Abstract: There is provided a component for machine structure having a hardened layer through an induction hardening in at least a part thereof, and more improving fatigue strengths as compared with the conventional ones, in which the hardened layer has a hardness Hv of not less than 750 and an average grain size of prior austenite grains is not more than 7 ?m over a full thickness of the hardened layer.

Abstract: An image forming device comprises; an endless-belt shaped image carrier that circulates along a predetermined locus of movement and is trained around a plurality of rollers, the plurality of rollers being structured by at least one driving roller that receives driving force from a drive source and drives, and driven rollers that do not have drive force, a dynamic friction connecting unit that, by dynamically-frictionally connecting the driving roller and at least one of the driven rollers under a predetermined dynamic friction coefficient, dynamically-frictionally drives the at least one driven roller by driving force of the driving roller.

Abstract: A steel for machine structural use with a better strength-ductility-toughness balance than maraging steel and applications thereof are provided. The steel for machine structural use with excellent strength, ductility, and toughness contains, in percent by mass, more than 0.30% to 0.5% of carbon, 1.0% or less of silicon, 1.5% or less of manganese, 0.025% or less of aluminum, 0.3% to 0.5% of molybdenum, and 0.0005% to 0.01% of boron, and the balance is iron and incidental impurities. The steel has a structure including at least 90% by volume of martensitic structure. The martensitic structure includes blocks having a size of 1.5 ?m or less. Dissolved boron is contained in an amount of at least 0.0005% and is present at boundaries of prior austenite grains in a concentration at least 1.5 times that in the prior austenite grains.

Abstract: An electro-optical device includes: a first optical panel having a pair of substrates with an electro-optical material interposed therebetween; a second optical panel that has a pair of substrates with an electro-optical material interposed therebetween, is disposed so as to overlap the first optical panel in plan view, and is smaller than the first optical panel in plan view; an illumination unit having a light source from which light is emitted and a light guiding member that is disposed between the first and second optical panels so as to make the light emitted from the light source incident on the first and second optical panels; and an optical absorber provided in a region other than a display area of the second optical panel between the first and second optical panels.

Abstract: An image forming device comprises; an endless-belt shaped image carrier that circulates along a predetermined locus of movement and is trained around a plurality of rollers, the plurality of rollers being structured by at least one driving roller that receives driving force from a drive source and drives, and driven rollers that do not have drive force, a dynamic friction connecting unit that, by dynamically-frictionally connecting the driving roller and at least one of the driven rollers under a predetermined dynamic friction coefficient, dynamically-frictionally drives the at least one driven roller by driving force of the driving roller.

Abstract: The present invention provides a steel material for induction quenching, containing 0.3% to 0.7% of C, 1.1% or less of Si, 0.2% to 1.1% of Mn, 0.05% to 0.6% of Mo, 0.06% or less of S, 0.025% or less of P, 0.25% or less of Al, 0.3% or less of Cr on a mass basis, and the balance being Fe and unavoidable impurities. The steel material has a ferrite structure and a pearlite structure, the total volume fraction of the ferrite structure and the pearlite structure is 90% or more, the thickness of the ferrite structure is 30 ?m or less, and the average prior austenite grain diameter of a hard layer obtained by induction quenching is 12 ?m or less. Since having superior machinability and superior fatigue strength after induction quenching, this steel material is suitable, for an automobile drive shaft, constant velocity joint, and the like.

Abstract: An electro-optical device includes: a first optical panel having a pair of substrates with an electro-optical material interposed therebetween; a second optical panel that has a pair of substrates with an electro-optical material interposed therebetween, is disposed so as to overlap the first optical panel in plan view, and is smaller than the first optical panel in plan view; an illumination unit having a light source from which light is emitted and a light guiding member that is disposed between the first and second optical panels so as to make the light emitted from the light source incident on the first and second optical panels; and an optical absorber provided in a region other than a display area of the second optical panel between the first and second optical panels.

