Patents by Inventor Kaveh Azar
Kaveh Azar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11859915Abstract: Embodiments relate to a system and method for dissipating heat from a heat generating component. The system and method an assembly of a fenestrated housing and a plenum and positioning of the assembly relate to the heat generating component. The plenum accommodates a fluid mover relative to the fenestrated housing. The fenestrations function to support multi-directional fluid flow created by the fluid mover and accommodated by the fenestrations, which function as ports to direct fluid with respect to the heat generating component.Type: GrantFiled: January 31, 2019Date of Patent: January 2, 2024Assignee: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Bahman Tavassoli-Hojati
-
Patent number: 11653478Abstract: Embodiments relate to a system, an apparatus, and a method that involve a plurality of stackable enclosure units that include inter-unit or inter-module passages for facilitating cooling of interior compartments of the units, especially server units.Type: GrantFiled: April 19, 2021Date of Patent: May 16, 2023Assignee: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Geng Qian, Anatoly Pikovsky
-
Patent number: 10955202Abstract: Embodiments relate to a system with a primary body in communication with at least one heat source. A chamber housed within the primary body includes a boundary to separate the heat source from fluid contact and a secondary body housed in the chamber. The secondary body includes a conduit and a cover in communication with the conduit wherein the cover has a fluid flow inlet extending into the conduit and the conduit includes a series of convection ports to exhaust fluid into the chamber. Upon surging through the convection ports, the fluid comes in contact with the plenum of the primary body and dissipates the heat generated from the heat source and transferred to the primary body. An outlet, separate from the inlet, removes the fluid from the chamber.Type: GrantFiled: June 28, 2017Date of Patent: March 23, 2021Assignee: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Bahman Tavassoli-Hojati, Anatoly Pikovsky
-
Patent number: 10692798Abstract: Embodiments of the invention related to using the fin length of the heat sink extending from an entrance of the heat sink to an interior sectional wall as the heat transfer element to achieve high thermal performance. The sectional wall(s) of the heat sink function to isolate fluid flow communication between the heat sink sections of fin fields, thereby preventing a flow coupling between the fin fields.Type: GrantFiled: April 9, 2015Date of Patent: June 23, 2020Assignee: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Bahman Tavassoli-Hojati
-
Publication number: 20180003451Abstract: Embodiments relate to a system with a primary body in communication with at least one heat source. A chamber housed within the primary body includes a boundary to separate the heat source from fluid contact and a secondary body housed in the chamber. The secondary body includes a conduit and a cover in communication with the conduit wherein the cover has a fluid flow inlet extending into the conduit and the conduit includes a series of convection ports to exhaust fluid into the chamber. Upon surging through the convection ports, the fluid comes in contact with the plenum of the primary body and dissipates the heat generated from the heat source and transferred to the primary body. An outlet, separate from the inlet, removes the fluid from the chamber.Type: ApplicationFiled: June 28, 2017Publication date: January 4, 2018Applicant: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Bahman Tavassoli-Hojati, Anatoly Pikovsky
-
Publication number: 20150296662Abstract: Embodiments of the invention related to using the fin length of the heat sink extending from an entrance of the heat sink to an interior sectional wall as the heat transfer element to achieve high thermal performance. The sectional wall(s) of the heat sink function to isolate fluid flow communication between the heat sink sections of fin fields, thereby preventing a flow coupling between the fin fields.Type: ApplicationFiled: April 9, 2015Publication date: October 15, 2015Applicant: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Bahman Tavassoli-Hojati
-
Patent number: 8125782Abstract: A heat sink assembly mount is provided. Generally the invention has a frame clip and a spring clip. The frame clip has one or more inwardly extending tabs and two or more vertically extending side portions. The one or more tabs are sized to fit over and removably couple to a heat producing device. The distance between the two or more vertically extending side portions is sized to hold a base portion of a heat sink and prevent horizontal motion of the heat sink. The spring clip couples to the frame clip and has a spring bias sized to produce a vertical force that presses the heat sink against a heat producing device.Type: GrantFiled: July 28, 2009Date of Patent: February 28, 2012Assignee: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Joseph P. Mennucci, Carlo Mandrone
-
Patent number: 8063485Abstract: A board mounted integrated electronics package assembly is provided with one or more securing elements to attach a heat dissipating device directly to the package. The securing element(s) is located along a periphery of the package and anchors a base of the heat dissipating device to the package, thereby eliminating employment of a secondary heat dissipating material between the package and the heat dissipating device.Type: GrantFiled: June 27, 2008Date of Patent: November 22, 2011Assignee: Advanced Thermal Solutions, Inc.Inventor: Kaveh Azar
-
