Patents by Inventor Kay Chiu
Kay Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9405710Abstract: A wireless communications device provides users with opportunities to access interactive media guidance or other applications and to control interactive media guidance applications running on user equipment. The wireless communications device may have a touch-sensitive screen with controls that are coordinated with the features of the interactive media guidance or other applications. The wireless communications device may function as a remote controller for user equipment.Type: GrantFiled: June 30, 2009Date of Patent: August 2, 2016Assignee: Rovi Guides, Inc.Inventors: Erwin Lau, Terry Tam, Kay Chiu
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Patent number: 8769578Abstract: A wireless communications device provides users with opportunities to access interactive media guidance or other applications and to control interactive media guidance applications running on user equipment. The wireless communications device may have a touch-sensitive screen with controls that are coordinated with the features of the interactive media guidance or other applications. The wireless communications device may function as a remote controller for user equipment.Type: GrantFiled: June 30, 2009Date of Patent: July 1, 2014Assignee: United Video Properties, Inc.Inventors: Erwin Lau, Terry Tam, Kay Chiu
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Publication number: 20120124624Abstract: A wireless communications device provides users with opportunities to access interactive media guidance or other applications and to control interactive media guidance applications running on user equipment. The wireless communications device may have a touch-sensitive screen with controls that are coordinated with the features of the interactive media guidance or other applications. The wireless communications device may function as a remote controller for user equipment.Type: ApplicationFiled: January 18, 2012Publication date: May 17, 2012Applicant: UNITED VIDEO PROPERTIES, INC.Inventors: Erwin Lau, Terry Tam, Kay Chiu
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Publication number: 20100333136Abstract: A wireless communications device provides users with opportunities to access interactive media guidance or other applications and to control interactive media guidance applications running on user equipment. The wireless communications device may have a touch-sensitive screen with controls that are coordinated with the features of the interactive media guidance or other applications. The wireless communications device may function as a remote controller for user equipment.Type: ApplicationFiled: June 30, 2009Publication date: December 30, 2010Applicant: Rovi Technologies CorporationInventors: Erwin Lau, Terry Tam, Kay Chiu
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Publication number: 20100333032Abstract: A wireless communications device provides users with opportunities to access interactive media guidance or other applications and to control interactive media guidance applications running on user equipment. The wireless communications device may have a touch-sensitive screen with controls that are coordinated with the features of the interactive media guidance or other applications. The wireless communications device may function as a remote controller for user equipment.Type: ApplicationFiled: June 30, 2009Publication date: December 30, 2010Applicant: Rovi Technologies CorporationInventors: Erwin Lau, Terry Tam, Kay Chiu
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Publication number: 20100333135Abstract: A wireless communications device provides users with opportunities to access interactive media guidance or other applications and to control interactive media guidance applications running on user equipment. The wireless communications device may have a touch-sensitive screen with controls that are coordinated with the features of the interactive media guidance or other applications. The wireless communications device may function as a remote controller for user equipment.Type: ApplicationFiled: June 30, 2009Publication date: December 30, 2010Applicant: Rovi Technologies CorporationInventors: Erwin Lau, Terry Tam, Kay Chiu
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Publication number: 20090127243Abstract: A method for bonding two pieces of a glassy metal includes:(a) partially immersing the two pieces of the glassy metal in a liquid cooling medium; and (b) welding the two pieces of the glassy metal, which are cooled by the cooling medium at the same time, using pulsed electric arc techniques. The cooling medium provides a cooling rate that is sufficient to prevent crystallization in melted portions of the two pieces of the glassy metal from occurring during welding.Type: ApplicationFiled: February 5, 2008Publication date: May 21, 2009Applicant: National Taiwan Ocean UniversityInventors: Shing-Hoa Wang, Pei-Hung Kuo, Yu-Lon Lin, Hsiao-Tsung Tsang, Po-Kay Chiu, Hung-Yin Tsai
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Patent number: 6908514Abstract: In this invention a coating of unexposed photoresist is used to protect from semiconductor processing the area immediately above a zero layer alignment mark used for a wafer stepper alignment. The entire surface of a wafer is coated with photoresist and all shot sites on the surface of a wafer including those containing the zero layer alignment marks are exposed with circuit patterns. Before the exposed areas of photoresist are removed, a protective coating of unexposed photoresist is applied to the surface of the wafer immediately above the alignment marks but within the boundaries of the shot site. The wafer is processed in the areas outside of the protective coating of photoresist including the shot site containing alignment marks. The area under the protective coating is not processed. This maintains a clear and concise view of the alignment marks. The area beyond the protective coating is processed along with the other shot sites.Type: GrantFiled: March 23, 2001Date of Patent: June 21, 2005Assignee: Taiwan Semiconductor Manufacturing CompanyInventors: Chen-Yu Chang, Wei-Kay Chiu
