Abstract: One or more impingement plates, each of which includes one or more apertures, is located within an card cage running from top to bottom and from back to front of the card cage. Each impingement plate is located adjacent to one or more electronic components to be cooled. Channels formed on either side of the impingement plate allow for the ingress of a cooling fluid, the forcing of the cooling fluid through the one or more apertures within the impingement plate toward the electronics to be cooled, and the egress of the cooling fluid after it's contact with the electronics.

Abstract: A circuit board cooling system includes a thermally conductive element sandwiched between two circuit boards. The thermally conductive element of this thermal sandwich conducts heat away from both of the attached circuit cards. The thermally conductive element may be a solid slab of thermally conductive material, such as copper, it may be a hollow, substantially planar thermal conductor with an internally circulating cooling fluid, or it may be a substantially planar heat pipe, for example.

Abstract: A heat exchanger and a method of manufacturing the heat exchanger is disclosed for dissipating heat from a heat generating component. The heat exchanger comprises a thermally conductive base in thermal communication with the component, a plurality of thermally conductive plate fins affixed to the base wherein the plate fins define a fin field and channels, and fluid control for controlling the fluid flow within the fin field. The individual fins of the heat exchanger comprise textured regions positioned about a side surface of the fins and extending into an adjacent channel. The positioning of the textured regions function to minimize formation of high pressure within the fin field by disturbing the fluid flow passing along the fins. Alternatively or in conjunction with the above-outlined embodiments, the heat exchanger may comprise a fluid control feature for substantially preventing premature egress of fluid from a top region of the fin field caused by the high pressure region within the fin field.

Abstract: A integrated circuit cooling system includes a thermally conductive element sandwiched between two integrated circuits. The thermally conductive element of this thermal sandwich conducts heat away from both of the attached integrated circuits. The thermally conductive element may be a solid slab of thermally conductive material, such as copper, it may be a hollow, substantially planar thermal conductor with an internally circulating cooling fluid, or it may be a substantially planar heat pipe for example.

Abstract: A heat exchanger with a radial fin field. The fin field comprises a central region extending between the inlet and outlet regions. Along both sides of the central region are a plurality of fins extending from the inlet region to the outlet region at an angle to the central region, wherein the angular mounting increases progressively towards the respective sides of the heat exchanger. As such, the lengths of the fins in the fin field are not uniform. The layout of the fins in the fin field provide for a portion of the fluid passing through the fin field to be drawn out along the sides of the fin field via the shorter length fins and by low pressure formed along the sides from fluid flow by-pass. Accordingly, the fin field utilizes the low pressure created by flow bypass to vent relatively high pressure fluid within the fin field.

Abstract: A plurality of substantially similar fins is produced from the thermally conductive and formable sheet stock, for example aluminum or copper, preferably using a set of matched forming dies. Each die in the set produces a fin that is cupped in side elevation. Each fin has two flanges (in the preferred embodiment) extending from the base portion of the cup, and the fin is preferably rectangular in plan. The die cavities are substantially identical in geometry, but differ slightly in dimension so that the base portion of the cup-shaped fin-pair produced by each die in a set varies in width. Each die in the set includes a feature for producing a locating lug or dimple, or alternatively a hole, in each fin produced. The plurality of substantially geometrically identical, but dimensionally differing fin-pairs are then assembled in a nested stack in accordance with the invention.

Abstract: A heat exchanger is disclosed for dissipating heat from a heat generating component. The heat exchanger comprises a thermally conductive base in thermal communication with the component, a plurality of thermally conductive plate fins affixed to the base wherein the plate fins define a fin field and channels, and fluid control for controlling the fluid flow within the fin field. In a first embodiment of the invention, the heat exchanger comprises a flow guide extending over a top region of the fin field. The flow guide comprises a front portion adjacent to the inlet region of the fin field extending a predetermined distance in front of the fin field, and extending at an angle relative to the front plane of the fin field. The mounting of the flow guides across the top of the fin field and forward of the inlet region enhances acceleration of fluid flow at both the inlet and exhaust regions.

Abstract: A heat exchanger is disclosed for dissipating heat from a heat generating component. The heat exchanger comprises a thermally conductive base in thermal communication with the component, a plurality of thermally conductive plate fins affixed to the base wherein the plate fins define a fin field and channels, and fluid control for controlling the fluid flow within the fin field. Fluid flow enters the fin field at an inlet region and flows through the channels to an outlet region, i.e. from left to right across the figures illustrated. The heat exchanger of the present invention comprises a fin field having an open region formed by the novel configuration and layout of the individual fins forming the fin field. The open region may be formed in various sections of the heat exchanger for achieving the desired results. The open region reduces friction on fluid passing through the channels of the fin field.

Abstract: A heat exchanger and a method of manufacturing the heat exchanger is disclosed for dissipating heat from a heat generating component. The heat exchanger comprises a thermally conductive base in thermal communication with the component, a plurality of thermally conductive plate fins affixed to the base wherein the plate fins define a fin field and channels, and fluid control for controlling the fluid flow within the fin field. The individual fins of the heat exchanger comprise textured regions positioned about a side surface of the fins and extending into an adjacent channel. The positioning of the textured regions function to minimize formation of high pressure within the fin field by disturbing the fluid flow passing along the fins. Alternatively or in conjunction with the above-outlined embodiments, the heat exchanger may comprise a fluid control feature for substantially preventing premature egress of fluid from a top region of the fin field caused by the high pressure region within the fin field.

