Patents by Inventor Katsuyuki Tsuchida

Katsuyuki Tsuchida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040149167
    Abstract: The present invention provides a surface treatment agent that endows a copper foil with excellent adhesion to insulating resins.
    Type: Application
    Filed: May 1, 2003
    Publication date: August 5, 2004
    Inventors: Katsuyuki Tsuchida, Masashi Kumagai, Fumiaki Akase
  • Publication number: 20040077751
    Abstract: The present invention provides an organic carboxylate composition that has long working life, cures epoxy resins, and improves adhesive properties, and also provides a method for producing the same. An organic carboxylate composition, obtained by heating and mixing a basic silane coupling agent and an amine compound with a softening point or melting point of 40° C. or greater together with an organic carboxylic acid; a method for producing the same; an additive for epoxy resin that contains this as the active ingredient thereof; and an epoxy resin composition containing the same. The basic silane coupling agent should preferably be a specific imidazole-group containing silane coupling agent, amino group-containing silane coupling agent, dialkylamino group-containing silane coupling agent, monomethylamino group-containing silane coupling agent, benzimidazole group-containing silane coupling agent, benzotriazole group-containing silane coupling agent, and pyridine ring-containing silane coupling agent.
    Type: Application
    Filed: June 25, 2003
    Publication date: April 22, 2004
    Inventors: Masashi Kumagat, Takashi Ouchi, Katsuyuki Tsuchida
  • Patent number: 6710181
    Abstract: The present invention provides a novel imidazole/organic monocarboxylic acid salt derivative reaction product capable of improving the adhesion between a resin and a metal such as copper, steel or aluminum, or an inorganic material such as glass fiber, silica, aluminum oxide or aluminum hydroxide, a method for producing this imidazole/organic monocarboxylic acid salt derivative reaction product, and a surface treatment agent, resin additive and resin composition that use this imidazole/organic monocarboxylic acid salt derivative reaction product. The above imidazole/organic monocarboxylic acid salt derivative reaction product is obtained by reacting an imidazole compound represented by undermentioned general formula (1) with a silane compound having a glycidoxy group represented by undermentioned general formula (2) at 80 to 200° C., and then reacting the product thus obtained with an organic monocarboxylic acid at 50 to 200° C.
    Type: Grant
    Filed: September 5, 2001
    Date of Patent: March 23, 2004
    Assignee: Nikko Materials Co., Ltd.
    Inventors: Masashi Kumagai, Katsuyuki Tsuchida
  • Publication number: 20040034136
    Abstract: There are provided a composition for functioning as an effective additive for epoxy resin that is solid at room temperature and has high storage stability, and a method thereof. The composition of the present invention is a basic silane coupling agent organic carboxylate composition obtained by first synthesizing an organic carboxylate of a basic silane coupling agent by reacting a basic silane coupling agent and an organic carboxylic acid, and subsequently heating and mixing the organic carboxylate of the basic silane coupling agent with a compound exhibiting good affinity for the basic silane coupling agent or organic carboxylic acid and having a softening point or melting point of 40° C. or greater.
    Type: Application
    Filed: June 12, 2003
    Publication date: February 19, 2004
    Inventors: Masashi Kumagai, Takashi Ouchi, Katsuyuki Tsuchida
  • Patent number: 6605356
    Abstract: A metal surface treatment agent containing the following components (A) to (D), which securely adheres to a metal substrate such as aluminum, exhibits excellent corrosion preventive properties, even with a thin film thickness, and has excellent plasticity and adhesion to paints. (A) at least one organosilicon compound having three carbonyl groups and at least one alkoxysilyl group, the organosilicon compound being present in a weight ratio of 5 to 15, based on the total of the components (A) to (D) being 100; (B) at least one epoxy resin modified with an alkanolamine, the modified epoxy resin being present in a weight ratio of 10 to 30 relative to the above total; (C) at least one blocked polyisocyanate present in a weight ratio of 50 to 70 relative to the above total; and (D) at least one amino resin present in a weight ratio of ratio 5 to 15 relative to the above total.