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Patent number: 6664194Abstract: There is first provided a substrate 10 and a target layer 12. There is then formed upon the target layer a patterned positive photoresist layer 14. There is then processed the target layer while employing the patterned positive photoresist layer as a mask layer, to thus form a processed target layer and a processed patterned positive photoresist layer. There is then photoexposed 18 the processed patterned positive photoresist layer to enhance its solubility. Finally, there is then stripped from the processed target layer the photoexposed processed patterned positive photoresist layer while employing a solvent.Type: GrantFiled: March 18, 1999Date of Patent: December 16, 2003Assignee: Taiwan Semiconductor Manufacturing CompanyInventors: Dian-Hau Chen, Chiang-Jen Peng, Wei-Kay Chiu
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Patent number: 6575645Abstract: An apparatus and method for developing a selectively exposed resist pattern, on an integrated circuit wafer, which avoids damage to the resist pattern and allows greater freedom in the choice of resists. Developer is placed on a selectively exposed layer of resist for a first time. The layer of resist and developer are then immersed in a cleaning liquid time for a second time to stop the developing action and remove the developer. As an option, ultrasonic power can be delivered to the wafer or the cleaning liquid while the layer of resist is immersed in the cleaning liquid. The cleaning liquid is then removed from the layer of resist, now a resist pattern, and the wafer and resist pattern is placed in a vacuum for drying. As another option, heat can be applied to the wafer and resist pattern while they are in the vacuum. The wafer and resist pattern are then removed from the vacuum for further processing.Type: GrantFiled: February 6, 2002Date of Patent: June 10, 2003Assignee: Taiwan Semiconductor Manufacturing CompanyInventor: Wei-Kay Chiu
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Publication number: 20030077600Abstract: A photovoltaic device is employed to facilitate interactions between immobilized and dissolved biological materials. Such interactions including nucleotide hybridization, peptide-peptide interaction and peptide/nucleotide binding. Through the force of the photovoltaic effect, which is caused by illuminating the photovoltaic device with a light source, the efficiency of interaction between immobilized biomedical materials on the surface of the device and free biological materials is remarkably enhanced. Such photovoltaic device may be a microfabricated device having an array of microlocations capable of being used as a biological screening tool with high throughput applications.Type: ApplicationFiled: October 23, 2001Publication date: April 24, 2003Inventors: Chi-Chan Chen, Sung-Kay Chiu, Chi-Meng Tzeng, Wei-Chi Ku
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Publication number: 20030059819Abstract: A composition for coating a solid support to immobilize and hybridize nucleic acid molecules on the solid support comprises an amine silane and an epoxy silane. A nucleic acid microarray and a method of manufacturing such microarray using such composition are described.Type: ApplicationFiled: August 23, 2002Publication date: March 27, 2003Applicant: U-Vision Biotech, Inc.Inventors: Chi-Meng Tzeng, Kung-Ming Hsu, Wei-Chi Ku, Grace Lau, Jing-Tyan Ma, Sung-Kay Chiu
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Patent number: 6537734Abstract: An apparatus and method for developing a selectively exposed resist pattern, on an integrated circuit wafer, which avoids damage to the resist pattern and allows greater freedom in the choice of resists. Developer is placed on a selectively exposed layer of resist for a first time. The layer of resist and developer are then immersed in a cleaning liquid time for a second time to stop the developing action and remove the developer. As an option, ultrasonic power can be delivered to the wafer or the cleaning liquid while the layer of resist is immersed in the cleaning liquid. The cleaning liquid is then removed from the layer of resist, now a resist-pattern, and the wafer and resist pattern is placed in a vacuum for drying. As another option, heat can be applied to the wafer and resist pattern while they are in the vacuum. The wafer and resist pattern are then removed from the vacuum for further processing.Type: GrantFiled: February 4, 2002Date of Patent: March 25, 2003Assignee: Taiwan Semiconductor Manufacturing CompanyInventor: Wei-Kay Chiu
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Publication number: 20020144707Abstract: An apparatus and method for developing a selectively exposed resist pattern, on an integrated circuit wafer, which avoids damage to the resist pattern and allows greater freedom in the choice of resists. Developer is placed on a selectively exposed layer of resist for a first time. The layer of resist and developer are then immersed in a cleaning liquid time for a second time to stop the developing action and remove the developer. As an option, ultrasonic power can be delivered to the wafer or the cleaning liquid while the layer of resist is immersed in the cleaning liquid. The cleaning liquid is then removed from the layer of resist, now a resist pattern, and the wafer and resist pattern is placed in a vacuum for drying. As another option, heat can be applied to the wafer and resist pattern while they are in the vacuum. The wafer and resist pattern are then removed from the vacuum for further processing.Type: ApplicationFiled: February 4, 2002Publication date: October 10, 2002Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANYInventor: Wei-Kay Chiu
