Abstract: A method includes the steps of emitting infrared light of a predetermined wavelength to an object, receiving infrared light of a predetermined wavelength different from the infrared light emitted from the object, and adjusting white balance of an image output from a camera at this time, thereby showing the incident infrared light as white. The method further includes the steps of emitting white visible light to the object from an RGB light source, receiving visible light emitted from the object, and adjusting the intensity of the RGB light source for each of R, G, and B, thereby adjusting white balance of a captured image.

Abstract: According to a method of manufacturing a semiconductor device, a short-circuit wiring is formed in a region on a wafer including a dicing region, and electrode pads for input and output signals of a plurality of devices disposed in a semiconductor device forming region are electrically short-circuited by the short-circuit wiring, so that occurrence of plasma damage is suppressed even if the wafer is subjected to various plasma processes. When the wafer subjected to the plasma processes is cut along the dicing region to separate a semiconductor device, the electrical short-circuit of the electrode pads by the short-circuit wiring is released, so that the functionally unwanted short-circuit of the devices or the like is appropriately released.

Abstract: An image pickup apparatus according to an embodiment includes: an image pickup device chip including an image pickup device formed on a first principal surface thereof and an external terminal for the image pickup device formed on a second principal surface thereof; a wiring board including a distal end portion including a connection pad, a flexure portion flexed at an angle of no less than 90 degrees, and an extending portion, the wiring board including a wiring layer extending from the distal end portion to the extending portion via the flexure portion, the wiring board being kept within a space immediately above the second principal surface of the image pickup device chip; a bonding layer that joins the second principal surface of the image pickup device chip and the distal end portion of the wiring board; and a bonding wire that electrically connects the external terminal and the connection pad.

Abstract: A manufacturing method for an optical unit includes: a step of bonding plural lens wafers, on which optical components are formed, and forming a lens unit wafer including plural lens units; a step of bonding a bending optical element wafer including plural bending optical elements to a first surface of the lens unit wafer such that the plural bending optical elements are respectively opposed to the plural lens units and forming an optical unit wafer; and a step of separating and individualizing the optical unit wafer for each of the lens units and the bending optical elements and manufacturing plural optical units.

Abstract: An endoscope apparatus includes a polygonal camera module integrally formed at a wafer level by aligning and bonding a light collecting surface side of a lens wafer formed by laminating a plurality of optical wafers on which a plurality of optical parts are formed, and a device surface side of a sensor wafer on which a plurality of solid-state image pickup devices are formed, and then separating the aligned and bonded lens wafer and sensor wafer into individual pieces, wherein an endoscope functional portion is located in a region from an edge end portion of the camera module to an outer peripheral end of an outer shape portion.

Abstract: An apparatus for introduction into a test body includes a functional portion for obtaining information on an inside of a test body; a power source for supplying power for driving the functional portion; and an enclosed container for accommodating the functional portion and the power source. A cross-sectional shape orthogonal to a longitudinal direction of the enclosed container is an elliptical shape to make an outer shape small to alleviate a burden on a test subject during introduction into a body by swallowing or the like for test.

Abstract: A semiconductor device includes a semiconductor chip having at least an electrode pad and a device formed on a semiconductor layer on its surface, a seal cap having a recess portion facing the device which is adhered to the surface of the semiconductor chip, and a cavity as an airspace formed by the recess portion between the semiconductor chip and the seal cap. The semiconductor chip includes a stepped portion at a portion of the back surface opposite the surface to have an uneven thickness.

Abstract: A chip-size semiconductor package can respond also to a semiconductor device in which an electrode pad pitch is narrow. A semiconductor package comprises a semiconductor substrate which has a first principal plane and a second principal plane, a circuit element formed on the first principal plane, two or more electrode pads connected to the circuit element provided on the first principal plane, two or more external connection terminals provided on the second principal plane, one or more through holes which reach at the second principal plane from the first principal plane, and two or more through wirings which connect the two or more electrode pads and the two or more external connection terminals through the one or more through holes respectively.

Abstract: An object of the present invention is to provide a method for fabricating a semiconductor device to fabricate a semiconductor device. To achieve such an object, the present invention relates to a method for fabricating a semiconductor device composed of a hetero-junction substrate formed of a semiconductor substrate, and a heterogeneous substrate made of a material other than semiconductor bonded to a surface of the semiconductor substrate. A dicing step of cutting the hetero-junction substrate into semiconductor chips comprises a first dicing step of forming grooves having a depth of at least the thickness of the semiconductor substrate on the surface of the semiconductor substrate; and a second dicing step of cutting the entire hetero-junction substrate along the grooves to divide the hetero-junction substrate into a plurality of semiconductor chips.

