Patents by Inventor Kazuhide Uriu

Kazuhide Uriu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer ceramic device including two ceramic layers with multilayer circuit patterns that can support semiconductor and saw chips
    Patent number: 6570469
    Abstract: A multilayer ceramic device improves device functionality, reduces overall device size and profile, makes manufacturing easier, and improves reliability. A first ceramic layer has a first multilayer circuit pattern electrically connected through via holes. Also, a second ceramic layer has a second multilayer circuit pattern electrically connected through via holes. A thermosetting resin sheet is disposed between the first and second ceramic layers. The thermosetting resin sheet has through holes filled with a conductive paste for electrically connecting one of multiple circuit pattern layers in the first ceramic layer with one of multiple circuit pattern layers in the second ceramic layer.
    Type: Grant
    Filed: June 27, 2001
    Date of Patent: May 27, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toru Yamada, Kazuhide Uriu, Tsutomu Matsumura, Toshio Ishizaki
  • Diplexer, and high-frequency switch and antenna duplexer using the same
    Publication number: 20030092397
    Abstract: A diplexer capable of passing signals of a high frequency band without being attenuated over a wide frequency band, and a high-frequency switch using the diplexer are provided. The diplexer includes a low-pass filter 82 having a parallel resonant circuit formed by a first capacitor C1 and a first inductor L1 and a serial resonant circuit formed by a second capacitor C2 and a second inductor L2. With this structure, two attenuation poles are provided in the low-pass filter 82. Thus, a passband of a high-pass filter 83 can be widened.
    Type: Application
    Filed: November 6, 2002
    Publication date: May 15, 2003
    Inventors: Kazuhide Uriu, Toru Yamada, Toshio Ishizaki
  • High frequency switch and high frequency radio communication apparatus
    Publication number: 20030092398
    Abstract: A high frequency switch having a plurality of signal paths for four frequency bands, the high frequency switch, has
    Type: Application
    Filed: October 29, 2002
    Publication date: May 15, 2003
    Inventors: Kazuhide Uriu, Toshio Ishizaki, Hideaki Nakakubo, Toru Yamada
  • High frequency switch and radio communication apparatus
    Publication number: 20030085774
    Abstract: A layered body of mounting a SAW filter, at least has
    Type: Application
    Filed: September 30, 2002
    Publication date: May 8, 2003
    Inventors: Kazuhide Uriu, Keiji Onishi, Toru Yamada, Toshio Ishizaki
  • Laminated band pass filter, high frequency radio equipment, and method of manufacturing laminated band pass filter
    Publication number: 20030048156
    Abstract: The present invention provides a small and low loss laminated bandpass filter by placing two strip lines 313 and 314 that form a resonator in a certain distance on the same layer and thereby electromagnetically coupling these strip lines.
    Type: Application
    Filed: August 6, 2002
    Publication date: March 13, 2003
    Inventors: Kazuhide Uriu, Toru Yamada, Toshio Ishizaki, Tsutomu Matsumura
  • High-frequency switch, laminated high-frequency switch, high-frequency radio unit, and high-frequency switching method
    Publication number: 20020101296
    Abstract: A high-frequency switch has
    Type: Application
    Filed: December 26, 2001
    Publication date: August 1, 2002
    Inventors: Kazuhide Uriu, Toru Yamada, Tomoyuki Iwasaki
  • Multilayer ceramic device
    Publication number: 20020011907
    Abstract: A multilayer ceramic device improves device functionality, reduces overall device size and profile, makes manufacturing easier, and improves reliability. A first ceramic layer 1 has a first multilayer circuit pattern 2 electrically connected through via holes 3. A second ceramic layer 2 also has a second multilayer circuit pattern 2 electrically connected through via holes 3. A thermosetting resin sheet 17 is disposed between the first and second ceramic layers. The thermosetting resin sheet has through holes filled with a conductive paste for electrically connecting one of multiple circuit pattern layers in the first ceramic layer with one of multiple circuit pattern layers in the second ceramic layer.
    Type: Application
    Filed: June 27, 2001
    Publication date: January 31, 2002
    Inventors: Toru Yamada, Kazuhide Uriu, Tsutomu Matsumura, Toshio Ishizaki