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Publication number: 20020090575Abstract: An apparatus and method for developing a selectively exposed resist pattern, on an integrated circuit wafer, which avoids damage to the resist pattern and allows greater freedom in the choice of resists. Developer is placed on a selectively exposed layer of resist for a first time. The layer of resist and developer are then immersed in a cleaning liquid time for a second time to stop the developing action and remove the developer. As an option, ultrasonic power can be delivered to the wafer or the cleaning liquid while the layer of resist is immersed in the cleaning liquid. The cleaning liquid is then removed from the layer of resist, now a resist pattern, and the wafer and resist pattern is placed in a vacuum for drying. As another option, heat can be applied to the wafer and resist pattern while they are in the vacuum. The wafer and resist pattern are then removed from the vacuum for further processing.Type: ApplicationFiled: February 6, 2002Publication date: July 11, 2002Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANYInventor: Wei-Kay Chiu
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Patent number: 6355397Abstract: An apparatus and method for developing a selectively exposed resist pattern, on an integrated circuit wafer, which avoids damage to the resist pattern and allows greater freedom in the choice of resists. Developer is placed on a selectively exposed layer of resist for a first time. The layer of resist and developer are then immersed in a cleaning liquid for a second time to stop the developing action and remove the developer. As an option, ultrasonic power can be delivered to the wafer or the cleaning liquid while the layer of resist is immersed in the cleaning liquid. The cleaning liquid is then removed from the layer of resist, now a resist pattern, and the wafer and resist pattern is placed in a vacuum for drying.Type: GrantFiled: April 11, 1997Date of Patent: March 12, 2002Assignee: Taiwan Semiconductor Manufacturing CompanyInventor: Wei-Kay Chiu
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Publication number: 20010012593Abstract: In this invention a coating of unexposed photoresist is used to protect from semiconductor processing the area immediately above a zero layer alignment mark used for a wafer stepper alignment. The entire surface of a wafer is coated with photoresist and all shot sites on the surface of a wafer including those containing the zero layer alignment marks are exposed with circuit patterns. Before the exposed areas of photoresist are removed, a protective coating of unexposed photoresist is applied to the surface of the wafer immediately above the alignment marks but within the boundaries of the shot site. The wafer is processed in the areas outside of the protective coating of photoresist including the shot site containing alignment marks. The area under the protective coating is not processed. This maintains a clear and concise view of the alignment marks. The area beyond the protective coating is processed along with the other shot sites.Type: ApplicationFiled: March 23, 2001Publication date: August 9, 2001Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANYInventors: Chen-Yu Chang, Wei-Kay Chiu
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Patent number: 6197481Abstract: In this invention a coating of unexposed photoresist is used to protect from semiconductor processing the area immediately above a zero layer alignment mark used for a wafer stepper alignment. The entire surface of a wafer is coated with photoresist and all shot sites on the surface of a wafer including those containing the zero layer alignment marks are exposed with circuit patterns. Before the exposed areas of photoresist are removed, a protective coating of unexposed photoresist is applied to the surface of the wafer immediately above the alignment marks but within the boundaries of the shot site. The wafer is processed in the areas outside of the protective coating of photoresist including the shot site containing alignment marks. The area under the protective coating is not processed. This maintains a clear and concise view of the alignment marks. The area beyond the protective coating is processed along with the other shot sites.Type: GrantFiled: September 17, 1998Date of Patent: March 6, 2001Assignee: Taiwan Semiconductor Manufacturing CompanyInventors: Chen-Yu Chang, Wei-Kay Chiu
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Patent number: 6137088Abstract: A method and apparatus for curing a photoresist that is deposited in liquid form and spun on a surface of a wafer leaving a thin film to be cured. This invention teaches methods for curing the resist with improved thickness control using front side heating.Type: GrantFiled: October 5, 1998Date of Patent: October 24, 2000Assignee: Taiwan Semiconductor Manufacturing CompanyInventors: Chao-Chen Chen, Wei-Kay Chiu
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Patent number: 6019844Abstract: A method and an apparatus are disclosed to improve the planarization of a coating upon a substrate, in particular to improve the planarization of a photoresist or spin-on-glass coating upon a semiconductor wafer. This is achieved by coupling an ultrasonic wave generator to either the chuck or the spindle of the chuck. Ultrasonic waves emanating from the ultrasonic generator are induced into the coating, vibrating it. The vibration causes coating material to fill in the valleys of the coating, thus planarizing the surface of the coating.Type: GrantFiled: November 20, 1998Date of Patent: February 1, 2000Assignee: Taiwan Semiconductor Manufacturing CompanyInventor: Wei-Kay Chiu