Abstract: A resin composition containing a compound represented by the following general formula (a) or the following general formula (b), an alkenyl-substituted nadimide compound, and a maleimide compound: wherein Ra represents a group represented by the following general formula (c),

Abstract: The present invention provides a resin composition containing an allyl group-containing compound (A) and a maleimide compound (B), in which the allyl group-containing compound (A) has a reactive functional group other than an allyl group.

Abstract: It is intended to provide a resin composition that suppresses the thermal expansion of a printed circuit board more than ever and also prevents the bleedout of substances from the printed circuit board, while maintaining a high glass transition temperature. The resin composition of the present invention contains an alkenyl-substituted nadimide, a maleimide compound, and an epoxy-modified cyclic silicone compound.

Abstract: The resin composition of the present invention comprises an alkenyl-substituted nadimide (A), a maleimide compound (B), and an amino-modified silicone (C).

Abstract: The present invention provides a resin composition containing an alkenyl-substituted nadimide and a perinone-based colorant, wherein the content of the perinone-based colorant is 0.8 parts by mass or less based on 100 parts by mass in total of resin-constituting components in the resin composition.

Abstract: It is intended to provide a method for producing a printed circuit board capable of enhancing the adhesion between the inorganic filler-containing insulating layer and the conductor layer of a printed circuit board. The method for producing a printed circuit board of the present invention is a method for producing a printed circuit board, having an alkali treatment step of bringing a surface of an insulating layer for a printed circuit board into contact with an aqueous alkali solution, and a conductor layer forming step of forming a conductor layer on at least a part of the surface of the insulating layer that has undergone the alkali treatment step, wherein the insulating layer contains a resin composition containing a thermosetting resin, a silane compound having a (meth)acrylic skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.

Abstract: It is intended to provide a resin composition that serves as a raw material for a printed circuit board excellent in heat resistance after moisture absorption and is excellent in moldability. The resin composition of the present invention contains a maleimide compound, a silane compound having a carbon-carbon unsaturated bond and a hydrolyzable group or a hydroxy group, a silane compound having an epoxy skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.

Abstract: A resin composition containing a cyclic epoxy-modified silicone compound (A) represented by formula (1), a cyanic acid ester compound (B) and/or a phenol resin (C) and an inorganic filler (D): wherein Ra each independently represent an organic group having an epoxy group; Rb each independently represent a substituted or unsubstituted monovalent hydrocarbon group; x represents an integer of 0 to 2; and y represents an integer of 1 to 6; and the siloxane unit marked with x and the siloxane unit marked with y are arranged mutually at random.

Abstract: The present invention provides an insulating layer for printed circuit boards having a difference of within 20% between the flexural modulus at 25° C. and the flexural modulus under heat at 250° C.

Abstract: The present invention provides a resin composition including: nanoparticles (A) of alumina and/or boehmite having an average particle size of 1.0 nm to 100 nm; fine particles (B) having an average particle size of 0.20 ?m to 100 ?m; and a thermosetting resin (C), wherein the nanoparticles (A) have their surfaces treated with a polysiloxane-based modifier.

Abstract: A resin composition containing a cyclic epoxy-modified silicone compound (A) represented by formula (1), a cyanic acid ester compound (B) and/or a phenol resin (C) and an inorganic filler (D): wherein Ra each independently represent an organic group having an epoxy group; Rb each independently represent a substituted or unsubstituted monovalent hydrocarbon group; x represents an integer of 0 to 2; and y represents an integer of 1 to 6; and the siloxane unit marked with x and the siloxane unit marked with y are arranged mutually at random.