Patents by Inventor Kazuaki Hashimoto

Kazuaki Hashimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220411317
    Abstract: A glass, which is a glass for a magnetic recording medium substrate or for a glass spacer for a magnetic recording and reproducing apparatus, is an amorphous oxide glass. An SiO2 content ranges from 56 mol % to 80 mol %, an Li2O content ranges from 1 mol % to 10 mol %, a B2O3 content ranges from 0 mol % to 4 mol %, a Na2O content is 0 mol %, a total content of MgO and CaO (MgO+CaO) ranges from 9 mol % to 40 mol %, and the oxide glass has a specific gravity of 2.75 g/cm3 or less, a glass transition temperature of 650° C. or higher, and a Young's modulus of 90 GPa or more.
    Type: Application
    Filed: August 24, 2022
    Publication date: December 29, 2022
    Inventors: Koichi SATO, Kazuaki HASHIMOTO
  • Patent number: 11505279
    Abstract: A bicycle motorization device is attached to a bicycle. The motorization device includes: a calculation unit configured to calculate speed of the bicycle; an estimation unit configured to estimate pedal force applied to pedals of the bicycle; an electric motor; a battery which supplies electric power to the electric motor; and a control unit configured to apply auxiliary driving force to a wheel of the bicycle by driving the electric motor based on the speed calculated and the pedal force estimated.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: November 22, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Jin Yoshizawa, Kazuaki Hashimoto, Takashi Uchida
  • Publication number: 20220336518
    Abstract: Various embodiments of the present application are directed towards an image sensor including a wavelength tunable narrow band filter, as well as methods for forming the image sensor. In some embodiments, the image sensor includes a substrate, a first photodetector, a second photodetector, and a filter. The first and second photodetectors neighbor in the substrate. The filter overlies the first and second photodetectors and includes a first distributed Bragg reflector (DBR), a second DBR, and a first interlayer between the first and second DBRs. A thickness of the first interlayer has a first thickness value overlying the first photodetector and a second thickness value overlying the second photodetector. In some embodiments, the filter is limited to a single interlayer. In other embodiments the filter further includes a second interlayer defining columnar structures embedded in the first interlayer and having a different refractive index than the first interlayer.
    Type: Application
    Filed: June 30, 2022
    Publication date: October 20, 2022
    Inventors: Cheng Yu Huang, Chun-Hao Chuang, Kazuaki Hashimoto, Keng-Yu Chou, Wei Chieh Chiang, Wen-Hau Wu, Chih-Kung Chang
  • Patent number: 11447414
    Abstract: Provided is a glass for a magnetic recording medium substrate, which is an amorphous oxide glass, in which an SiO2 content ranges from 56 mol % to 80 mol %, an Li2O content ranges from 1 mol % to 10 mol %, a B2O3 content ranges from 0 mol % to 4 mol %, a total content of MgO and CaO (MgO+CaO) ranges from 9 mol % to 40 mol %, and the oxide glass has a specific gravity of 2.75 g/cm3 or less, a glass transition temperature of 650° C. or higher, and a Young's modulus of 90 GPa or more.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: September 20, 2022
    Assignee: HOYA CORPORATION
    Inventors: Koichi Sato, Kazuaki Hashimoto
  • Publication number: 20220277768
    Abstract: Provided is a glass for a magnetic recording medium substrate, which is an amorphous glass, in which an SiO2 content is in a range of 54 mol % or more and 62 mol % or less, an MgO content is in a range of 15 mol % or more and 28 mol % or less, an Li2O content is in a range of 0.2 mol % or more, and an Na2O content is in a range of 5 mol % or less.
    Type: Application
    Filed: July 22, 2020
    Publication date: September 1, 2022
    Inventors: Koichi SATO, Kazuaki HASHIMOTO
  • Patent number: 11422003
    Abstract: A control device includes: an obtaining unit configured to obtain location information of an electric bicycle and operation information obtained by the vehicle; a calculation unit configured to generate environment information indicating an estimated travel environment of the electric bicycle based on the operation information; and a storage unit configured to store the location information and the environment information. The calculation unit is configured to generate an updated map by associating the location information with the environment information, and reflecting the location information and the environment information on a map.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: August 23, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kazuaki Hashimoto, Jin Yoshizawa, Takashi Uchida
  • Patent number: 11404468
    Abstract: Various embodiments of the present application are directed towards an image sensor including a wavelength tunable narrow band filter, as well as methods for forming the image sensor. In some embodiments, the image sensor includes a substrate, a first photodetector, a second photodetector, and a filter. The first and second photodetectors neighbor in the substrate. The filter overlies the first and second photodetectors and includes a first distributed Bragg reflector (DBR), a second DBR, and a first interlayer between the first and second DBRs. A thickness of the first interlayer has a first thickness value overlying the first photodetector and a second thickness value overlying the second photodetector. In some embodiments, the filter is limited to a single interlayer. In other embodiments the filter further includes a second interlayer defining columnar structures embedded in the first interlayer and having a different refractive index than the first interlayer.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: August 2, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng Yu Huang, Chun-Hao Chuang, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Wen-Hau Wu, Chih-Kung Chang
  • Publication number: 20220220038
    Abstract: Porous ceramics that meet the demand for bone substitute materials and the like are provided. Solution is provided by porous ceramics and a method for producing the porous ceramics, which are ceramics having pores, the pores including open pores and closed pores, the open pores including a plurality of large-diameter open pores having a pore size within a range of 20 to 600 ?m and a plurality of micro-diameter open pores having a pore size within a range of 1.0 ?m or smaller, wherein the large-diameter open pores are distributed substantially uniformly all over the ceramics.
