Abstract: Provided are a phase shift mask blank that can sufficiently suppress the formation of haze on a phase shift film surface (on a phase mask), a phase shift mask having reduced haze defects, a method for manufacturing the phase shift mask, and a method for modifying the phase shift mask by electron beam modification etching.

Abstract: An image pickup apparatus for endoscope includes an image pickup device, an optical element, an optical fiber, a fiber tube, a plurality of metal cables, a cable tube, and a wire rod wound around the cable tube and the fiber tube to integrate the cable tube and the fiber tube. The plurality of metal cables are fixed to the cable tube deformed by the wire rod. The optical fiber is not fixed to the fiber tube by the wire rod.

Abstract: An image pickup apparatus includes: a wiring board that has a first main surface and a second main surface; an electronic components that include an image pickup device mounted on the wiring board; and conductive wires bonded to the wiring board. The wiring board includes a first area disposed in an XY plane, a second area extended from a distal end portion of the first area and disposed in an XZ plane, a third area extended from a first side surface of the first area and disposed in a YZ plane, and a fourth area extended from a distal end portion of the third area and disposed in the XZ plane. The first main surface of the second area is a distal end surface, and the image pickup device is mounted on the distal end surface.

Abstract: An image pickup apparatus includes: an image pickup device that includes a light receiving surface, an opposite surface, a light receiving portion, and external electrodes connected to the light receiving portion; and a wiring board that includes a first main surface, a second man surface, and a wiring portion provided with first bonding electrodes bonded to the external electrodes, wherein the first main surface of the wiring portion is arranged at a first angle ?1 equal to or smaller than 90 degrees relative to the opposite surface, the wiring board includes a reinforced portion and a folded portion bent at the first angle ?1 between the reinforced portion and the wiring portion, and the second main surface of the reinforced portion is fixed to the opposite surface of the image pickup device.

Abstract: A manufacturing method for an image pickup unit, the method including: a step of bonding plural lens wafers, on which optical components are formed, and forming a lens unit wafer including plural lens units; a step of bonding a bending optical element wafer including plural bending optical elements to a first surface of the lens unit wafer such that the plural bending optical elements are respectively opposed to the plural lens units and forming an optical unit wafer; a step of separating and individualizing the optical unit wafer for each of the lens units and the bending optical elements and manufacturing plural optical units; and a step of respectively bonding solid-state image pickup devices to emission surfaces of lights of the bending optical elements of the optical units.

Abstract: An image pickup apparatus includes: a wiring board that has a first main surface and a second main surface; an electronic components that include an image pickup device mounted on the wiring board; and conductive wires bonded to the wiring board. The wiring board includes a first area disposed in an XY plane, a second area extended from a distal end portion of the first area and disposed in an XZ plane, a third area extended from a first side surface of the first area and disposed in a YZ plane, and a fourth area extended from a distal end portion of the third area and disposed in the XZ plane. The first main surface of the second area is a distal end surface, and the image pickup device is mounted on the distal end surface.

Abstract: For a wiring board, silicon including a first main surface and a second main surface is a base, a first conductor on the first main surface and a second conductor on the second main surface are connected by a through electrode formed of an electroplating layer disposed on an inner surface of a through hole, a bottom surface of which is the second conductor, and a hilling which is a continuous projecting portion is provided on the inner surface of the through hole from the first main surface to the second main surface in parallel with a depth direction.

Abstract: A method includes the steps of emitting infrared light of a predetermined wavelength to an object, receiving infrared light of a predetermined wavelength different from the infrared light emitted from the object, and adjusting white balance of an image output from a camera at this time, thereby showing the incident infrared light as white. The method further includes the steps of emitting white visible light to the object from an RGB light source, receiving visible light emitted from the object, and adjusting the intensity of the RGB light source for each of R, G, and B, thereby adjusting white balance of a captured image.

Abstract: A semiconductor module includes an image pickup device on which a bump is disposed, and a flexible wiring board having a flexible resin as a base and including a wire having a bonding electrode at a distal end portion solder-bonded to the bump, in which the bonding electrode is pressed against the bump by bending/deformation of the wiring board caused by application of heat to a solder bonding temperature.

Abstract: A manufacturing method of an image pickup apparatus includes a step of manufacturing an image pickup device chip, a step of manufacturing a wiring board having first terminals and second terminals disposed on both sides of a first primary surface with a central flexible portion intervened in between, a step of joining a heat conductive block to a second primary surface of the wiring board, a step of joining the image pickup device chip to the first terminals of the wiring board, a step of performing solder joining of core wires of a cable to the second terminals of the wiring board by conducting heat generated by a heat tool through the heat conductive block, a step of bending the wiring board, and a step of performing housing inside a frame member, and sealing with sealing resin.

