Abstract: The present invention provides a circuit, in which a device typified by a PLED element is built into a flip-flop. In this case, a storage node of the device is low leakage. According to the present invention, it is possible to realize a SRAM that has nonvolatility while achieving high-speed operation. It is also possible to realize a flip-flop having the same characteristics. An example of a typical mode of the present invention is a storage circuit characterized by the following: a storage element is a device incorporating: a first path for a carrier; a first mode for storing a charge that generates an electric field where conductivity of the first path is changed; and a barrier structure through which a second carrier moves in response to given voltage so that the second carrier is stored in the first node; and the storage circuit includes a second node, to which information stored in the first node is outputted steadily in a state in which power is supplied.

Abstract: In a digital information system for realizing the sale of information or the like having a commercial value in the form of a digital signal, and an audio processor, and signal processor suitably used with the system, when a digital signal is received/delivered, a digital signal source is connected directly to a player for receiving and storing a specified information, which is reproduced by the player independently. A voice interval of a digital audio signal is processed to realize the slow and fast playback. The system includes a data compressor and a data extender of simple configuration. The value of the digital signal received/delivered can be exhibited directly. A selling system is constructed easily, and the player is simple in configuration and easy to operate by anyone.

Abstract: In a digital information system for realizing the sale of information or the like having a commercial value in the form of a digital signal, and an audio processor, and signal processor suitably used with the system, when a digital signal is received/delivered, a digital signal source is connected directly to a player for receiving and storing a specified information, which is reproduced by the player independently. A voice interval of a digital audio signal is processed to realize the slow and fast playback. The system includes a data compressor and a data extender of simple configuration. The value of the digital signal received/delivered can be exhibited directly. A selling system is constructed easily, and the player is simple in configuration and easy to operate by anyone.

Abstract: Herein disclosed is a semiconductor integrated circuit device comprising a SRAM having its memory cell composed of transfer MISFETs to be controlled through word lines and drive MISFETs. The gate electrodes of the drive MISFETs and the gate electrodes of the transfer MISFETs of the memory cell, and the word lines are individually formed of different conductive layers. The drive MISFETs and the transfer MISFETs are individually arranged to cross each other in the gate length direction. The word lines are extended in the gate length direction of the gate electrodes of the drive MISFETs and caused to cross the gate electrodes of the drive MISFETs partially.The two transfer MISFETs of the memory cell have their individual gate electrodes connected with two respective word lines spaced from each other and extended in an identical direction. The region defined by the two word lines is arranged therein with the two drive MISFETs and the source lines.

Abstract: Herein disclosed is a semiconductor integrated circuit device comprising a SRAM having its memory cell composed of transfer MISFETs to be controlled through word lines and drive MISFETs. The gate electrodes of the drive MISFETs and the gate electrodes of the transfer MISFETs of the memory cell, and the word lines are individually formed of different conductive layers. The drive MISFETs and the transfer MISFETs are individually arranged to cross each other in the gate length direction. The word lines are extended in the gate length direction of the gate electrodes of the drive MISFETs and caused to cross the gate electrodes of the drive MISFETs partially.The two transfer MISFETs of the memory cell have their individual gate electrodes connected with two respective word lines spaced from each other and extended in an identical direction. The region defined by the two word lines is arranged therein with the two drive MISFETs and the source lines.

Abstract: Herein disclosed is a semiconductor integrated circuit device comprising an SRAM having its memory cell composed of transfer MISFETs to be controlled through word lines and drive MISFETs, and a method of forming this device. The gate electrodes of the drive MISFETs and of the transfer MISFETs of the memory cell, and the word lines, are individually formed of different conductive layers. The two transfer MISFETs of the memory cell have their individual gate electrodes connected with two respective word lines spaced from each other and extended in an identical direction. The source line is formed of a conductive layer identical to that of the word line. An oxidation resisting film is formed on the gate electrodes of the drive MISFETs so as to reduce stress caused by oxidization of edge portions of these gate electrodes, and to reduce a resulting leakage current.