    Type: Application
    Filed: June 2, 2020
    Publication date: July 14, 2022
    Applicants: CHIBA INSTITUTE OF TECHNOLOGY, DAIO PAPER CORPORATION
    Inventors: Kazuaki HASHIMOTO, Junya OKAWA, Hiroto SASAKI
  • Publication number: 20220216260
    Abstract: The present disclosure relates to an integrated chip. The integrated chip includes an image sensing element disposed within a substrate. A gate structure is disposed along a front-side of the substrate. A back-side of the substrate includes one or more first angled surfaces defining a central diffuser disposed over the image sensing element. The back-side of the substrate further includes second angled surfaces defining a plurality of peripheral diffusers laterally surrounding the central diffuser. The plurality of peripheral diffusers are a smaller size than the central diffuser.
    Type: Application
    Filed: January 4, 2021
    Publication date: July 7, 2022
    Inventors: Keng-Yu Chou, Chun-Hao Chuang, Jen-Cheng Liu, Kazuaki Hashimoto, Ming-En Chen, Shyh-Fann Ting, Shuang-Ji Tsai, Wei-Chieh Chiang
  • Publication number: 20220173140
    Abstract: Various embodiments of the present disclosure are directed towards an integrated chip (IC). The IC comprises a first phase detection autofocus (PDAF) photodetector and a second PDAF photodetector in a substrate. A first electromagnetic radiation (EMR) diffuser is disposed along a back-side of the substrate and within a perimeter of the first PDAF photodetector. The first EMR diffuser is spaced a first distance from a first side of the first PDAF photodetector and a second distance less than the first distance from a second side of the first PDAF photodetector. A second EMR diffuser is disposed along the back-side of the substrate and within a perimeter of the second PDAF photodetector. The second EMR diffuser is spaced a third distance from a first side of the second PDAF photodetector and a fourth distance less than the third distance from a second side of the second PDAF photodetector.
    Type: Application
    Filed: February 1, 2022
    Publication date: June 2, 2022
    Inventors: Keng-Yu Chou, Chun-Hao Chuang, Kazuaki Hashimoto, Wei-Chieh Chiang, Cheng Yu Huang, Wen-Hau Wu, Chih-Kung Chang
  • Publication number: 20220165769
    Abstract: A method for forming an image sensor package is provided. An image sensor chip is formed over a package substrate. A protection layer is formed overlying the image sensor chip. The protection layer has a planar top surface and a bottom surface lining and contacting structures under the protection layer. An opening is formed into the protection layer and spaced around a periphery of the image sensor chip. A light shielding material is filled in the opening to form an on-wafer shield structure having a sidewall directly contact the protection layer.
    Type: Application
    Filed: February 10, 2022
    Publication date: May 26, 2022
    Inventors: Wen-Hau Wu, Chun-Hao Chuang, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Cheng Yu Huang
  • Patent number: 11329083
    Abstract: An image sensor package is provided. The image sensor package comprises a package substrate, and an image sensor chip arranged over the package substrate. The integrated circuit device further comprises a protection layer overlying the image sensor chip having a planar top surface and a bottom surface lining and contacting structures under the protection layer, and an on-wafer shield structure spaced around a periphery of the image sensor chip. The height of the image sensor package can be reduced since a discrete cover glass or an infrared filter and corresponding intervening materials are no longer needed since being replaced by the build in protection layer. The size of the image sensor package can be reduced since a discrete light shield and corresponding intervening materials are no longer needed since being replaced by the build in on wafer light shield structure.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: May 10, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wen-Hau Wu, Chun-Hao Chuang, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Cheng Yu Huang
  • Publication number: 20220139983
    Abstract: In some embodiments, an image sensor is provided. The image sensor includes a photodetector disposed in a semiconductor substrate. A wave guide filter having a substantially planar upper surface is disposed over the photodetector. The wave guide filter includes a light filter disposed in a light filter grid structure. The light filter includes a first material that is translucent and has a first refractive index. The light filter grid structure includes a second material that is translucent and has a second refractive index less than the first refractive index.
