Abstract: A plasma processing apparatus for processing an object to be processed using a plasma. The apparatus includes a processing chamber defining a processing cavity for containing an object to be processed and a process gas therein, a microwave radiating antenna having a microwave radiating surface for radiating a microwave in order to excite a plasma in the processing cavity, and a dielectric body provided so as to be opposed to the microwave radiating surface, in which the distance D between the microwave radiating surface and a surface of the dielectric body facing away from the microwave radiating surface, which is represented with the wavelength of the microwave being a distance unit, is determined to be in the range satisfying the inequality 0.7×n/4?D?1.3×n/4 (n being a natural number).

Abstract: A method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips. This method includes forming a groove with a pattern according to an outer contour of a desired semiconductor chip, holding the semiconductor wafer by a wafer holding mechanism, grinding a back surface of the semiconductor wafer held by the wafer holding mechanism, detecting opening of a bottom face of the groove during the back surface grinding process to determine timing for finishing the back surface grinding. The opening of the groove can be detected by means of a light sensor for detecting light passing through the groove or a microwave sensor for detecting a microwave passing through the groove. In addition, it is possible to suck air inside the groove so as to detect the opening of the groove by a pressure rise in the air inside the groove.

Abstract: A method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips. This method includes forming a groove with a pattern according to an outer contour of a desired semiconductor chip, holding the semiconductor wafer by a wafer holding mechanism, grinding a back surface of the semiconductor wafer held by the wafer holding mechanism, detecting opening of a bottom face of the groove during the back surface grinding process to determine timing for finishing the back surface grinding. The opening of the groove can be detected by means of a light sensor for detecting light passing through the groove or a microwave sensor for detecting a microwave passing through the groove. In addition, it is possible to suck air inside the groove so as to detect the opening of the groove by a pressure rise in the air inside the groove.

Abstract: A gas supply path structure forms a fluid path for allowing a laser gas to flow into or out of a pair of fluid inlet and outlet 11a and a laser gas is controlled to a predetermined subsonic speed at a throat portion. Gas supplies for controlling the speed of the gas are connected each to the fluid inlet and to the fluid outlet of the gas supply path structure and, together with a cooling device, compose a circulation system for controlling the speed and pressure of the laser gas at the fluid inlet and/or at the fluid outlet.

Abstract: A gas supply path structure forms a fluid path for allowing a laser gas to flow into or out of a pair of fluid inlet and outlet 11a and a laser gas is controlled to a predetermined subsonic speed at a throat portion. Gas supplies for controlling the speed of the gas are connected each to the fluid inlet and to the fluid outlet of the gas supply path structure and, together with a cooling device, compose a circulation system for controlling the speed and pressure of the laser gas at the fluid inlet and/or at the fluid outlet.

Abstract: The plasma process apparatus is capable of uniformalizing the density of a plasma generated thereby and a self-bias voltage associated therewith. This apparatus include two parallel plates electrodes I and II, one of electrodes I and II being configured for carrying a substrate to be plasma processed. The apparatus further includes a magnetic field applying means for applying a magnetic field horizontal and one-directional to a surface of the substrate. An additional element of the apparatus is a single auxiliary electrode positioned around the periphery of electrode I and having high-frequency power applied thereto. The alignment of the electrodes is such that they define a space where a plasma for use in processing the substrate is to be excited.

Abstract: A method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips. This method includes forming a groove with a pattern according to an outer contour of a desired semiconductor chip, holding the semiconductor wafer by a wafer holding mechanism, grinding a back surface of the semiconductor wafer held by the wafer holding mechanism detecting opening of a bottom face of the groove during the back surface grinding process to determine timing for finishing the back surface grinding. The opening of the groove can be detected by means of a light sensor for detecting light passing through the groove or a microwave sensor for detecting a microwave passing through the groove. In addition, it is possible to suck air inside the groove so as to detect the opening of the groove by a pressure rise in the air inside the groove.

Abstract: The present invention has an object thereof to make possible the recycling of exhaust gas components in a manufacturing process by cooling, liquefaction, and recovery, and to use toxic or useful gases without disposal, and to dramatically reduce the frequency of exhaust system maintenance by combining such a recovery method with a vacuum exhaust system.