Abstract: A heat exchanger and a method of manufacturing the heat exchanger is disclosed for dissipating heat from a heat generating component. The heat exchanger comprises a thermally conductive base in thermal communication with the component, a plurality of thermally conductive plate fins affixed to the base wherein the plate fins define a fin field and channels, and fluid control for controlling the fluid flow within the fin field. The individual fins of the heat exchanger are tapered with the cross-sectional area of the individual fins decreasing from an inlet region of the heat exchanger toward a middle region of the heat exchanger. The tapering of the fins function to minimize formation of high pressure with the fin field. In an alternative embodiment, the heat exchanger may comprise an aperture for enhancing ventilation of fluid within the fin field, and thereby reducing formation of high pressure within the fin field.

Abstract: A heat exchanger and a method of manufacturing the heat exchanger is disclosed for dissipating heat from a heat generating component. The heat exchanger comprises a thermally conductive base in thermal communication with the component, a plurality of thermally conductive plate fins affixed to the base wherein the plate fins define a fin field and channels, and fluid control for controlling the fluid flow within the fin field. The individual fins of the heat exchanger comprise apertures extending through the walls of the individual fins. The formation of the apertures within the individual plate fins provides communication of fluid across the channels within the fin field.

Abstract: A sensor comprising a substantially planer base having a substantially-flat bottom surface to facilitate adhesive mounting, and at least one transducer mounted to said base.

Abstract: A heat exchanger and a method of manufacturing the heat exchanger is disclosed for dissipating heat from a heat generating component. The heat exchanger comprises a thermally conductive base in thermal communication with the component, a plurality of thermally conductive plate fins affixed to the base wherein the plate fins define a fin field and channels, and fluid control for controlling the fluid flow within the fin field. The individual fins of the heat exchanger comprise a plurality of vertical segments extending from the base to the top area of the heat exchanger. The vertical segments are spaced apart by apertures. In an alternative embodiment, the horizontal width of the segments may vary to adjust the fluid flow through the heat exchanger. In conjunction with the above-outlined embodiments, the heat exchanger may comprise a fluid control feature for substantially preventing premature egress of fluid from a top region of the fin field caused by the high pressure region within the fin field.

Abstract: A heat exchanger and a method of manufacturing the heat exchanger is disclosed for dissipating heat from a heat generating component. The heat exchanger comprises a thermally conductive base in thermal communication with the component, a plurality of thermally conductive plate fins affixed to the base wherein the plate fins define a fin field and channels, and fluid control for controlling the fluid flow within the fin field. The individual fins of the heat exchanger comprise an arc shape with diametrically opposed legs extending vertically downward from each end of the fins. The individual fins are comprised of thermally conductive material affixed to and in thermal communication with the base. The individual fins are arcuately shaped sections separated by arcuately shaped channels. The fins, together with the channels and base form a fin field having an inlet region, a middle region and an outlet region.

Abstract: An integrated circuit chip cooling system includes a thermally conductive block on which the chip is directly mounted. The block is secured to a printed circuit board and is suspended into flowing coolant, with the chip being maintained out of contact with the coolant. The coolant is circulated to remove heat from the block.

Abstract: A heat exchanger is disclosed for dissipating heat from a heat generating component. The heat exchanger comprises a thermally conductive base in thermal communication with the component, a plurality of thermally conductive plate fins affixed to the base wherein the plate fins define a fin field and channels, and fluid control means for controlling the fluid flow within the fin field. In one embodiment, the fluid control means utilizes the low pressure created by flow bypass to vent relatively high pressure fluid within the fin field. Alternatively or in conjunction, the fluid control means substantially prevents premature egress of fluid from the top of the fin field caused by the high pressure region within the fin field.

Abstract: A device is disclosed for interfacing with a variety of transducer types to generate a measurement value of a certain property. The device has at least one sensor block that in turn has at least one sensor channel containing sensor circuitry. The sensor circuitry is configured to cooperate with a particular transducer to generate an electrical signal representing the property. Connected to the sensor block is a control block. The control block has configuration circuitry for enabling the sensor circuitry. Additionally, the control block contains conversion circuitry for converting the signal to the measurement value using a conversion equation. A user interface provides the means for inputting configuration information and outputting the measurement value. In one embodiment, the sensor block also contains a multiplicity of sensor channels and multiplexing circuitry for enabling the control block to address each sensor channel individually.

Abstract: An arrangement for cooling a heat dissipating circuit element mounted to a first side of a printed circuit board. A heat dissipation member is mounted to the other side of the circuit board and a thermally conductive post secured to the heat dissipation member extends through an aperture through the circuit board and into thermal contact with the circuit element.

Abstract: An interactive scanning device or system having one or more single or multi-dimensional scanners, an input device, an image processor, and a communication interface, for scanning an object or surface and interactively displaying and manipulating a threedimensional image of the object or surface from the geometrical dimensions of the object or topology of the surface captured during scanning. The communication interface enables the geometrical dimensions of the object, the topology of the surface, or the image of the object, to be transmitted over a wire or wireless communication medium to an end user station having an interactive scanning device or a computer station, or both, for initial or further display and manipulation. A further embodiment of the present invention incorporates a photosensitive or photographic recording device to capture an optical image of the object or surface to superimpose with the scanned image.

Abstract: Dissipation of the heat produced by the operation of electronic circuitry may be improved by a heat sink which comprises a flat base from which a number of vertical fins extend. The fins are parallel to one another and define a number of parallel channels into which coolant flow is directed. The thermal resistance of the heat sink is optimized by setting fin thickness and channel width parameters to appropriate values. The heat sink may be attached in a heat conductive manner to a heat producing electronic component. One or more of these heat sinked components may be laid out in an in-line or staggered arrangement on a support in the form of a circuit pack. Cooling fluid is delivered to the circuit pack in a variety of ways to cool the heat sinked components. A method of determining the optimum fin thickness and channel width parameters involves determining a relationship between total thermal resistance of the heat sink and combinations of fin thickness and channel width parameters.