Patents by Inventor Katsuya Sakayori

Katsuya Sakayori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8697332
    Abstract: An object of the present invention is to provide a base generator which has sensitivity and is applicable to a wide range of applications, and a photosensitive resin composition which is applicable to a wide range of applications due to the structure of a polymer precursor in which reaction into a final product is promoted by a basic substance or by heating in the presence of a basic substance. The base generator generates a base by exposure to electromagnetic radiation and heating. The photosensitive resin composition comprises a polymer precursor in which reaction into a final product is promoted by the base generator and a basic substance or by heating in the presence of a basic substance.
    Type: Grant
    Filed: March 26, 2010
    Date of Patent: April 15, 2014
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Mami Katayama, Shunji Fukuda, Katsuya Sakayori, Kouji Kawaguchi
  • Publication number: 20140085830
    Abstract: A main object of the invention is to provide a heat dissipating substrate which is excellent in heat dissipating performance, and undergoes neither peel therein nor short circuit. The invention attains this objet by providing a heat dissipating substrate comprising a support base material, an insulating layer formed directly on the support base material, and a wiring layer formed directly on the insulating layer, wherein the insulating layer is formed by non-thermoplastic polyimide resin, and has a thickness in the range of 1 ?m to 20 ?m.
    Type: Application
    Filed: September 20, 2013
    Publication date: March 27, 2014
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Shunji FUKUDA, Katsuya SAKAYORI, Toshimasa TAKARABE
  • Publication number: 20130309607
    Abstract: A photosensitive resin composition which is excellent in resolution, low in cost, and usable in a wide range of structures of polymer precursors each of which is reacted into a final product by a basic substance or by heating in the presence of a basic substance. The photosensitive resin composition includes a base generator which has a specific structure and generates a base by exposure to electromagnetic radiation and heating, and a polymer precursor which is reacted into a final product by the base generator and by a basic substance or by heating in the presence of a basic substance.
    Type: Application
    Filed: April 25, 2013
    Publication date: November 21, 2013
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Mami KATAYAMA, Shunji FUKUDA, Katsuya SAKAYORI
  • Patent number: 8476444
    Abstract: A photosensitive resin composition which is excellent in resolution, low in cost, and usable in a wide range of structures of polymer precursors each of which is reacted into a final product by a basic substance or by heating in the presence of a basic substance. The photosensitive resin composition includes a base generator which has a specific structure and generates a base by exposure to electromagnetic radiation and heating, and a polymer precursor which is reacted into a final product by the base generator and by a basic substance or by heating in the presence of a basic substance.
    Type: Grant
    Filed: March 30, 2009
    Date of Patent: July 2, 2013
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Mami Katayama, Shunji Fukuda, Katsuya Sakayori
  • Publication number: 20130126860
    Abstract: A main object of the present invention is to provide a TFT substrate having excellent switching characteristics. The object is attained by providing a thin film transistor substrate comprising: a substrate, and a thin film transistor having an oxide semiconductor layer that is formed on the substrate and is formed from an oxide semiconductor, and a semiconductor layer-adjoining insulating layer formed to be in contact with the oxide semiconductor layer, wherein at least one semiconductor layer-adjoining insulating layer included in the thin film transistor is a photosensitive polyimide insulating layer formed by using a photosensitive polyimide resin composition.
    Type: Application
    Filed: October 4, 2012
    Publication date: May 23, 2013
    Inventors: Shunji FUKUDA, Katsuya SAKAYORI, Keita ARIHARA
  • Patent number: 8308967
    Abstract: The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.
    Type: Grant
    Filed: January 13, 2011
    Date of Patent: November 13, 2012
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Katsuya Sakayori, Terutoshi Momose, Shigeki Kawano, Tomoko Togashi, Hiroko Amasaki, Nobuhiro Sakihama, Tsuyoshi Yamazaki, Michiaki Uchiyama, Hiroshi Yagi
  • Patent number: 8252423
    Abstract: There is provided a resin laminate having a layer construction of a first inorganic material layer/insulating layer/second inorganic material layer or a layer construction of an inorganic material layer/insulating layer, wherein the insulating layer has a multi-layer structure of two or more resin layers of a core insulating layer and an adhesive insulating layer. In this case, the resin laminate has the adhesive insulating layer which can realize optimal etching, is suitable for etching by a wet process, and has excellent adhesion. At least one of the layers constituting the insulating layer is formed of a polyimide resin which comprises repeating units represented by formula (1) and has a glass transition point of 150 to 360° C. and is dissolvable in a basic solution at a rate of more than 3 ?m/min, preferably more than 5 ?m/min, and most preferably more than 8 ?m/min.
