Abstract: According to one embodiment, a semiconductor device includes a first element isolating area, a first element area surrounding the first element isolating area, a second element isolating area surrounding the first element area a first gate electrode provided on and across the first element isolating area, the first element area, and the second element isolating area, and a second gate electrode isolated from the first gate electrode and provided on and across the first element isolating area, the first element area, and the second element isolating area.

Abstract: According to one embodiment, a semiconductor device includes a first element isolating area, a first element area surrounding the first element isolating area, a second element isolating area surrounding the first element area a first gate electrode provided on and across the first element isolating area, the first element area, and the second element isolating area, and a second gate electrode isolated from the first gate electrode and provided on and across the first element isolating area, the first element area, and the second element isolating area.

Abstract: A nonvolatile semiconductor memory device in an embodiment includes a semiconductor layer, a memory cell array, word lines, bit lines, a source line, and a control circuit. The memory cell array has memory strings, each of the memory strings having memory cells. The word lines are connected to the control gates of the memory cells. The control circuit controls a voltage applied to the semiconductor layer, the control gates, the bit lines, and the source line. When executing a read operation, the control circuit begins application of a first voltage to the source line at a first time, the first voltage having a positive value. The control circuit begins application of a second voltage to unselected word lines at the first time or thereafter, the second voltage setting the memory cells to a conductive state regardless of retained data of the memory cells.

Abstract: A nonvolatile semiconductor memory device in an embodiment includes a semiconductor layer, a memory cell array, word lines, bit lines, a source line, and a control circuit. The memory cell array has memory strings, each of the memory strings having memory cells. The word lines are connected to the control gates of the memory cells. The control circuit controls a voltage applied to the semiconductor layer, the control gates, the bit lines, and the source line. When executing a read operation, the control circuit begins application of a first voltage to the source line at a first time, the first voltage having a positive value. The control circuit begins application of a second voltage to unselected word lines at the first time or thereafter, the second voltage setting the memory cells to a conductive state regardless of retained data of the memory cells.

Abstract: According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell array including regular memory cells and permanent memory cells and a control circuit. The regular memory cells are capable of switching between a first data storage state and a second data storage state. The permanent memory cells are fixed in a third data storage state that is read as the same logic level data as the first storage state. Data is stored in at least one of the regular memory cells and at least one of the permanent memory cells. The control circuit rewrites at least one of the regular memory cells from the second data storage state to the first data storage state at the time of data holding. The control circuit performs a reading operation after rewriting the regular memory cells from the first data storage state to the second data storage state.

Abstract: According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell array including regular memory cells and permanent memory cells and a control circuit. The regular memory cells are capable of switching between a first data storage state and a second data storage state. The permanent memory cells are fixed in a third data storage state that is read as the same logic level data as the first storage state. Data is stored in at least one of the regular memory cells and at least one of the permanent memory cells. The control circuit rewrites at least one of the regular memory cells from the second data storage state to the first data storage state at the time of data holding. The control circuit performs a reading operation after rewriting the regular memory cells from the first data storage state to the second data storage state.

Abstract: A semiconductor memory includes a converter configured to convert each read-data of plural bits read from a memory core into serial data, respectively, in synchronization with a read clock to generate converted read-data. An output register holds the converted read-data in synchronization with the read clock. A selector selects one bit from each plural bits of the converted read-data, in accordance with a control data, and to supply the selected bit to the output register.

Abstract: A semiconductor device includes a plurality of cell arrays, a selection control circuit to generate and to output a selection control signal. An array selection circuit generates internal address signals on the basis of an external address signal and the selection control signal. The array selection circuit outputs the internal address signals to the plurality of cell arrays to select ones of the cell arrays. A sales method for selling semiconductor devices includes presenting function-related information and price-related information on partially good semiconductor devices to client terminals and prompting the client terminals to provide purchase/non-purchase information and determining the possibility of successful transactions on the basis of the purchase/non-purchase information. A sales system for selling semiconductor devices uses the sales method and a sales program product for causing a computer system to sell semiconductor devices using the sales method.

Abstract: A semiconductor memory includes a converter configured to convert each read-data of plural bits read from a memory core into serial data, respectively, in synchronization with a read clock to generate converted read-data. An output register holds the converted read-data in synchronization with the read clock. A selector selects one bit from each plural bits of the converted read-data, in accordance with a control data, and to supply the selected bit to the output register.

Abstract: An input/output circuit inputs/outputs serial data. A register section comprises a first and a second register. The first register converts the serial data into parallel data. The second register converts parallel data into serial data. A first control signals supply a conversion timing for each bit when the serial data are converted into the parallel data. A second control signals supply a conversion timing for each bit when the parallel data are converted into the serial data. The signal generating circuit controls a timing of rise or fall of the first control signals and sets which of the memory cells should store a value for each bit, of the serial data, and controls a timing of rise or fall of the second control signals and sets which number of value of the serial data should be the value for each bit, of the parallel data read from the memory cells.