    Type: Grant
    Filed: December 10, 2001
    Date of Patent: August 12, 2003
    Assignee: Nikko Materials Co., Ltd.
    Inventors: Takashi Ouchi, Katsuyuki Tsuchida, Masashi Kumagai
  • Publication number: 20030088108
    Abstract: The present invention provides a novel imidazole/organic monocarboxylic acid salt derivative reaction product capable of improving the adhesion between a resin and a metal such as copper, steel or aluminum, or an inorganic material such as glass fiber, silica, aluminum oxide or aluminum hydroxide, a method for producing this imidazole/organic monocarboxylic acid salt derivative reaction product, and a surface treatment agent, resin additive and resin composition that use this imidazole/organic monocarboxylic acid salt derivative reaction product.
    Type: Application
    Filed: September 5, 2001
    Publication date: May 8, 2003
    Inventors: Masashi Kumagai, Katsuyuki Tsuchida
  • Patent number: 6551711
    Abstract: A metal-polymer composite comprises a metal and substrate layer disposed on the metal, wherein the substrate layer is formed from a curable thermosetting resin system comprising a curing agent and about 0.1 to 100 weight percent (wt %), preferably about 0.2 to about 80 wt %, more preferably about 0.4 to about 60 wt %, and most preferably about 2 to about 40 wt % of an episulfide, and further wherein the resin system is cured in the presence of the metal. In another embodiment, the thermosetting system comprises about 0.1 to about 50 wt %, preferably about 1 to about 40 wt % and more preferably about 2 to about 30 wt % of at least one episulfide resin, at least one epoxy resin reactive therewith, and a curing agent, wherein the resin system is cured in the presence of a metal, such as a layer of copper or gold. A preferred epoxy resin is the diglycidyl ether of bisphenol A, which is the condensation product of bisphenol A and epichlorohydrin (hereinafter abbreviated “DGEBA”).
    Type: Grant
    Filed: June 19, 2000
    Date of Patent: April 22, 2003
    Assignee: The University of Connecticut
    Inventors: James P. Bell, Katsuyuki Tsuchida
  • Publication number: 20030054174
    Abstract: A metal surface treatment agent comprising the following components (A) to (D), which securely adheres to a metal substrate such as aluminum, exhibits excellent corrosion preventive properties even with a thin film thickness, and has excellent plasticity and adhesion to paints.
    Type: Application
    Filed: December 10, 2001
    Publication date: March 20, 2003
    Inventors: Takashi Ouchi, Katsuyuki Tsuchida, Masashi Kumagai
  • Publication number: 20030017343
    Abstract: A water-based metal surface treatment agent that is for the surface treatment of metals including aluminum products such a as pre-coated aluminum sheets and gives excellent coating film adhesion, flexibility and acid resistance is provided.
    Type: Application
    Filed: July 8, 2002
    Publication date: January 23, 2003
    Inventors: Takashi Ouchi, Katsuyuki Tsuchida, Masashi Kumagai
  • Patent number: 5258522
    Abstract: This present invention provides a novel imidazole-silane compound which has an excellent heat resistance and a high corrosion preventive effect on metal surface and is capable of remarkably improving the adhesion of a metal to a resin substrate, a process for preparing such a compound, and a new metal surface finishing agent comprising the same. The novel imidazole-silane compound is represented by the general formula (1), (2) or (3) as defined in claims and produced by reacting an imidazole compound of the general formula (4) with a 3-glycidoxypropylsilane compound of the general formula (5) at a temperature of 80.degree. to 200.degree. C.
    Type: Grant
    Filed: July 22, 1992
    Date of Patent: November 2, 1993
    Assignee: Nippon Mining Co., Ltd.
    Inventors: Katsuyuki Tsuchida, Masashi Kumagai, Yukio Ogino