    Type: Grant
    Filed: October 25, 2010
    Date of Patent: August 28, 2012
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Katsuya Sakayori, Shigeki Kawano, Hiroko Amasaki, Hidetsugu Tazawa, Kazunari Ikeda, Kouhei Ohno
  • Publication number: 20120187399
    Abstract: Disclosed is a substrate for a flexible device which, when a TFT is produced on a flexible substrate in which a metal layer and a polyimide layer are laminated, can suppress deterioration of the electrical performance of the TFT due to the surface irregularities of the metal foil surface and can suppress detachment or cracks of the TFT. Also disclosed is a substrate for a thin film element which has excellent surface smoothness and is capable of suppressing deterioration of the characteristics of thin film elements. Also disclosed are methods for manufacturing substrates for thin film elements.
    Type: Application
    Filed: September 29, 2010
    Publication date: July 26, 2012
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Shunji Fukuda, Katsuya Sakayori, Keita Arihara, Koji Ichimura, Kei Amagai
  • Publication number: 20120181914
    Abstract: Provided is a heat-conductive sealing member which has high moisture barrier properties, has heat dissipation properties, and is capable of encapsulating an element by a simple method. The heat-conductive sealing member has a metal base material, an insulating layer that is formed on the metal base material, has heat conductivity and contains at least polyimide, and a tacky adhesive layer that is formed on the insulating layer and has heat resistance.
    Type: Application
    Filed: September 29, 2010
    Publication date: July 19, 2012
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Shunji Fukuda, Katsuya Sakayori, Yasuhiro Iizumi
  • Publication number: 20120183751
    Abstract: The present invention is to provide a photosensitive resin composition which has excellent resolution, is low in cost and is applicable to a wide range of applications due to the structure of a polymer precursor in which reaction into a final product is promoted by a basic substance or by heating in the presence of a basic substance. The present invention is also to provide a base generator which is applicable to such a photosensitive resin composition. Disclosed is a base generator which has a specific structure and generates a base by exposure to electromagnetic radiation and heating. Also disclosed is a photosensitive resin composition which comprises the base generator and a polymer precursor in which reaction into a final product is promoted by a basic substance or by heating in the presence of a basic substance.
    Type: Application
    Filed: September 29, 2010
    Publication date: July 19, 2012
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Mami Katayama, Shunji Fukuda, Katsuya Sakayori
  • Patent number: 8211613
    Abstract: The present invention provides a radical generator having a naphthalimide structure or a crosslinking agent and a photosensitive compound having a function as a radical generator. A photoradical polymerization initiator of the present invention comprises a compound (a) having only one naphthalimide structure-containing group in one molecule. The radial generator of the present invention comprises a compound (c) having two or more naphthalimide structure-containing groups in one molecule and also functions as a crosslinking agent. A first photosensitive compound of the present invention comprises a compound (d) having a naphthalimide structure-containing group and an ethylenic unsaturated group in one molecule. A second photosensitive compound of the present invention comprises a polymer (e) of one or more radical polymerizable compounds containing the compound (d).
    Type: Grant
    Filed: July 2, 2008
    Date of Patent: July 3, 2012
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventor: Katsuya Sakayori
  • Publication number: 20120122033
    Abstract: A polymer precursor including a part which sequences an unsaturated bond having a ? electron orbit and a single bond alternately is disclosed. The polymer precursor has a first functional group and a second functional group which form a repeating unit constituting a polymer skeleton of an end product by an intramolecular reaction. At least a part of a conjugated state formed by the ? electron orbit in the molecule is disconnected or weakened due to a three-dimensional structure of the molecule and a transmittance with respect to an electromagnetic wave of at least one wavelength selected from the group consisting of 436 nm, 405 nm, 365 nm, 248 nm and 193 nm is improved.
    Type: Application
    Filed: November 30, 2011
    Publication date: May 17, 2012
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventor: Katsuya SAKAYORI
  • Publication number: 20120070781
    Abstract: An object of the present invention is to provide a base generator which has sensitivity and is applicable to a wide range of applications, and a photosensitive resin composition which is applicable to a wide range of applications due to the structure of a polymer precursor in which reaction into a final product is promoted by a basic substance or by heating in the presence of a basic substance. The base generator generates a base by exposure to electromagnetic radiation and heating. The photosensitive resin composition comprises a polymer precursor in which reaction into a final product is promoted by the base generator and a basic substance or by heating in the presence of a basic substance.
