Patents by Inventor Katsuya Tomizawa

Katsuya Tomizawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board
    Patent number: 11769607
    Abstract: A resin composition comprising a maleimide compound, a cyanate ester compound, a silane compound having a styrene skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.
    Type: Grant
    Filed: November 16, 2021
    Date of Patent: September 26, 2023
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Katsuya Tomizawa, Yoichi Takano, Meguru Ito, Eisuke Shiga
  • Curable composition, prepreg, resin sheet, metal foil-clad laminate and printed wiring board
    Patent number: 11718708
    Abstract: A curable composition is provided that includes an alkenyl phenol A, an epoxy-modified silicone B, an epoxy compound C other than the epoxy-modified silicone B, and a thermosetting resin E, in which the thermosetting resin E contains one or more selected from the group consisting of a maleimide compound, a cyanate ester compound, a phenolic compound, an alkenyl-substituted nadimide compound, and an epoxy compound.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: August 8, 2023
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Katsuya Tomizawa, Mayumi Kikuchi, Hidetoshi Kawai
  • Resin composition for printed wiring board, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board
    Patent number: 11702504
    Abstract: A resin composition for a printed wiring board, including: a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F), wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: July 18, 2023
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Shohei Yamaguchi, Katsuya Tomizawa, Norihiro Shida, Hidetoshi Kawai
  • Curable composition, prepreg, resin sheet, metal foil-clad laminate and printed wiring board
    Patent number: 11499005
    Abstract: A curable composition containing an alkenyl phenol A, an epoxy-modified silicone B, and an epoxy compound C other than the epoxy-modified silicone B.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: November 15, 2022
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Katsuya Tomizawa, Mayumi Kikuchi, Hidetoshi Kawai
  • CURABLE COMPOSITION, PREPREG, RESIN SHEET, METAL FOIL-CLAD LAMINATE AND PRINTED WIRING BOARD
    Publication number: 20220325034
    Abstract: A curable composition is provided that includes an alkenyl phenol A, an epoxy-modified silicone B, an epoxy compound C other than the epoxy-modified silicone B, and a thermosetting resin E, in which the thermosetting resin E contains one or more selected from the group consisting of a maleimide compound, a cyanate ester compound, a phenolic compound, an alkenyl-substituted nadimide compound, and an epoxy compound.
    Type: Application
    Filed: June 21, 2022
    Publication date: October 13, 2022
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Katsuya TOMIZAWA, Mayumi KIKUCHI, Hidetoshi KAWAI
  • RESIN COMPOSITION, PREPREG, RESIN SHEET, METAL FOIL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD
    Publication number: 20220076859
    Abstract: A resin composition comprising a maleimide compound, a cyanate ester compound, a silane compound having a styrene skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.
    Type: Application
    Filed: November 16, 2021
    Publication date: March 10, 2022
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Katsuya TOMIZAWA, Yoichi TAKANO, Meguru ITO, Eisuke SHIGA
  • Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board
    Patent number: 11195638
    Abstract: A resin composition that includes a maleimide compound, an alkenyl-substituted nadimide, a silane compound having a styrene skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: December 7, 2021
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Katsuya Tomizawa, Yoichi Takano, Meguru Ito, Eisuke Shiga
  • RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, PRINTED WIRING BOARD, AND MULTILAYER PRINTED WIRING BOARD
    Publication number: 20210301071
    Abstract: A resin composition for a printed wiring board, including: a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F), wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.
    Type: Application
    Filed: June 28, 2019
    Publication date: September 30, 2021
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Shohei YAMAGUCHI, Katsuya TOMIZAWA, Norihiro SHIDA, Hidetoshi KAWAI
  • CURABLE COMPOSITION, PREPREG, RESIN SHEET, METAL FOIL-CLAD LAMINATE AND PRINTED WIRING BOARD
    Publication number: 20210261722
    Abstract: A curable composition containing an alkenyl phenol A, an epoxy-modified silicone B, and an epoxy compound C other than the epoxy-modified silicone B.
    Type: Application
    Filed: July 11, 2019
    Publication date: August 26, 2021
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Katsuya TOMIZAWA, Mayumi KIKUCHI, Hidetoshi KAWAI
  • THERMOSETTING COMPOSITION, PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, PRINTED WIRING BOARD, AND MULTILAYER PRINTED WIRING BOARD
    Publication number: 20210147614
    Abstract: A thermosetting composition including at least a thermosetting compound, the thermosetting composition satisfying relationships represented by formulas (i) and (ii) below: 0.80?b/a?0.98??(i), and 0.05?c/a?0.30??(ii), wherein a, b, and c represent storage moduli (unit: GPa) at 30° C., 100° C., and 260° C., respectively, of a cured product formed by curing a prepreg obtained by impregnating or coating a base material with the thermosetting composition.
    Type: Application
    Filed: April 17, 2019
    Publication date: May 20, 2021
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Hiroaki TADOKORO, Shohei YAMAGUCHI, Katsuya TOMIZAWA, Hidetoshi KAWAI
  • Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board
    Patent number: 10815349
    Abstract: It is intended to provide a resin composition that suppresses the thermal expansion of a printed circuit board more than ever and also prevents the bleedout of substances from the printed circuit board, while maintaining a high glass transition temperature. The resin composition of the present invention contains an alkenyl-substituted nadimide, a maleimide compound, and an epoxy-modified cyclic silicone compound.