    Type: Application
    Filed: January 19, 2022
    Publication date: May 5, 2022
    Inventors: Cheng Yu Huang, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Wen-Chien Yu, Ting-Cheng Chang, Wen-Hau Wu, Chih-Kung Chang
  • Patent number: 11276716
    Abstract: Various embodiments of the present disclosure are directed towards an integrated chip (IC). The IC comprises a first phase detection autofocus (PDAF) photodetector and a second PDAF photodetector in a substrate. A first electromagnetic radiation (EMR) diffuser is disposed along a back-side of the substrate and within a perimeter of the first PDAF photodetector. The first EMR diffuser is spaced a first distance from a first side of the first PDAF photodetector and a second distance less than the first distance from a second side of the first PDAF photodetector. A second EMR diffuser is disposed along the back-side of the substrate and within a perimeter of the second PDAF photodetector. The second EMR diffuser is spaced a third distance from a first side of the second PDAF photodetector and a fourth distance less than the third distance from a second side of the second PDAF photodetector.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: March 15, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Keng-Yu Chou, Chun-Hao Chuang, Kazuaki Hashimoto, Wei-Chieh Chiang, Cheng Yu Huang, Wen-Hau Wu, Chih-Kung Chang
  • Publication number: 20220045117
    Abstract: In some embodiments, the present disclosure relates to an integrated chip structure. The integrated chip structure includes an image sensor disposed within a first substrate. A first band-pass filter and a second band-pass filter are disposed on the first substrate. A dielectric structure is disposed on the first substrate. The dielectric structure is laterally between the first band-pass filter and the second band-pass filter and laterally abuts the first band-pass filter and the second band-pass filter.
    Type: Application
    Filed: October 21, 2021
    Publication date: February 10, 2022
    Inventors: Cheng Yu Huang, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Wen-Hau Wu
  • Patent number: 11233081
    Abstract: In some embodiments, an image sensor is provided. The image sensor includes a photodetector disposed in a semiconductor substrate. A wave guide filter having a substantially planar upper surface is disposed over the photodetector. The wave guide filter includes a light filter disposed in a light filter grid structure. The light filter includes a first material that is translucent and has a first refractive index. The light filter grid structure includes a second material that is translucent and has a second refractive index less than the first refractive index.
    Type: Grant
    Filed: May 20, 2019
    Date of Patent: January 25, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng Yu Huang, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Wen-Chien Yu, Ting-Cheng Chang, Wen-Hau Wu, Chih-Kung Chang
  • Publication number: 20210387896
    Abstract: A glass for magnetic recording medium substrate is an amorphous oxide glass. In terms of mol %, SiO2 content ranges from 45 to 68%, Al2O3 from 5 to 20%, total content of SiO2 and Al2O3 60 to 80%, B2O3 from 0 to 5%, MgO from 3 to 28%, CaO from 0 to 18%, total content of BaO and SrO 0 to 2%, total content of alkali earth metal oxides from 12 to 30%, total content of alkali metal oxides from 3.5 to 15%, and at least one kind selected from the group made of Sn oxide and Ce oxide being included, a total content of Sn oxide and Ce oxide ranges from 0.05 to 2.00%, a glass transition temperature ?625° C., a Young's modulus ?83 GPa, a specific gravity ?2.85, and an average linear expansion coefficient at 100 to 300° C.?48×10?7/° C.
    Type: Application
    Filed: June 24, 2021
    Publication date: December 16, 2021
    Applicant: HOYA CORPORATION
    Inventors: Koichi SATO, Kazuaki HASHIMOTO
  • Patent number: 11158664
    Abstract: In some embodiments, the present disclosure relates to an integrated chip structure. The integrated chip structure includes a first image sensor disposed within a first substrate and a second image sensor disposed within a second substrate. The second substrate has a first side facing the first substrate. The first side includes angled surfaces defining one or more recesses within the first side. A band-pass filter is arranged between the first substrate and the second substrate and is configured to reflect electromagnetic radiation that is within a first range of wavelengths.
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: October 26, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng Yu Huang, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Wen-Hau Wu
  • Patent number: 11158662
    Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip has an image sensor within a substrate. A first dielectric has an upper surface that extends over a first side of the substrate and over one or more trenches within the first side of the substrate. The one or more trenches laterally surround the image sensor. An internal reflection structure arranged over the upper surface of the first dielectric. The internal reflection structure is configured to reflect radiation exiting from the substrate back into the substrate.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: October 26, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Keng-Yu Chou, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Wei-Chieh Chiang, Cheng Yu Huang, Wen-Hau Wu, Chih-Kung Chang, Jhy-Jyi Sze
  • Publication number: 20210265408
    Abstract: Various embodiments of the present application are directed to a narrow band filter with high transmission and an image sensor comprising the narrow band filter. In some embodiments, the filter comprises a first distributed Bragg reflector (DBR), a second DBR, a defect layer between the first and second DBRs, and a plurality of columnar structures. The columnar structures extend through the defect layer and have a refractive index different than a refractive index of the defect layer. The first and second DBRs define a low transmission band, and the defect layer defines a high transmission band dividing the low transmission band. The columnar structures shift the high transmission band towards lower or higher wavelengths depending upon a refractive index of the columnar structures and a fill factor of the columnar structures.
    Type: Application
    Filed: April 21, 2021
    Publication date: August 26, 2021
    Inventors: Cheng Yu Huang, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Wen-Hau Wu