Abstract: In a semiconductor device of the present invention, an electrode pad is formed on a surface of a semiconductor substrate, and in the electrode pad, two different areas: a connection area of through wiring electrically connected to a through wiring; and a pad area for inspection that keeps away from an opening on the surface of a through hole, are set. Accordingly, the electrode pad can be adequately prevented from being damaged due to contact of a probe, providing a high yield and reliability of the semiconductor device. That is, because the through hole is not opened directly below the pad area for inspection with which the probe is in contact upon operation inspection of devices, a mechanical strength of the electrode pad against the probe can be maintained in a high level.

Abstract: According to a method of manufacturing a semiconductor device, a short-circuit wiring is formed in a region on a wafer including a dicing region, and electrode pads for input and output signals of a plurality of devices disposed in a semiconductor device forming region are electrically short-circuited by the short-circuit wiring, so that occurrence of plasma damage is suppressed even if the wafer is subjected to various plasma processes. When the wafer subjected to the plasma processes is cut along the dicing region to separate a semiconductor device, the electrical short-circuit of the electrode pads by the short-circuit wiring is released, so that the functionally unwanted short-circuit of the devices or the like is appropriately released.

Abstract: Light detecting elements are formed in areas marked off by scribe lines on a semiconductor substrate, and color filters are deposited in such a manner as to cover the formed areas of the light detecting elements, and then an infrared cut-off filter, on which an infrared reflecting film is vapor-deposited in such a manner as to cover the formed areas of the light detecting elements, is firmly fixed to the surface of the semiconductor substrate through the interposition of a translucent resin layer, such as an epoxy adhesive, to thereby form a multilayered structure, and this multilayered structure is diced along scribe lines.

Abstract: A semiconductor device includes a semiconductor chip having at least an electrode pad and a device formed on a semiconductor layer on its surface, a seal cap having a recess portion facing the device which is adhered to the surface of the semiconductor chip, and a cavity as an airspace formed by the recess portion between the semiconductor chip and the seal cap. The semiconductor chip includes a stepped portion at a portion of the back surface opposite the surface to have an uneven thickness.

Abstract: A medical capsule apparatus put into the body cavity which has various types of medical drugs depending on applications and contributes to the reduction in management costs includes at least a main body unit having a function for observing the body cavity, and a medical drug unit having a function for accommodating and discharging the medical drug. The main body unit and the medical drug unit are freely connected and separated.

Abstract: Light detecting elements are formed in areas marked off by scribe lines on a semiconductor substrate, and color filters are deposited in such a manner as to cover the formed areas of the light detecting elements, and then an infrared cut-off filter, on which an infrared reflecting film is vapor-deposited in such a manner as to cover the formed areas of the light detecting elements, is firmly fixed to the surface of the semiconductor substrate through the interposition of a translucent resin layer, such as an epoxy adhesive, to thereby form a multilayered structure, and this multilayered structure is diced along scribe lines.

Abstract: A melting volume reduction device (10) for waste resin comprises: a charging port (15) for charging waste resin; a cutter (38) for crushing the charged waste resin; a screen (39) through which pieces of waste resin, which have been crushed into sizes not more than a predetermined size, can pass; a conveyer means (49) for conveying the pieces of waste resin which have passed through the screen; a melting means (44) for melting the pieces of waste resin, which have been conveyed by the conveyer means, into a state of high viscosity; and a discharge port (44a) for discharging the melted waste of resin. The melting volume reduction device for waste resin is composed so that it can be transported by a transportation means, and the melting volume reduction device for waste resin is capable of reducing a volume of waste resin by means of melting at a site where the waste resin is generated.

Abstract: A method and apparatus for adjusting a color difference signal of an image includes a video signal processor. The video signal processor receives a luminance signal and color difference signals representing the image, and accesses a color saturation level from a color saturation level table stored in memory based on the color difference signals. The video signal processor then detects flesh tone in areas of the image based on the luminance signal and the color saturation level, and generates a flesh tone detecting signal based on results of the flesh tone detection.

Abstract: The color video camera has a processing circuit which converts electrical signals obtained from an imager into a luminance signal and color-difference signals. The color video camera further includes a memory which stores a table of values designating color saturation levels and corresponding to a specific hue of a background color. The memory outputs a color saturation level based on the color difference signals obtained by imaging an object on a background of the specific hue. This color saturation level is compared with the luminance signal, and based on the comparison results the luminance signal and color difference signals are separated into components corresponding to the background area and components corresponding to the object area.

Abstract: A flesh-tone area is detected based on color-difference and luminance signals constituting video signals, and luminance correction, color correction, and aperture correction are performed only on the flesh-tone area or a human face area identified in the flesh-tone area. The setting of a focus area or the setting of a photometric area for iris control, automatic gain control, automatic shutter control, etc., in a video camera, is performed with respect to the flesh-tone area or the human face area. Furthermore, based on the color-difference and luminance signals constituting the video signals, a background area is detected, and the video signals are divided into components representing a background area and components representing an object area. An image signal of a desired hue or a still image is superimposed on the detected background area, or special processing is performed on the video signals representing the object area other than the detected background area.