    Type: Grant
    Filed: July 4, 2016
    Date of Patent: October 27, 2020
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Katsuya Tomizawa, Tomoki Hamajima, Shohei Yamaguchi, Eisuke Shiga, Meguru Ito
  • Resin composition and prepreg, resin sheet, laminate, and printed circuit board comprising same
    Patent number: 10717837
    Abstract: The present invention provides a resin composition containing an alkenyl-substituted nadimide and a perinone-based colorant, wherein the content of the perinone-based colorant is 0.8 parts by mass or less based on 100 parts by mass in total of resin-constituting components in the resin composition.
    Type: Grant
    Filed: July 4, 2016
    Date of Patent: July 21, 2020
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Katsuya Tomizawa, Eisuke Shiga, Meguru Ito, Tomo Chiba
  • Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them
    Patent number: 10703874
    Abstract: The resin composition of the present invention comprises an alkenyl-substituted nadimide (A), a maleimide compound (B), and an amino-modified silicone (C).
    Type: Grant
    Filed: July 4, 2016
    Date of Patent: July 7, 2020
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yoichi Takano, Nobuyoshi Ohnishi, Katsuya Tomizawa, Naoki Kashima, Hiroshi Takahashi, Eisuke Shiga
  • Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board
    Patent number: 10676579
    Abstract: It is intended to provide a resin composition that serves as a raw material for a printed circuit board excellent in heat resistance after moisture absorption and is excellent in moldability. The resin composition of the present invention contains a maleimide compound, a silane compound having a carbon-carbon unsaturated bond and a hydrolyzable group or a hydroxy group, a silane compound having an epoxy skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.
    Type: Grant
    Filed: July 4, 2016
    Date of Patent: June 9, 2020
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Katsuya Tomizawa, Yoichi Takano, Meguru Ito, Eisuke Shiga
  • RESIN COMPOSITION, PREPREG, RESIN SHEET, METAL FOIL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD
    Publication number: 20200152349
    Abstract: A resin composition that includes a maleimide compound, an alkenyl-substituted nadimide, a silane compound having a styrene skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.
    Type: Application
    Filed: January 16, 2020
    Publication date: May 14, 2020
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Katsuya TOMIZAWA, Yoichi TAKANO, Meguru ITO, Eisuke SHIGA
  • Resin composition and prepreg, resin sheet, laminate, and printed circuit board
    Patent number: 10563029
    Abstract: A resin composition containing a compound represented by the following general formula (a) or the following general formula (b), an alkenyl-substituted nadimide compound, and a maleimide compound: wherein Ra represents a group represented by the following general formula (c),
    Type: Grant
    Filed: July 4, 2016
    Date of Patent: February 18, 2020
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yoichi Takano, Katsuya Tomizawa, Takashi Kubo, Tomo Chiba, Eisuke Shiga
  • Resin composition, prepreg, metal foil-clad laminate, and printed circuit board
    Patent number: 10550228
    Abstract: The present invention provides a resin composition containing an allyl group-containing compound (A) and a maleimide compound (B), in which the allyl group-containing compound (A) has a reactive functional group other than an allyl group.
    Type: Grant
    Filed: July 4, 2016
    Date of Patent: February 4, 2020
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Naoki Kashima, Katsuya Tomizawa, Meguru Ito, Tomoki Hamajima, Eisuke Shiga, Kentaro Takano, Shota Koga
  • Insulating layer for printed circuit board and printed circuit board
    Patent number: 10292260
    Abstract: The present invention provides an insulating layer for printed circuit boards having a difference of within 20% between the flexural modulus at 25° C. and the flexural modulus under heat at 250° C.
    Type: Grant
    Filed: January 6, 2015
    Date of Patent: May 14, 2019
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Katsuya Tomizawa, Tomo Chiba, Meguru Ito, Eisuke Shiga
  • Resin composition, prepreg, laminate, metal foil-clad laminate, and printed-wiring board
    Patent number: 10138393
    Abstract: The present invention provides a resin composition including: nanoparticles (A) of alumina and/or boehmite having an average particle size of 1.0 nm to 100 nm; fine particles (B) having an average particle size of 0.20 ?m to 100 ?m; and a thermosetting resin (C), wherein the nanoparticles (A) have their surfaces treated with a polysiloxane-based modifier.
    Type: Grant
    Filed: January 14, 2014
    Date of Patent: November 27, 2018
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Katsuya Tomizawa, Tomo Chiba, Hiroshi Takahashi, Eisuke Shiga, Daisuke Ueyama, Kentaro Nomizu
  • RESIN COMPOSITION, PREPREG, RESIN SHEET, METAL FOIL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD
    Publication number: 20180197655
    Abstract: It is intended to provide a resin composition that serves as a raw material for a printed circuit board excellent in chemical resistance, desmear resistance, and insulation reliability. The resin composition of the present invention contains a maleimide compound, a silane compound having a styrene skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.
    Type: Application
    Filed: July 4, 2016
    Publication date: July 12, 2018
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Katsuya TOMIZAWA, Yoichi TAKANO, Meguru ITO, Eisuke SHIGA