Abstract: A method is provided for manufacturing a semiconductor integrated circuit device which includes a capacitor element having a first electrode, a second electrode, and a dielectric film formed between said first electrode and said second electrode. In particular, the method includes the step of forming at least one of the first electrode and second electrode with a polycrystalline silicon film which is deposited over a semiconductor substrate by a CVD method and which is doped with an impurity during said deposition to decrease the resistance of the polycrystalline silicon film. The capacitor element formed by this method is particularly useful for memory cells of static random access memory devices.

Abstract: A memory system including a first memory area (MEM-A) implemented using memory units including low threshold voltage transistors powered by a low supply voltage source, and a second memory area (MEM-B) implemented using memory units including higher threshold voltage cells powered by a higher supply voltage source. The first memory area, MEM-A, is designated to contain frequently accessed variables, with less frequently accessed variables designated for storage in the second memory area, MEM-B. The most frequently accessed variables stored in MEM-A provide for fast access at a low power per access power dissipation level due to the lower supply voltage and lower threshold voltage design. Alternatively, the less frequently accessed variables stored in MEM-B require a high power per access, but negligible leakage current during static steady state conditions.

Abstract: A semiconductor static memory device, which has an increased storage capacity without imposing an increased access time, includes first, second and third metallic layers. To begin, word lines for the transfer MOSFETS are formed of the same polysilicon layer used to form the gate electrodes of the transfer MOSFETs of the memory device. A metallic layer of the first layer is used for local word lines, with the polysilicon word lines and local word lines being connected at their ends or inside of cell arrays. A metallic layer of the second layer is used for bit layers, and a metallic layer of the third layer is used for main word lines. Consequently, the word lines have a decreased time constant, allowing fast memory access. Each of sense amplifiers used in the memory device are formed with MOSFETs, which are disposed divisionally in adjacent locations. Preferably the gate electrodes of the divided MOSFETs are located symmetrically.

Abstract: Herein disclosed is a semiconductor integrated circuit device comprising a SRAM having its memory cell composed of transfer MISFETs to be controlled through word lines and drive MISFETs. The gate electrodes of the drive MISFETs and the gate electrodes of the transfer MISFETs of the memory cell, and the word lines are individually formed of different conductive layers. The drive MISFETs and the transfer MISFETs are individually arranged to cross each other in the gate length direction. The word lines are extended in the gate length direction of the gate electrodes of the drive MISFETs and caused to cross the gate electrodes of the drive MISFETs partially.The two transfer MISFETs of the memory cell have their individual gate electrodes connected-with two respective word lines spaced from each other and extended in an identical direction. The region defined by the two word lines is arranged therein with the two drive MISFETs and the source lines.

Abstract: Herein disclosed is a semiconductor integrated circuit device comprising a SRAM having its memory cell composed of transfer MISFETs to be controlled through word lines and drive MISFETs. The gate electrodes of the drive MISFETs and the gate electrodes of the transfer MISFETs of the memory cell, and the word lines are individually formed of different conductive layers. The drive MISFETs and the transfer MISFETs are individually arranged to cross each other in the gate length direction. The word lines are extended in the gate length direction of the gate electrodes of the drive MISFETs and caused to cross the gate electrodes of the drive MISFETs partially.The two transfer MISFETs of the memory cell have their individual gate electrodes connected with two respective word lines spaced from each other and extended in an identical direction. The region defined by the two word lines is arranged therein with the two drive MISFETs and the source lines.

Abstract: Herein disclosed is a semiconductor integrated circuit device comprising a SRAM having its memory cell composed of transfer MISFETs to be controlled through word lines and drive MISFETs. The gate electrodes of the drive MISFETs and the gate electrodes of the transfer MISFETs of the memory cell, and the word lines are individually formed of different conductive layers. The drive MISFETs and the transfer MISFETs are individually arranged to cross each other in the gate length direction. The word lines are extended in the gate length direction of the gate electrodes of the drive MISFETs and caused to cross the gate electrodes of the drive MISFETs partially.

Abstract: A method of fabricating semiconductor integrated circuits with an improved yield rate is realized, which requires no special circuits for selecting normal circuit blocks. Removable temporary wires are connected to circuit blocks, which are thus tested. After removing the temporary wires, a plurality of normally-operating circuit blocks are interconnected by new main wires. The need of a special selecting circuit for replacing defective circuit blocks with normal circuit blocks is eliminated without increasing the delay time due to redundancy. The freedom of the main wiring formed after removal of the temporary wires is so high that the functional freedom of the system constructed is improved.

