Abstract: A semiconductor substrate has, on an Au electrode pad, an electrolessly-plated Ni film/an electrolessly-plated Pd film/an electrolessly-plated Au film or an electrolessly-plated Ni film/an electrolessly-plated Au film and a method of manufacturing the semiconductor substrate by the steps indicated in (1) to (6) below: (1) a degreasing step; (2) an etching step; (3) a pre-dipping step; (4) a Pd catalyst application step; (5) an electroless Ni plating step; (6) an electroless Pd plating step and electroless Au plating step or an electroless Au plating step.

Abstract: A semiconductor wafer suppressed in voids produced in the interface between a passivation film and an electroless nickel plating film, and configured such that an electrode pad is entirely covered by the electroless nickel plating film. The semiconductor wafer includes, on a substrate, an electrode pad and a passivation film covering the upper surface of the substrate and an opening from which the electrode pad is exposed. The semiconductor wafer sequentially includes, on the electrode pad, an electroless nickel plating film, an electroless palladium plating film and an electroless gold plating film. A void, present in the interface between the passivation film and the electroless nickel plating film, has a length from the forefront of the void to the surface of the electrode pad of 0.3 ?m or more and a width of 0.2 ?m or less. The electrode pad is entirely covered by the electroless nickel plating film.

Abstract: A semiconductor substrate has, on an Au electrode pad, an electrolessly-plated Ni film/an electrolessly-plated Pd film/an electrolessly-plated Au film or an electrolessly-plated Ni film/an electrolessly-plated Au and a method of manufacturing the semiconductor substrate by the steps indicated in (1) to (6) below: (1) a degreasing step; (2) an etching step; (3) a pre-dipping step; (4) a Pd catalyst application step; (5) an electroless Ni plating step; (6) an electroless Pd plating step and electroless Au plating step or an electroless Au plating step.

Abstract: A semiconductor wafer suppressed in voids produced in the interface between a passivation film and an electroless nickel plating film, and configured such that an electrode pad is entirely covered by the electroless nickel plating film. The semiconductor wafer includes, on a substrate, an electrode pad and a passivation film covering the upper surface of the substrate and an opening from which the electrode pad is exposed. The semiconductor wafer sequentially includes, on the electrode pad, an electroless nickel plating film, an electroless palladium plating film and an electroless gold plating film. A void, present in the interface between the passivation film and the electroless nickel plating film, has a length from the forefront of the void to the surface of the electrode pad of 0.3 ?m or more and a width of 0.2 ?m or less. The electrode pad is entirely covered by the electroless nickel plating film.

Abstract: The invention provides a two-layer flexible substrate free of surface defects and having excellent etching characteristics and adherence to a resist. The two-layer flexible substrate has a copper layer provided on one or both faces of an insulator film without using an adhesive, wherein the surface roughness (Ra) of the copper layer is 0.10 to 0.25 ?m, and wherein the average crystal grain size [of copper] is no greater than 0.8 ?m at 1 ?m from the insulator film in the cross-section of the copper layer. Preferably, the insulator film is a polyimide film.

Abstract: The object of the present invention is to obtain a low profile electrolytic copper foil with a low surface roughness at the rough surface side (opposite side from the glossy side) in the electrolytic copper foil manufacture using a cathode drum and, particularly, to obtain an electrolytic copper foil with excellent elongation and tensile strength that permits fine patterning. Another object is to obtain a copper electrolytic solution that allows uniform copper plating without pinholes on a 2-layer flexible substrate. This copper electrolytic solution contains, as an additive, a compound having the specific skeleton represented by General Formula (1) below which is obtained by an addition reaction in which water is added to a compound having in a molecule one or more epoxy groups: wherein A is an epoxy compound residue and n is an integer of 1 or more.

Abstract: The object of the present invention is to obtain a low profile electrolytic copper foil with low surface roughness at the rough surface side (opposite side from the glossy side) in the electrolytic copper foil manufacture using a cathode drum, and particularly to obtain an electrolytic copper foil with excellent elongation and tensile strength that permits fine patterning. Another object is to obtain a copper electrolytic solution that allows uniform copper plating without pinholes on a 2-layer flexible substrate. This copper electrolytic solution comprises as an additive a compound having the specific skeleton represented by General Formula (1) below which is obtained by an addition reaction in which water is added to a compound having in a molecule one or more epoxy groups: wherein A is an epoxy compound residue and n is an integer of 1 or more.

Abstract: A surface treated copper foil with improved adhesion to the insulating resin of a copper-clad laminate for higher frequency applications contains a copper foil provided with a heat-resistant layer and an olefin-based silane coupling agent layer sequentially on at least one side thereof. An anticorrosive treatment may be performed after the heat resistance treatment. The copper foil is preferably an electrolytic copper foil, and these layers can be provided on the S side and/or the M side thereof. The copper foil has an adequate adhesive strength, even without the roughening treatment that has been performed in the past. A film of zinc, zinc-tin, zinc-nickel, zinc-cobalt, copper-zinc, copper-nickel-cobalt, or nickel-cobalt can be used favorably as the heat-resistant layer, and a film that has undergone a zinc-chromate or a chromate treatment can be used favorably as the anticorrosive layer.

Abstract: The invention provides a two-layer flexible substrate free of surface defects and having excellent etching characteristics and adherence to resist. The two-layer flexible substrate has a copper layer provided on one or both faces of an insulator film without using an adhesive, wherein the surface roughness (Ra) of the copper layer is 0.10 to 0.25 ?m, and wherein the average crystal grain size [of copper] is no greater than 0.8 ?m at 1 ?m from the insulator film in the cross section of the copper layer. Preferably, the insulator film is a polyimide film.

