Abstract: In the configuration where a cover tape separating mechanism 50 partially separating a cover tape 15e from a carrier tape 15 is provided in an upper member 32 of a guide section 30, a pressing member 43, which presses the carrier tape 15 from the cover tape 15e, is provided in the upper member 32 on the upstream side of the cover tape separating mechanism 50. Accordingly, it is possible to suppress the early separation of the cover tape 15e from the base tape 15a that does not yet reach the cover tape separating mechanism 50.

Abstract: A positioning mechanism, which determines the relative position of a carrier tape 15 in a tape feed direction by fitting alignment pins 37 to feed holes 15d in a lower member 31, and a cover tape separating mechanism 50, which is provided on an upper member 32 and exposes electronic components 16 stored in component pockets 15b by separating a cover tape 15e from a base tape 15, are provided at non-interference positions that do not interfere with each other when the upper member 32 is closed to the lower member 31. Accordingly, when the cover tape 15e is separated from the carrier tape 15, the carrier tape 15 is aligned with the guide section 30.

Abstract: A screen printer capable of concurrently, efficiently subjecting a plurality of different types of substrates, to a printing operation. The screen printer makes up an electronic component mounting line and prints electronic component bonding paste on a substrate. A substrate conveyance section that conveys a substrate forwardly or backwardly in a direction of conveyance of a substrate is disposed at an intermediate position between a first screen printing section and a second screen printing section arranged symmetrically with respect to a center line CL. It thereby becomes possible to adopt a variety of substrate conveyance forms, as required, such as return conveyance for returning the substrate from a downstream machine to an upstream side of the screen printer and bypass conveyance for letting the substrate sent from an upstream side pass through the screen printer, to thus be conveyed to a downstream machine.

Abstract: In the separation of a cover tape 15e from a carrier tape 15 performed by a cover tape separating mechanism 50, a cover tape 15e, which is separated from a base tape 15a by a separating blade edge 51f, comes into contact with a concave conical surface 52c, so that one side portion of a cover tape 15e is bent toward the other side portion; and the bent cover tape 15e is pressed against a guide surface 32s from below while the carrier tape 15 is guided to a pick-up position. Accordingly, the cover tape 15e is folded on the base tape 15a in a flat shape.

Abstract: In a structure that exfoliation is performed in the pitch sending of a carrier tape (15) by making a cover tape exfoliating mechanism (50) intervene between joining surfaces of a base tape (15a) and a cover tape (15e), in an exfoliation start position where an exfoliating knife tip (51f) of an acuminate shape, which is provided at a front end, starts to exfoliate the joining surface, a lower guide member(40), which guides the carrier tape (15) from below, is pushed up from the bottom side by a lever member (44), and when the carrier tape (15)is installed, the carrier tape (15) is pushed up together with the lower guide member (40)to make the exfoliating knife tip (51f) in the exfoliation start position to be aligned to the joining surfaces and enter between the joining surfaces.

Abstract: An electronic component installation apparatus 4 which constructs an electronic component mounting line 1 and installs an electronic component on a substrate is configured to include substrate conveyance lanes L1, L3 as two conveyance paths for feed which respectively feed the substrate carried from the upstream side to the downstream side, the conveyance paths for feed in which substrate positioning parts for positioning and holding the substrate in installation work positions are disposed between two component installation parts 22A, 22B for taking the electronic components out of component supply parts 23A, 23B and transferring and installing the electronic components to the substrate, and a substrate conveyance lane L2 as a return conveyance path which returns the substrate carried from the downstream side to the upstream side and is disposed in a state of being sandwiched between the substrate conveyance lanes L1, L3.

Abstract: A screen printer capable of concurrently, efficiently subjecting a plurality of different types of substrates, to a printing operation. The screen printer makes up an electronic component mounting line and prints electronic component bonding paste on a substrate. A substrate conveyance section that conveys a substrate forwardly or backwardly in a direction of conveyance of a substrate is disposed at an intermediate position between a first screen printing section and a second screen printing section arranged symmetrically with respect to a center line CL. It thereby becomes possible to adopt a variety of substrate conveyance forms, as required, such as return conveyance for returning the substrate from a downstream machine to an upstream side of the screen printer and bypass conveyance for letting the substrate sent from an upstream side pass through the screen printer, to thus be conveyed to a downstream machine.

Abstract: A screen printing apparatus including two screen printers, each including a substrate introduction portion by which a substrate is introduced from an upstream side of a component mounting line, a printing portion which performs a screen printing to the introduced substrate, a substrate discharge portion by which the substrate is discharged to a downstream side, and a substrate moving stage which receives the substrate to position the substrate with respect to the printing portion and to move the substrate to the substrate discharge portion. The two substrate introduction portions, the two printing portions, and the two substrate discharge portions are arranged symmetrically to each other with respect to a perpendicular symmetrical plane extending in a transportation direction of the substrate in the component mounting line, respectively. Each printing portion is provided at a position further from the perpendicular symmetrical plane than the substrate discharge portion.