Abstract: A carry look ahead circuit includes a first circuit for generating a logical sum of inputs, a second circuit for generating a logical product of the inputs, and a selection circuit for selecting either one of an output of the first circuit and an output of the second circuit in accordance with a carry signal from a lower figure to produce the selected output as a carry signal. Consequently, the number of circuit elements can be reduced greatly to configure the high speed and low power consumption carry look ahead circuit.

Abstract: A semiconductor static memory device, which has an increased storage capacity without imposing an increased access time, includes first, second and third metallic layers. To begin, word lines for the transfer MOSFETS are formed of the same polysilicon layer used to form the gate electrodes of the transfer MOSFETs of the memory device. A metallic layer of the first layer is used for local word lines, with the polysilicon word lines and local word lines being connected at their ends or inside of cell arrays. A metallic layer of the second layer is used for bit layers, and a metallic layer of the third layer is used for main word lines. Consequently, the word lines have a decreased time constant, allowing fast memory access. Each of sense amplifiers used in the memory device are formed with MOSFETs, which are disposed divisionally in adjacent locations. Preferably the gate electrodes of the divided MOSFETs are located symmetrically.

Abstract: A MOSFET Static Random Access Memory (SRAM) cell has a symmetrical construction, with a pair of word lines. The word lines are in second level polysilicon, so that they may overlap the driving transistor gates which are in first level polysilicon.

Abstract: In a semiconductor memory, a latch circuit is arranged between the outputs of a sense amplifier and the inputs of a data output buffer. First pass-gates are arranged between the outputs of the sense amplifier and the latch circuit, while second pass-gates are arranged between the latch circuit and the inputs of the data output buffer. The outputs of the sense amplifier are transmitted to the inputs of the data output buffer through signal paths which bypass the first pass-gates, the latch circuit and the second pass-gates, whereby the data output buffer generates a data output quickly. Thereafter, the first pass-gates and the second pass-gates are controllably brought to a signal-through condition, whereby the output information items of the sense amplifier are stored in the latch circuit. The data output buffer holds the data output in conformity with the stored information items of the latch circuit.

Abstract: In order to obtain a highly stable SRAM cell having a small cell area, a cell ratio R is set to be R=(W.sub.DEFF /L.sub.DEFF)/(W.sub.TEFF /L.sub.TEFF)<3 where L.sub.DEFF and W.sub.DEFF denote an effective channel length and an effective channel width of two driver MOSFETs 3 and 4 respectively, and L.sub.TEFF and W.sub.TEFF denote an effective channel length and an effective channel width of two transfer MOSFETs 5 and 6 respectively. Further, a maximum current I.sub.R flowing into the active loads MOSFETs 1 and 2 is set to be greater than a current I.sub.L (1.times.10.sup.-8 A) that flows into the driver MOSFET 5 when a threshold voltage is applied across the gate and the cource of the MOSFET 5. The pair of active load MOSFETs 1 and 2 are stacked on the driver MOSFETs 3 and 4 and on the transfer MOSFETs 5 and 6.

Abstract: A semiconductor static random access memory having a high .alpha.-ray immunity and a high packing density is provided which is also capable of high-speed operation. A semiconductor memory device comprises static random access memory cells each including a flip-flop circuit. Storage nodes of each flip-flop circuit have respective pn-junctions formed at regions sandwiched between gate electrodes of first insulated gate field effect transistors and gate electrodes of second insulated gate field effect transistors, respectively. The pn-junction has an area smaller than that of a channel portion of the first or second insulated gate field effect transistor.

Abstract: A MOS transistor sense amplifier employs cross coupled positive feedback for the load circuit of a differential amplifier with an equalizing switch at the amplifier output, and preferably also at the input. This basis amplifier circuit may be repeated in stages. When stages are employed, it is desirable that the first stage employs current mirror loading of the differential amplifier to reduce the data delay. Data delay is further reduced by providing strong amplification during the sense portion of the read cycle with a preamplifier, which preamplifier has its amplification reduced, preferably to unity by being turned off, when the sense portion of the cycle is finished, and most preferably when the input and output data lines are directly connected independently of the preamplifier, so that the preamplifier may be completely turned off to lower power consumption.