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Patent number: 6545354Abstract: In a semiconductor device such as a CSP, re-wiring is provided on a circuit element formation region of a semiconductor substrate and a columnar electrode for connection with a circuit board is provided on the re-wiring. A first insulating film is provided over the semiconductor substrate excluding a connection pad, and a ground potential layer connected to a ground potential is provided on an upper surface of the first insulating film on the circuit element formation region. A re-wiring is provided over the ground potential layer with a second insulating film interposed. Since the ground potential layer serves as a barrier layer for preventing crosstalk between the re-wiring and circuit element formation region, it is possible to eliminate crosstalk between the re-wiring and a circuit within the circuit element formation region and to freely position the re-wiring without restrictions.Type: GrantFiled: February 7, 2000Date of Patent: April 8, 2003Assignee: Casio Computer Co., Ltd.Inventors: Yutaki Aoki, Ichiro Mihara, Takeshi Wakabayashi, Katsumi Watanabe