Abstract: A screen printer capable of concurrently, efficiently subjecting a plurality of different types of substrates, to a printing operation. The screen printer makes up an electronic component mounting line and prints electronic component bonding paste on a substrate. A substrate conveyance section that conveys a substrate forwardly or backwardly in a direction of conveyance of a substrate is disposed at an intermediate position between a first screen printing section and a second screen printing section arranged symmetrically with respect to a center line CL. It thereby becomes possible to adopt a variety of substrate conveyance forms, as required, such as return conveyance for returning the substrate from a downstream machine to an upstream side of the screen printer and bypass conveyance for letting the substrate sent from an upstream side pass through the screen printer, to thus be conveyed to a downstream machine.

Abstract: A screen printing apparatus including two screen printers, each including a substrate introduction portion by which a substrate is introduced from an upstream side of a component mounting line, a printing portion which performs a screen printing to the introduced substrate, a substrate discharge portion by which the substrate is discharged to a downstream side, and a substrate moving stage which receives the substrate to position the substrate with respect to the printing portion and to move the substrate to the substrate discharge portion. The two substrate introduction portions, the two printing portions, and the two substrate discharge portions are arranged symmetrically to each other with respect to a perpendicular symmetrical plane extending in a transportation direction of the substrate in the component mounting line, respectively. Each printing portion is provided at a position further from the perpendicular symmetrical plane than the substrate discharge portion.

Abstract: It is an object to provide an electronic component mounting system capable of concurrently, efficiently subjecting a plurality of substrates to component mounting operation and accomplishing both high productivity and a capability of addressing production of multiple products. An electronic component mounting system is configured by arranging, on an upstream side of a component loading unit having a plurality of substrate conveyance mechanisms, a screen printer M2 having a plurality of individual printing mechanisms and a coating and inspection machine M4 that applies a coat of a resin for use in boding an electronic component and that inspects a coated state. The coating and inspection machine M4 is equipped with a coating head 15 that performs operation for coating substrates conveyed by substrate conveyance mechanisms 12A and 12B from the screen printer M2 with the resin and an inspection head 16 that performs pre-coating inspection and post-coating inspection.

Abstract: An object of the invention is to provide an electronic component mounting system and an electronic component mounting method which can execute component mounting work on a plurality of boards simultaneously, concurrently and efficiently so that high productivity and responsiveness to production of many items can be achieved consistently.

Abstract: An object of the invention is to provide an electronic component mounting system which can execute component mounting work on a plurality of boards simultaneously, concurrently and efficiently so that high productivity and responsiveness to production of many items can be achieved consistently.

Abstract: An object of the invention is to provide an electronic component mounting system and an electronic component mounting method which can execute component mounting work on a plurality of boards simultaneously, concurrently and efficiently so that high productivity and responsiveness to production of many items can be achieved consistently.

Abstract: A component mount system includes: a component placing unit; an inspection unit; a repair station; an image display device; a defective portion image display unit configured to display an image of a defective portion of a board on the image display device; an input device; and a repair required portion display unit configured to display a defective portion detected by the inspection unit, which is indicated as a true defective portion in a determination result input through the input device and selected from the defective portion detected by the inspection unit, as a repair required portion on the image display device. The image display device is provided at a location where an operator who performs a repair work can watch the image displayed on the image display device, and the input device is provided at a location where the operator can operate the input device.

Abstract: An object is to provide an electronic component installation apparatus capable of efficiently doing component installation work for which plural substrates including a double-sided mounting substrate are targeted.

Abstract: There is provided a screen printer capable of concurrently, efficiently subjecting a plurality of substrates, including different types of substrates, to printing operation. In a screen printer 2 that makes up an electronic component mounting line 1 and that prints electronic component bonding paste on a substrate, a substrate conveyance section 8 that conveys a substrate 5 forwardly or backwardly in a direction of conveyance of a substrate is disposed at an intermediate position between a first screen printing section 7A and a second screen printing section 7B arranged symmetrically with respect to a center line CL. It thereby becomes possible to adopt a variety of substrate conveyance forms, as required, such as return conveyance for returning the substrate 5 from a downstream machine to an upstream side of the screen printer 2 and bypass conveyance for letting the substrate sent from an upstream side pass through the screen printer, to thus be conveyed to a downstream machine.

Abstract: An inspection process before component mounting for all component mounting positions on which components are to be mounted is performed when a reenter mode is not set by operation of a reenter switch, a recognition camera is first caused to recognize the component mounting position and then a component presence inspection process which inspects whether or not the component is mounted on the component mounting position is performed when the reenter mode is set by the reenter switch, and, the inspection process before component mounting is performed for the component mounting position on which the component is not mounted.

Abstract: To provide a component placement apparatus capable of preventing free operation of a mounting head within the movable region from being restricted as well as improving the mounting takt time.

Abstract: In estimating a curved surface model by approximating the shape of the board surface of a circuit board, auxiliary measurement spots are set other than measurement spots on the board surface, eligibility as a sampling displacement magnitude in estimating a curved surface model is determined according to a difference in a displacement magnitude from a work reference surface. When the sampling displacement magnitude is determined to be ineligible, a new measurement spot is reset. By this operation, a local increase and decrease in the displacement magnitude due to a discontinuity of the board surface exerts no influence on the estimation of the curved surface model, and the curved surface model approximated more closely to the shape of the actual board surface is estimated, leading to an improvement in the work quality with the working height adjusted to the proper height.