    Type: Application
    Filed: March 26, 2010
    Publication date: March 22, 2012
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Mami Katayama, Shunji Fukuda, Katsuya Sakayori, Kouji Kawaguchi
  • Patent number: 8088882
    Abstract: A main object of the present invention is to provide a polymer precursor which exhibits high transmittance to a shorter wavelength range with respect to an electromagnetic wave though the polymer precursor has a part which sequences an unsaturated bond having a ? electron orbit and a single bond alternately.
    Type: Grant
    Filed: March 28, 2006
    Date of Patent: January 3, 2012
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventor: Katsuya Sakayori
  • Patent number: 8071273
    Abstract: It is a main object of the present invention to provide a polyimide precursor and a polyimide precursor resin composition, which precursor being easy to synthesize, available at low cost, excellent in storage and capable of giving polyimide that is low in impurities after imidization, irrespective of the chemical structure of the finally-obtained polyimide.
    Type: Grant
    Filed: March 27, 2009
    Date of Patent: December 6, 2011
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventor: Katsuya Sakayori
  • Patent number: 8066891
    Abstract: The present invention provides a laminate comprising an insulating layer having suppressed dusting properties, an insulating film comprising the insulating layer, and an electronic circuit component comprising a pattern of the insulating layer. The laminate has a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer. The insulating layer comprises a laminate of two or more wet etchable insulating unit layers. At the interface between the inorganic material layer and the insulating layer, surface irregularities of the inorganic material layer have been transferred onto the surface of the insulating layer. The average height of the surface irregularities transferred onto the insulating layer is less than the thickness of the outermost insulating unit layer in the insulating layer.
    Type: Grant
    Filed: October 6, 2006
    Date of Patent: November 29, 2011
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Katsuya Sakayori, Terutoshi Momose, Tomoko Togashi, Shigeki Kawano, Michiaki Uchiyama, Kazuto Okamura, Kazutoshi Taguchi, Kazunori Ohmizo, Makoto Shimose
  • Publication number: 20110281218
    Abstract: It is a main object of the present invention to provide a polyimide precursor and a polyimide precursor resin composition, which precursor being easy to synthesize, available at low cost, excellent in storage and capable of giving polyimide that is low in impurities after imidization, irrespective of the chemical structure of the finally-obtained polyimide.
    Type: Application
    Filed: July 25, 2011
    Publication date: November 17, 2011
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventor: Katsuya SAKAYORI
  • Patent number: 7951460
    Abstract: The present invention is directed to a laminate having a layer construction of metal-insulating layer-metal or a layer construction of metal-insulating layer, which laminate meets conditions for developing large adhesive strength between the insulating layer and the metal, as well as to an insulating film and an electronic circuit using the laminate. The laminate has a layer construction of first metal layer/insulating layer/second metal layer or a layer construction of metal layer/insulating layer. The insulating layer 1 has a multilayer structure of two or more layers. The layers on the side of the adhesive interface with each metal layer (a copper foil 3 and an SUS foil 4), out of the layers constituting the insulating layer 1, each are a thermoplastic resin layer 2. The minimum value of the storage modulus at a temperature at or above Tg of the thermoplastic resin layer 2 is not more than 106 Pa.
    Type: Grant
    Filed: January 23, 2004
    Date of Patent: May 31, 2011
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventor: Katsuya Sakayori
  • Publication number: 20110108519
    Abstract: The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.
    Type: Application
    Filed: January 13, 2011
    Publication date: May 12, 2011
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Katsuya SAKAYORI, Terutoshi Momose, Shigeki Kawano, Tomoko Togashi, Hiroko Amasaki, Nobuhiro Sakihama, Tsuyoshi Yamazaki, Michiaki Uchiyama, Hiroshi Yagi
  • Patent number: 7932340
    Abstract: The invention provides a radical generator, although being a self-cleavage type initiator, which is capable of suppressing volatilization of low molecular weight decomposition materials at the time of light radiation and post-baking, and leaving no low molecular weight decomposition materials in the final product, a photosensitive resin composition and an article using the radical generator. The photoradical generator provided according to the invention contains a compound (a) having one or more self-cleavage type radical-generating parts and one or more ethylenic unsaturated groups in one molecule.
    Type: Grant
    Filed: October 20, 2006
    Date of Patent: April 26, 2011
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventor: Katsuya Sakayori