Abstract: There are provided a composition for functioning as an effective additive for epoxy resin that is solid at room temperature and has high storage stability, and a method thereof. The composition of the present invention is a basic silane coupling agent organic carboxylate composition obtained by first synthesizing an organic carboxylate of a basic silane coupling agent by reacting a basic silane coupling agent and an organic carboxylic acid, and subsequently heating and mixing the organic carboxylate of the basic silane coupling agent with a compound exhibiting good affinity for the basic silane coupling agent or organic carboxylic acid and having a softening point or melting point of 40° C. or greater.

Abstract: The object of the present invention is to obtain a low profile electrolytic copper foil with low surface roughness at the rough surface side (opposite side from the glossy side) in the electrolytic copper foil manufacture using a cathode drum, and particularly to obtain an electrolytic copper foil with excellent elongation and tensile strength that permits fine patterning. Another object is to obtain a copper electrolytic solution that allows uniform copper plating without pinholes on a 2-layer flexible substrate. This copper electrolytic solution comprises as an additive a compound having the specific skeleton represented by General Formula (1) below which is obtained by an addition reaction in which water is added to a compound having in a molecule one or more epoxy groups: wherein A is an epoxy compound residue and n is an integer of 1 or more.

Abstract: As a resin composition that solves the problems such as unpleasant odor encountered when a tertiary amine compound is used as a catalyst in a reaction of a polyol and a polyisocyanate, and that promotes the curing of these resins and improves adhesion to metals, inorganic materials, and organic materials, the present invention provides a resin composition containing the following components as essential components, (A) a polyol (B) a polyisocyanate (C) a silane coupling agent containing an imidazole group (here, the ratio NCO/OH of the number of isocyanate groups in the polyisocyanate (B) to the number of hydroxyl groups in the polyol (A) in the above composition is from 0.6 to 4.0, and the weight ratio of {(A)+(B)}:(C) is from 100:0.01 to 100:10).

Abstract: There are provided a composition for functioning as an effective additive for epoxy resin that is solid at room temperature and has high storage stability, and a method thereof. The composition of the present invention is a basic silane coupling agent organic carboxylate composition obtained by first synthesizing an organic carboxylate of a basic silane coupling agent by reacting a basic silane coupling agent and an organic carboxylic acid, and subsequently heating and mixing the organic carboxylate of the basic silane coupling agent with a compound exhibiting good affinity for the basic silane coupling agent or organic carboxylic acid and having a softening point or melting point of 40° C. or greater.

Abstract: It is an object of the present invention to provide a non-gelling solid silane coupling agent which enhances adhesion of a resin composition to metals and so forth when added to the resin composition, and which has excellent storage stability and molten fluidity. The present invention is a non-gelling, pulverizable, solid silane coupling agent composition composed of a reaction product of the following components.

Abstract: There is provided a composition for functioning as an effective additive for an epoxy resin that is a solid at room temperature and has a high storage stability, and a method thereof. The composition of the present invention is a basic silane coupling agent organic carboxylate composition obtained by first synthesizing an organic carboxylate of a basic silane coupling agent by reacting a basic silane coupling agent and an organic carboxylic acid, and subsequently heating and mixing the organic carboxylate of the basic silane coupling agent with a compound exhibiting a good affinity for the basic silane coupling agent or organic carboxylic acid and having a softening point or melting point of 40° C. or greater.

Abstract: It is an object of the present invention to provide a non-gelling solid silane coupling agent which enhances adhesion of a resin composition to metals and so forth when added to the resin composition, and which has excellent storage stability and molten fluidity. The present invention is a non-gelling, pulverizable, solid silane coupling agent composition composed of a reaction product of the following components.

Abstract: A water-based metal surface treatment agent for the surface treatment of metals including aluminum products such as pre-coated aluminum sheets gives excellent coating film adhesion, flexibility and acid resistance. The water-based metal surface treatment agent contains the following components (1) to (3): (1) A copolymer, containing in a side chain, a diketene or ketoester capable of switching between keto and enol tautomeric forms, and containing at least one hydrophilic side chain containing a cationic group, an anionic group, or a nonionic group; (2) An epoxy resin modified with a phosphoric acid type compound; and (3) A water-soluble curing agent.

Abstract: The present invention provides an organic carboxylate composition that has long working life, cures epoxy resins, and improves adhesive properties, and also provides a method for producing the same. An organic carboxylate composition, obtained by heating and mixing a basic silane coupling agent and an amine compound with a softening point or melting point of 40° C. or greater together with an organic carboxylic acid; a method for producing the same; an additive for epoxy resin that contains this as the active ingredient thereof; and an epoxy resin composition containing the same. The basic silane coupling agent should preferably be a specific imidazole-group containing silane coupling agent, amino group-containing silane coupling agent, dialkylamino group-containing silane coupling agent, monomethylamino group-containing silane coupling agent, benzimidazole group-containing silane coupling agent, benzotriazole group-containing silane coupling agent, and pyridine ring-containing silane coupling agent.

Abstract: The present invention provides a surface treatment agent that endows a copper foil with excellent adhesion to insulating resins. The surface treatment agent of the present invention has as its active components an organosilicic compound expressed by a following General Formula (1) and/or an organosilicic compound expressed by a General Formula (2) and an olefin-based silane coupling agent. The surface treatment agent of the present invention provides particularly excellent adhesion between an insulating resin and a low-profile copper foil used for a high-frequency-adaptable substrate. In Formulas (1) and (2), R1 is a hydroxyl group or a C1 to C5 alkyl group, and R2 is a C1 to C10 alkylene group that may contain oxygen.

Abstract: The present invention provides a surface treated copper foil with improved adhesion to the insulating resin of a copper-clad laminate for higher frequency applications.