Abstract: The present invention provides a machine structural part composed of 0.3% to 0.7% of C, 0.30% or less of Si, 0.2% to 2.0% of Mn, 0.005% to 0.25% of Al, 0.005% to 0.1% of Ti, 0.05% to 0.6% of Mo, 0.0003% to 0.006% of B, 0.06% or less of S, 0.020% or less of P, 0.0030% or less of O on a mass basis, and the balance being Fe and unavoidable impurities. In addition, the machine structural part has a hard layer on at least a part of a surface thereof formed by induction quenching, an average prior austenite grain diameter of the hard layer is 7 ?m or less, and the maximum diameter of a non-metal inclusion composed of oxides is 15 ?m or less. Since having a high fatigue strength, this machine structural part is suitable for an automobile drive shaft, constant velocity joint, and the like.

Abstract: When a non-oriented electrical steel sheet is manufactured, simultaneously having superior magnetic properties and high strengths, a composition containing 0.02% or less of C, 4.5% or less of Si, 5.0% or less (including 0) of Ni, and 0.2% to 4.0% of Cu is used, and a solute Cu is allowed to appropriately remain in finish annealing. In the steel sheet thus obtained, finely shaped Cu is precipitated by aging treatment, and while the magnetic properties are not degraded, the yield stress is increased to not less than CYS (MPa) represented by the following formula: note CYS=180+5,600[% C]+95[% Si]+50[% Mn]+37[% Al]+435[% P]+25[% Ni]+22d?1/2 where d is an average grain diameter (mm) of crystal grains.

Abstract: A lighting device of the invention includes: a plurality of light sources; and an optical waveguide, wherein light emitted from the plurality of light sources is incident from a side of the optical waveguide and then emitted from one main plane of the optical waveguide. The optical waveguide includes a first inclined plane for reflecting light emitted from a first light source and then emitting the light from the one main plane, and a second inclined plane for reflecting light emitted from a second light source and then emitting the light from the one main plane at an exit angle different from the light emitted from the first light source, and wherein each of the light sources is independently driven.

Abstract: A power semiconductor module has a circuit assembly body, which includes a metal base, a ceramic substrate, and a power semiconductor chip, and is combined with a package having terminals formed integrally. The ceramic substrate of the module has a structure such that an upper circuit plate and a lower plate are joined to both sides of a ceramic plate, respectively, and the metal base and the ceramic substrate are fixed to one another using solder, thereby improving reliability and lengthening a life of a power semiconductor module by optimizing a ceramic substrate and a metal base thereof, the dimensions thereof, and material and method used for a join formed between the ceramic substrate and metal base.

Abstract: A power semiconductor module has a circuit assembly body, which includes a metal base, a ceramic substrate, and a power semiconductor chip, and is combined with a package having terminals formed integrally. The ceramic substrate of the module has a structure such that an upper circuit plate and a lower plate are joined to both sides of a ceramic plate, respectively, and the metal base and the ceramic substrate are fixed to one another using solder, thereby improving reliability and lengthening a life of a power semiconductor module by optimizing a ceramic substrate and a metal base thereof, the dimensions thereof, and material and method used for a join formed between the ceramic substrate and metal base.

Abstract: A semiconductor device can be formed with fewer voids in the solder bonding a laminate of a silicon chip, an insulator substrate, and a metal base, with a solder layer positioned between the layers. After placing the laminate in a furnace, it is evacuated and then pressurized with hydrogen gas, and then heated to melt the solder. While maintaining the heat, the furnace is again evacuated to remove voids in the solder, and then the furnace is positively pressurized again with hydrogen gas to prevent holes produced by the voids traveling in the solder, and to obtain a uniform solder fillet shape. Thereafter the laminate is rapidly cooled to obtain a finer grain solder to increase the rate of creep to quickly remove the warping of the laminate to the original state.

Abstract: It is an object of this invention to provide a sea rescue informing apparatus and a life boat comprising the sea rescue informing apparatus. The sea rescue informing apparatus can securely inform a rescuer about the current position of a sufferer by continuously operating a rescue informing device with no fear of electric power consumption.