Abstract: A sheet material for advertisement having high water resistance and durability for practice and optionally high flameproof property and mildewproof property and capable of recording thereon ink images having a high clarity under transmitted light by ink jet printing, has an ink receiving layer which is formed on a sheet substrate comprising a base fiber fabric and a synthetic resin-containing coating layer, which optionally has a flameproof and/or mildewproof property, and which comprises hydrated silica particles (having an average primary particle size of 20 to 35 nm an average secondary particle size of 2 to 7 &mgr;m and a BET specific surface area of 50 to 170 m2/g, a water-holding material, for example, three dimensionally cross-linked isocyanate-polyalkyleneoxide and isocyanate-N-vinyl acetamide copolymers and/or copolymers or reaction products of ethyleneoxide (65% by weight or more) with a modifying organic compound, an acrylic resin binder, and optionally a phosphate ester compound flame retarder and

Abstract: A gas supply path structure forms a fluid path for allowing a laser gas to flow into or out of a pair of fluid inlet and outlet 11a and a laser gas is controlled to a predetermined subsonic speed at a throat portion. Gas supplies for controlling the speed of the gas are connected each to the fluid inlet and to the fluid outlet of the gas supply path structure and, together with a cooling device, compose a circulation system for controlling the speed and pressure of the laser gas at the fluid inlet and/or at the fluid outlet.

Abstract: The present invention makes possible the recycling of exhaust has components in a manufacturing process by cooling, liquefaction, and recovery, and to use toxic or useful gases without disposal, and to dramatically reduce the frequency of exhaust system maintenance by combining such a recovery method with a vacuum exhaust system.

Abstract: A gas supply path structure forms a fluid path for allowing a laser gas to flow into or out of a pair of fluid inlet and outlet 11a and a laser gas is controlled to a predetermined subsonic speed at a throat portion. Gas supplies for controlling the speed of the gas are connected each to the fluid inlet and to the fluid outlet of the gas supply path structure and, together with a cooling device, compose a circulation system for controlling the speed and pressure of the laser gas at the fluid inlet and/or at the fluid outlet.

Abstract: A plasma processing apparatus for processing an object to be processed using a plasma.

Abstract: A stainproof, flame-resistant composite sheet material including at least one silicone polymer layer containing a silicon resin or rubber and optionally a flame-resistant inorganic filler and at least one stainproof surface layer containing at least one synthetic thermoplastic stain-resistant, weathering-resistant polymeric material, the silicone polymer layer and the stainproof surface layer being bonded optionally through an adhesive material, a cold plasma or corona discharge-modified surface portion of the silicone polymer layer or a cold plasma or corona discharge-modified and graft polymerization-modified surface portion of the silicone polymer layer.

Abstract: Disclosed is a process for preparing a water-proof sheet by forming a polymer coating on both the surfaces of a fibrous substrate fabric. At first, the fibrous substrate fabric is treated with a water repellant, and both the surfaces are subjected to the low temperature plasma treatment or corona discharge treatment. Then, a polymer coating is formed on both the surfaces. According to this process, the peel strength of the polymer coating is improved and the water absorbing property is reduced substantially to zero. If an inorganic fiber substrate fabric is treated according to this process, the bending resistance is highly improved in the resulting water-proof sheet.

Abstract: A stainproof, flame-resistant composite sheet material including at least one silicone polymer layer containing a silicone resin or rubber and optionally a flame-resistant inorganic filler and at least one stainproof surface layer containing at least one synthetic thermoplastic stain-resistant, weathering-resistant polymeric material, the silicone polymer layer and the stainproof surface layer being bonded optionally through an adhesive material, a cold plasma or corona discharge-modified surface portion of the silicone polymer layer or a cold plasma or corona discharge-modified and graft polymerization-modified surface portion of the silicone polymer layer.

Abstract: Disclosed is a process for preparing a water-proof sheet by forming a polymer coating on both the surfaces of a fibrous substrate fabric. At first, the fibrous substrate fabric is treated with a water repellant, and both the surfaces are subjected to the low temperature plasma treatment or corona discharge treatment. Then, a polymer coating is formed on both the surfaces. According to this process, the peel strength of the polymer coating is improved and the water absorbing property is reduced substantially to zero. If an inorganic fiber substrate fabric is treated according to this process, the bending resistance is highly improved in the resulting water-proof sheet.