Abstract: An image pickup apparatus includes: an image pickup device that includes a light receiving surface, an opposite surface, a light receiving portion, and external electrodes connected to the light receiving portion; and a wiring board that includes a first main surface, a second man surface, and a wiring portion provided with first bonding electrodes bonded to the external electrodes, wherein the first main surface of the wiring portion is arranged at a first angle ?1 equal to or smaller than 90 degrees relative to the opposite surface, the wiring board includes a reinforced portion and a folded portion bent at the first angle ?1 between the reinforced portion and the wiring portion, and the second main surface of the reinforced portion is fixed to the opposite surface of the image pickup device.

Abstract: A manufacturing method for an image pickup unit, the method including: a step of bonding plural lens wafers, on which optical components are formed, and forming a lens unit wafer including plural lens units; a step of bonding a bending optical element wafer including plural bending optical elements to a first surface of the lens unit wafer such that the plural bending optical elements are respectively opposed to the plural lens units and forming an optical unit wafer; a step of separating and individualizing the optical unit wafer for each of the lens units and the bending optical elements and manufacturing plural optical units; and a step of respectively bonding solid-state image pickup devices to emission surfaces of lights of the bending optical elements of the optical units.

Abstract: A manufacturing method for an optical unit includes: a step of bonding plural lens wafers, on which optical components are formed, and forming a lens unit wafer including plural lens units; a step of bonding a bending optical element wafer including plural bending optical elements to a first surface of the lens unit wafer such that the plural bending optical elements are respectively opposed to the plural lens units and forming an optical unit wafer; and a step of separating and individualizing the optical unit wafer for each of the lens units and the bending optical elements and manufacturing plural optical units.

Abstract: A semiconductor module includes an image pickup device on which a bump is disposed, and a flexible wiring board having a flexible resin as a base and including a wire having a bonding electrode at a distal end portion solder-bonded to the bump, in which the bonding electrode is pressed against the bump by bending/deformation of the wiring board caused by application of heat to a solder bonding temperature.

Abstract: A manufacturing method of an image pickup apparatus includes a step of manufacturing an image pickup device chip, a step of manufacturing a wiring board having first terminals and second terminals disposed on both sides of a first primary surface with a central flexible portion intervened in between, a step of joining a heat conductive block to a second primary surface of the wiring board, a step of joining the image pickup device chip to the first terminals of the wiring board, a step of performing solder joining of core wires of a cable to the second terminals of the wiring board by conducting heat generated by a heat tool through the heat conductive block, a step of bending the wiring board, and a step of performing housing inside a frame member, and sealing with sealing resin.

Abstract: A manufacturing method for an optical unit includes: a step of bonding plural lens wafers, on which optical components are formed, and forming a lens unit wafer including plural lens units; a step of bonding a bending optical element wafer including plural bending optical elements to a first surface of the lens unit wafer such that the plural bending optical elements are respectively opposed to the plural lens units and forming an optical unit wafer; and a step of separating and individualizing the optical unit wafer for each of the lens units and the bending optical elements and manufacturing plural optical units.

Abstract: A manufacturing method for an optical unit includes: a step of bonding plural lens wafers, on which optical components are formed, and forming a lens unit wafer including plural lens units; a step of bonding a bending optical element wafer including plural bending optical elements to a first surface of the lens unit wafer such that the plural bending optical elements are respectively opposed to the plural lens units and forming an optical unit wafer; and a step of separating and individualizing the optical unit wafer for each of the lens units and the bending optical elements and manufacturing plural optical units.

Abstract: An image pickup apparatus according to an embodiment includes: an image pickup device chip including an image pickup device formed on a first principal surface thereof and an external terminal for the image pickup device formed on a second principal surface thereof; a wiring board including a distal end portion including a connection pad, a flexure portion flexed at an angle of no less than 90 degrees, and an extending portion, the wiring board including a wiring layer extending from the distal end portion to the extending portion via the flexure portion, the wiring board being kept within a space immediately above the second principal surface of the image pickup device chip; a bonding layer that joins the second principal surface of the image pickup device chip and the distal end portion of the wiring board; and a bonding wire that electrically connects the external terminal and the connection pad.

Abstract: An apparatus for introduction into a test body includes a functional portion for obtaining information on an inside of a test body; a power source for supplying power for driving the functional portion; and an enclosed container for accommodating the functional portion and the power source. A cross-sectional shape orthogonal to a longitudinal direction of the enclosed container is an elliptical shape to make an outer shape small to alleviate a burden on a test subject during introduction into a body by swallowing or the like for test.

Abstract: An endoscope apparatus includes a polygonal camera module integrally formed at a wafer level by aligning and bonding a light collecting surface side of a lens wafer formed by laminating a plurality of optical wafers on which a plurality of optical parts are formed, and a device surface side of a sensor wafer on which a plurality of solid-state image pickup devices are formed, and then separating the aligned and bonded lens wafer and sensor wafer into individual pieces, wherein an endoscope functional portion is located in a region from an edge end portion of the camera module to an outer peripheral end of an outer shape portion.