Abstract: An input/output circuit inputs/outputs serial data. A register section comprises a first and a second register. The first register converts the serial data into parallel data. The second register converts parallel data into serial data. A first control signals supply a conversion timing for each bit when the serial data are converted into the parallel data. A second control signals supply a conversion timing for each bit when the parallel data are converted into the serial data. The signal generating circuit controls a timing of rise or fall of the first control signals and sets which of the memory cells should store a value for each bit, of the serial data, and controls a timing of rise or fall of the second control signals and sets which number of value of the serial data should be the value for each bit, of the parallel data read from the memory cells.

Abstract: A semiconductor integrated circuit device including an integrated circuit portion, a fuse element block, and a data transfer selecting circuit. The fuse element block includes a programmable fuse element. The data transfer selecting circuit selects one of the transfer of data programmed in the fuse element to the integrated circuit portion, transfer of data input from outside to the integrated circuit portion, and transfer of data programmed in the fuse element to outside.

Abstract: A semiconductor integrated circuit device, which enables impedance adjustment of a particular pad without affecting other pads or signal wirings or without the need for a design change in basic layout, has formed a number of elements and wirings on and in a silicon substrate 11, and pads 13 stacked thereon via an insulation film 12. A particular pad 13a is connected to a signal wiring 17a formed in a bus line region 17, and a capacitor-forming conductor 14 behaving as an impedance adjusting conductor is formed to surround the pad 13a. A source line conductor 15 is made in a space between the pad 13a and the capacitor-forming conductor 14 to encircle the capacitor-forming conductor 14. Therefore, the pad capacitance can be increased by using the space around the pad 13a, other signal wirings 17b and any others formed in the bus line region 17 are not affected substantially. Since here is used the portion around the pad which is not used normally, the basic layout need not be changed.

Abstract: A semiconductor integrated circuit device comprises an integrated circuit portion, a fuse element block, and a data transfer selecting circuit. The fuse element block includes a programmable fuse element. The data transfer selecting circuit selects one of the transfer of data programmed in the fuse element to the integrated circuit portion, transfer of data input from outside to the integrated circuit portion, and transfer of data programmed in the fuse element to outside.

Abstract: A semiconductor memory device comprises a memory cell array, a first latch circuit group, and a second latch circuit group. The first latch circuit group sequentially outputs n/2 bit read data of n-bit read data from the memory cell array in response to sequentially shifted read control signals. The second latch circuit group sequentially outputs the remaining n/2 bit read data in response to the sequentially shifted read control signal.

Abstract: A semiconductor memory device is provided which ensures the symmetry of memory data transmission time and a high-speed operation and has large write/read operation margin with no need of increasing the chip area. By placing a horizontally long peripheral circuit section in the middle in the vertical direction of a semiconductor chip, placing a vertically long shift register section above and below and perpendicularly to the peripheral circuit section, and making the memory core and shift register arrangement symmetrical in the horizontal direction, the data/signal lines between the memory core and the shift register section can be made short and the symmetry of the interconnections can be maintained, which allows the implementation of a high-speed and large-margin semiconductor memory device.

Abstract: A semiconductor integrated circuit device, which enables impedance adjustment of a particular pad without affecting other pads or signal wirings or without the need for a design change in basic layout, has formed a number of elements and wirings on and in a silicon substrate 11, and pads 13 stacked thereon via an insulation film 12. A particular pad 13a is connected to a signal wiring 17a formed in a bus line region 17, and a capacitor-forming conductor 14 behaving as an impedance adjusting conductor is formed to surround the pad 13a. A source line conductor 15 is made in a space between the pad 13a and the capacitor-forming conductor 14 to encircle the capacitor-forming conductor 14. Therefore, the pad capacitance can be increased by using the space around the pad 13a, other signal wirings 17b and any others formed in the bus line region 17 are not affected substantially. Since here is used the portion around the pad which is not used normally, the basic layout need not be changed.

Abstract: A semiconductor integrated circuit device comprises an integrated circuit portion, a fuse element block, and a data transfer selecting circuit. The fuse element block includes a programmable fuse element. The data transfer selecting circuit selects one of the transfer of data programmed in the fuse element to the integrated circuit portion, transfer of data input from outside to the integrated circuit portion, and transfer of data programmed in the fuse element to outside.

Abstract: A semiconductor integrated circuit device comprises an integrated circuit portion, a fuse element block, and a data transfer selecting circuit. The fuse element block includes a programmable fuse element. The data transfer selecting circuit selects one of the transfer of data programmed in the fuse element to the integrated circuit portion, transfer of data input from outside to the integrated circuit portion, and transfer of data programmed in the fuse element to outside.

Abstract: According to one embodiment, a semiconductor device includes a first element isolating area, a first element area surrounding the first element isolating area, a second element isolating area surrounding the first element area a first gate electrode provided on and across the first element isolating area, the first element area, and the second element isolating area, and a second gate electrode isolated from the first gate electrode and provided on and across the first element isolating area, the first element area, and the second element isolating area.