Publication number: 20100200206Abstract: Apparatus and method for making a heat sink assembly. The apparatus includes a first clip configured to be urgingly attached to a heat producing device, the first clip having a first edge, a second edge, a third edge, and a fourth edge. The apparatus further includes a heat sink configured to be attached to the first clip, and a second clip configured to be attached to the first clip, the second clip being sized to accommodate a portion of the heat sink, and the second clip urging the heat sink towards the heat producing device. Methods to make the foregoing apparatus are also described.Type: ApplicationFiled: February 12, 2009Publication date: August 12, 2010Inventors: Carlo Mandrone, Joseph P. Mennucci, Kaveh Azar
-
Publication number: 20100097760Abstract: An apparatus and a method for impingement cooling. The apparatus may include a plenum having a fluid. The plenum may be configured to contact a plate. A duct may be attached to the plate, wherein the duct may include a hole configured to pass the fluid, such as an air or a gas. A heat source, such as an electric or electronic component, may be located proximate to the hole, such as on a printed circuit board. The hole may be configured to make a contact between the fluid and the heat source. Methods to make the foregoing structure are also described.Type: ApplicationFiled: October 20, 2008Publication date: April 22, 2010Inventors: Kaveh Azar, Bahman Tavassoli Hojati
-
Publication number: 20100018670Abstract: A heat sink assembly mount is provided. Generally the invention has a frame clip and a spring clip. The frame clip has one or more inwardly extending tabs and two or more vertically extending side portions. The one or more tabs are sized to fit over and removably couple to a heat producing device. The distance between the two or more vertically extending side portions is sized to hold a base portion of a heat sink and prevent horizontal motion of the heat sink. The spring clip couples to the frame clip and has a spring bias sized to produce a vertical force that presses the heat sink against a heat producing device.Type: ApplicationFiled: July 28, 2009Publication date: January 28, 2010Applicant: ADVANCED THERMAL SOLUTIONS, INC.Inventors: Kaveh Azar, Joseph P. Mennucci, Carlo Mandrone
-
Patent number: 7567435Abstract: A heat sink assembly mount is provided. Generally the invention has a frame clip and a spring clip. The frame clip has one or more inwardly extending tabs and two or more vertically extending side portions. The one or more tabs are sized to fit over and removably couple to a heat producing device. The distance between the two or more vertically extending side portions is sized to hold a base portion of a heat sink and prevent horizontal motion of the heat sink. The spring clip couples to the frame clip and has a spring bias sized to produce a vertical force that presses the heat sink against a heat producing device.Type: GrantFiled: March 7, 2005Date of Patent: July 28, 2009Assignee: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Joseph P. Mennucci, Carlo Mandrone
-
Publication number: 20060198107Abstract: A heat sink assembly mount is provided. Generally the invention has a frame clip and a spring clip. The frame clip has one or more inwardly extending tabs and two or more vertically extending side portions. The one or more tabs are sized to fit over and removably couple to a heat producing device. The distance between the two or more vertically extending side portions is sized to hold a base portion of a heat sink and prevent horizontal motion of the heat sink. The spring clip couples to the frame clip and has a spring bias sized to produce a vertical force that presses the heat sink against a heat producing device.Type: ApplicationFiled: March 7, 2005Publication date: September 7, 2006Inventors: Kaveh Azar, Joseph Mennucci, Carlo Mandrone
-
Patent number: 6691766Abstract: An electronics cooling system in accordance with the principles of the present invention includes an electronics cabinet that is thermally connected with the ground in the vicinity of the cabinet. The cabinet may or may not sit directly on the earth, but the thermal connection is made with the earth below, and in the near vicinity of, the cabinet, thereby employing the earth as a heat sink. In an illustrative embodiment, an enclosed cabinet includes a heat pipe that makes thermal contact with the ground in the immediate vicinity of the electronics cabinet. An electronics cabinet in accordance with the principles of the present invention is particularly suited for use in uncontrolled environments, such as may be encountered by remote telecommunications switches and wireless telecommunications equipment, for example.Type: GrantFiled: September 15, 2000Date of Patent: February 17, 2004Assignee: Lucent Technologies Inc.Inventor: Kaveh Azar
-
Patent number: D835590Type: GrantFiled: June 27, 2018Date of Patent: December 11, 2018Assignee: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Vineet Sunil Barot, Anatoly Pikovsky
-
Patent number: D837753Type: GrantFiled: June 27, 2018Date of Patent: January 8, 2019Assignee: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Vineet Sunil Barot, Anatoly Pikovsky
-
Patent number: D856944Type: GrantFiled: January 31, 2019Date of Patent: August 20, 2019Assignee: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Bahman Tavassoli-Hojati
-
Patent number: D856945Type: GrantFiled: January 31, 2019Date of Patent: August 20, 2019Assignee: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Bahman Tavassoli-Hojati
-
Patent number: D876372Type: GrantFiled: June 27, 2018Date of Patent: February 25, 2020Assignee: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Vineet Sunil Barot, Anatoly Pikovsky
-
Patent number: D877098Type: GrantFiled: June 27, 2018Date of Patent: March 3, 2020Assignee: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Vineet Sunil Barot, Anatoly Pikovsky