Abstract: A polyimide film includes a polyimide in which a specific amount of molecular framework containing one or two silicon atoms in its main chain, wherein a total light transmittance measured in accordance with JIS K7361-1 is 85% or more; wherein a yellowness index calculated in accordance with JIS K7373-2006 is 30 or less; wherein a glass transition temperature is in a temperature range of from 150° C. to 400° C.; and wherein a tensile elastic modulus at 25° C. obtained by measuring a 15 mm×40 mm test piece at a tensile rate of 10 mm/min and a chuck distance of 20 mm in accordance with JIS K7127, is 1.8 GPa or more.

Abstract: A polyimide film includes a polyimide in which a specific amount of molecular framework containing one or two silicon atoms in its main chain, wherein a total light transmittance measured in accordance with JIS K7361-1 is 85% or more; wherein a yellowness index calculated in accordance with JIS K7373-2006 is 30 or less; wherein a glass transition temperature is in a temperature range of from 150° C. to 400° C.; and wherein a tensile elastic modulus at 25° C. obtained by measuring a 15 mm×40 mm test piece at a tensile rate of 10 mm/min and a chuck distance of 20 mm in accordance with JIS K7127, is 1.8 GPa or more.

Abstract: A resin composition including an olefin resin, an alkenyl-containing alkoxy silane compound, and at least one inorganic filler selected from the group consisting of titanium oxide, alumina, talc, clay, aluminum, aluminum hydroxide, mica, iron oxide, graphite, carbon black, calcium carbonate, zinc sulfide, zinc oxide, barium sulfate, and potassium titanate; a reflector using the resin composition; a reflector-bearing lead frame; and a semiconductor light-emitting device. Accordingly, provided by the present invention are: a resin composition capable of expressing an excellent heat resistance (especially heat distortion resistance) even when it is made to a formed body; a reflector using the resin composition; a reflector-bearing lead frame; and a semiconductor light-emitting device.

Abstract: A semiconductor light-emitting device including at least a substrate, a reflector having a concave cavity, and an optical semiconductor element, wherein the reflector is formed of a resin composition containing an inorganic substance; in a spectrum obtained when the reflector is measured by an X-ray diffraction method using CuK? radiation (wavelength=1.5418 A), an intensity ratio (P1/P2) of a peak intensity P1 of the highest intensity diffraction peak in a range of diffraction angle 2? of 0° to 24° to the peak intensity P2 of the highest intensity diffraction peak in a range of diffraction angle 2? of more than 24° to 70° is 0.01 or more and 1.0 or less; and an ash content of the reflector is 60% by mass or more. A semiconductor light-emitting device and an optical-semiconductor-mounting substrate, including a reflector having an extremely high light reflection property and excellent dimensional stability.

Abstract: Provided are an electron beam curable resin composition including an olefin resin, a crosslinking agent, and a white pigment, in which the crosslinking agent has a saturated or unsaturated ring structure, at least one atom among atoms forming at least one ring is bonded to any allylic substituent of an allyl group, a methallyl group, an allyl group through a linking group, and a methallyl group through a linking group, and the white pigment is blended in an amount of more than 200 parts by mass and 500 parts by mass or less with respect to 100 parts by mass of olefin resin, a reflector resin frame using the resin composition, a reflector, a semiconductor light-emitting device, and a molding method using the resin composition.

Abstract: A resin film has improved rigidity and flex resistance, and reduced optical distortion. A polyimide film has a polyimide containing an aromatic ring, and inorganic particles having a smaller refractive index in a major axis direction than an average refractive index in a direction perpendicular to the major axis direction, wherein, when the polyimide film is monotonically heated from 25° C. at 10° C./min, a size shrinkage ratio represented by the following formula in at least one direction is 0.1% or more at at least one temperature in a range of from 250° C. to 400° C.: size shrinkage ratio (%)=[{(size at 25° C.)?(size after heating)}/(size at 25° C.)]×100; wherein a birefringence index in a thickness direction is 0.020 or less at a wavelength of 590 nm; and wherein a total light transmittance measured in accordance with JIS K7361-1 is 80% or more at a thickness of 10 ?m.

Abstract: A semiconductor light-emitting device including at least a substrate, a reflector having a concave cavity, and an optical semiconductor element, wherein the reflector is formed of a resin composition containing an inorganic substance; in a spectrum obtained when the reflector is measured by an X-ray diffraction method using CuK? radiation (wavelength=1.5418 A), an intensity ratio (P1/P2) of a peak intensity P1 of the highest intensity diffraction peak in a range of diffraction angle 2? of 0° to 24° to the peak intensity P2 of the highest intensity diffraction peak in a range of diffraction angle 2? of more than 24° to 70° is 0.01 or more and 1.0 or less; and an ash content of the reflector is 60% by mass or more. A semiconductor light-emitting device and an optical-semiconductor-mounting substrate, including a reflector having an extremely high light reflection property and excellent dimensional stability.

Abstract: Provided is a heat-conductive sealing member which has high moisture barrier properties, has heat dissipation properties, and is capable of encapsulating an element by a simple method. The heat-conductive sealing member has a metal base material, an insulating layer that is formed on the metal base material, has heat conductivity and contains at least polyimide, and a tacky adhesive layer that is formed on the insulating layer and has heat resistance.

Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, a conductor layer formed on the insulating layer, and a cover layer covering the conductor layer. The insulating layer and the cover layer are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3×10?6/% RH and 30×10?6/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5×10?6/% RH or less.

Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, a conductor layer formed on the insulating layer, and a cover layer covering the conductor layer. The insulating layer and the cover layer are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3×10?6/% RH and 30×10?6/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5×10?6/% RH or less.

Abstract: A resin composition including an olefin resin, an alkenyl-containing alkoxy silane compound, and at least one inorganic filler selected from the group consisting of titanium oxide, alumina, talc, clay, aluminum, aluminum hydroxide, mica, iron oxide, graphite, carbon black, calcium carbonate, zinc sulfide, zinc oxide, barium sulfate, and potassium titanate; a reflector using the resin composition; a reflector-bearing lead frame; and a semiconductor light-emitting device. Accordingly, provided by the present invention are: a resin composition capable of expressing an excellent heat resistance (especially heat distortion resistance) even when it is made to a formed body; a reflector using the resin composition; a reflector-bearing lead frame; and a semiconductor light-emitting device.

Abstract: A main object of the invention is to provide a heat dissipating substrate which is excellent in heat dissipating performance, and undergoes neither peel therein nor short circuit. The invention attains this objet by providing a heat dissipating substrate comprising a support base material, an insulating layer formed directly on the support base material, and a wiring layer formed directly on the insulating layer, wherein the insulating layer is formed by non-thermoplastic polyimide resin, and has a thickness in the range of 1 ?m to 20 ?m.

Abstract: Provided are an electron beam curable resin composition including an olefin resin, and a crosslinking agent, in which the crosslinking agent has a saturated or unsaturated ring structure, at least one atom among atoms forming at least one ring is bonded to any allylic substituent of an allyl group, a methallyl group, an allyl group through a linking group, and a methallyl group through a linking group, and the crosslinking agent is blended in an amount of more than 15 parts by mass and 40 parts by mass or less with respect to 100 parts by mass of olefin resin, a reflector resin frame using the resin composition, a reflector, a semiconductor light-emitting device, and a molding method using the resin composition.

Abstract: Provided are an electron beam curable resin composition including an olefin resin, a crosslinking agent, and a white pigment, in which the crosslinking agent has a saturated or unsaturated ring structure, at least one atom among atoms forming at least one ring is bonded to any allylic substituent of an allyl group, a methallyl group, an allyl group through a linking group, and a methallyl group through a linking group, and the white pigment is blended in an amount of more than 200 parts by mass and 500 parts by mass or less with respect to 100 parts by mass of olefin resin, a reflector resin frame using the resin composition, a reflector, a semiconductor light-emitting device, and a molding method using the resin composition.

Abstract: Disclosed is a substrate for a flexible device which, when a TFT is produced on a flexible substrate in which a metal layer and a polyimide layer are laminated, can suppress deterioration of the electrical performance of the TFT due to the surface irregularities of the metal foil surface and can suppress detachment or cracks of the TFT. Also disclosed is a substrate for a thin film element which has excellent surface smoothness and is capable of suppressing deterioration of the characteristics of thin film elements. Also disclosed are methods for manufacturing substrates for thin film elements.

Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, a conductor layer formed on the insulating layer, and a cover layer covering the conductor layer. The insulating layer and the cover layer are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3×10?6/% RH and 30×10?6/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5×10?6/% RH or less.

Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, a conductor layer formed on the insulating layer, and a cover layer covering the conductor layer. The insulating layer and the cover layer are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3×10?6/% RH and 30×10?6/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5×10?6/% RH or less.

Abstract: A polyimide precursor and a polyimide precursor resin composition, the polyimide precursor having repeating units represented by formula (1) and a photosensitive resin composition comprising the polyimide precursor and a photoacid generator or photobase generator: where R1 is a tetravalent organic group; R2 is a divalent organic group; R1s may be the same or different from each other and R2s may be the same or different from each other in the repeating units; R3 and R4 respectively represent a monovalent organic group having a structure represented by formula (2) and may be the same or different from each other; and R3s and R4s in the repeating units may be the same or different from each other, respectively. R5, R6, R7 and R8 are as described in the specification.

Abstract: A photosensitive resin composition which is excellent in resolution, low in cost, and usable in a wide range of structures of polymer precursors each of which is reacted into a final product by a basic substance or by heating in the presence of a basic substance. The photosensitive resin composition includes a base generator which has a specific structure and generates a base by exposure to electromagnetic radiation and heating, and a polymer precursor which is reacted into a final product by the base generator and by a basic substance or by heating in the presence of a basic substance.

Abstract: A polymer precursor including a part which sequences an unsaturated bond having a ? electron orbit and a single bond alternately is disclosed. The polymer precursor has a first functional group and a second functional group which form a repeating unit constituting a polymer skeleton of an end product by an intramolecular reaction. At least a part of a conjugated state formed by the ? electron orbit in the molecule is disconnected or weakened due to a three-dimensional structure of the molecule and a transmittance with respect to an electromagnetic wave of at least one wavelength selected from the group consisting of 436 nm, 405 nm, 365 nm, 248 nm and 193 nm is improved.