Abstract: A power semiconductor module has a circuit assembly body, which includes a metal base, a ceramic substrate, and a power semiconductor chip, and is combined with a package having terminals formed integrally. The ceramic substrate of the module has a structure such that an upper circuit plate and a lower plate are joined to both sides of a ceramic plate, respectively, and the metal base and the ceramic substrate are fixed to one another using solder, thereby improving reliability and lengthening a life of a power semiconductor module by optimizing a ceramic substrate and a metal base thereof, the dimensions thereof, and material and method used for a join formed between the ceramic substrate and metal base.

Abstract: A power semiconductor module has a circuit assembly body, which includes a metal base, a ceramic substrate, and a power semiconductor chip, and is combined with a package having terminals formed integrally. The ceramic substrate of the module has a structure such that an upper circuit plate and a lower plate are joined to both sides of a ceramic plate, respectively, and the metal base and the ceramic substrate are fixed to one another using solder, thereby improving reliability and lengthening a life of a power semiconductor module by optimizing a ceramic substrate and a metal base thereof, the dimensions thereof, and material and method used for a join formed between the ceramic substrate and metal base.

Abstract: A semiconductor device can be formed with fewer voids in the solder bonding a laminate of a silicon chip, an insulator substrate, and a metal base, with a solder layer positioned between the layers. After placing the laminate in a furnace, it is evacuated and then pressurized with hydrogen gas, and then heated to melt the solder. While maintaining the heat, the furnace is again evacuated to remove voids in the solder, and then the furnace is positively pressurized again with hydrogen gas to prevent holes produced by the voids traveling in the solder, and to obtain a uniform solder fillet shape. Thereafter the laminate is rapidly cooled to obtain a finer grain solder to increase the rate of creep to quickly remove the warping of the laminate to the original state.

Abstract: A power semiconductor module has a circuit assembly body, which includes a metal base, a ceramic substrate, and a power semiconductor chip, and is combined with a package having terminals formed integrally. The ceramic substrate of the module has a structure such that an upper circuit plate and a lower plate are joined to both sides of a ceramic plate, respectively, and the metal base and the ceramic substrate are fixed to one another using solder, thereby improving reliability and lengthening a life of a power semiconductor module by optimizing a ceramic substrate and a metal base thereof, the dimensions thereof, and material and method used for a join formed between the ceramic substrate and metal base.

Abstract: A portable lighting instrument having a light emitting diode assembly capable of being applied to a lighting system for a helicopter taking off and landing place. The system is constituted by a lighting instrument including a heliport lighthouse installed in a fixed position temporarily determined as a temporary taking off and landing place for a helicopter, a wind lamp, a landing area lighting lamp, a boundary guide lamp, and a boundary lamp. For at least the boundary guide lamp and the boundary lamp out of these lighting instruments, the portable lighting instrument according to the present invention can be used. The lighting instrument comprises a casing; a solar cell disposed on the outer surface of the casing; an electrical double-layer capacitor placed in the casing and charged by the solar cell; and a light emitting diode assembly disposed on the top of the casing and lighted by a current supplied from the electrical double-layer capacitor.

Abstract: A non-oriented electromagnetic steel sheet contains 0.005 wt. % or less C, 0.2 wt. % or less P, 0.005 wt. % or less N, 4.5 wt. % or less Si, 0.05 to 1.5 wt. % Mn, 1.5 wt. % or less Al and 0.001 wt. % or less S, at least one element selected from the group of 0.001 to 0.05 wt. % Sb, 0.002 to 0.1 wt. % Sn, 0.0005 to 0.01 wt. % Se and 0.0005 to 0.01 wt. % Te; and the balance being Fe and inevitable impurities. The non-oriented electromagnetic steel sheet is produced by the steps of: hot-rolling a slab to form a hot-rolled steel sheet, cold-rolling the hot-rolled steel sheet to form a cold-rolled steel sheet; and finish annealing the cold-rolled steel sheet.