Abstract: A coating material including a low-molecular or medium-molecular organic compound represented by general formula (1). (In the formula, R1 is a single bond, methylene, ethylene or oxygen; and R2 is a hydrogen atom, or a hydrocarbon group, a fluorine-containing alkyl group, a cyclic form containing an aromatic group or aliphatic group, which may contain hydroxy group, carboxyl group, amino group, amide group, imide group, glycidyl group, cyano group, fluorocarbinol group, sulfonic group or sulfonylamide group, and a complex thereof, and may contain a fluorine atom, oxygen atom, nitrogen atom, silicon atom or sulfur atom, and R2's of the same type or different type may be connected by an ester bond, amide bond, ether bond, thioether bond, thioester bond or urethane bond.). This compound can be derived from a diol compound and bicyclo[2.2.2]octane-2,3:5,6-tetracarboxylic anhydride.

Abstract: A polyamide resin/rubber-reinforced styrene-based resin composition, particularly, a polyamide resin/ABS resin composition, excellent in the balance between impact strength and fluidity as well as in the heat resistance, chemical resistance and paintability, as well as a shaped article thereof, are provided. The resin composition comprises 100 parts by weight of a thermoplastic resin comprising (A) from 79.5 to 20 parts by weight of a polyamide resin, (B) from 20 to 79.5 parts by weight of a polymer obtained by grafting an aromatic vinyl-based monomer and a vinyl cyanide-based monomer to a specific rubber-like polymer, (C) from 0.

Abstract: A resist protective coating material is provided comprising an ?-trifluoromethylacrylic acid/norbornene copolymer having cyclic perfluoroalkyl groups as pendant. In a pattern-forming process, the material forms on a resist film a protective coating which is water-insoluble, dissolvable in alkaline developer and immiscible with the resist film, allowing for effective implementation of immersion lithography.

Abstract: There is provided a photosensitive composition including a polyimide or polyimide precursor. The polyimide and polyimide precursor of the present invention includes a group of a first acid-cleavable group, a first base-cleavable group or a first thermally-cleavable group, and another group of a hydrophilic group, or a protected hydrophilic group by a second acid-cleavable group, a second base-cleavable group, or a crosslinkable group.

Abstract: A fluorine-containing diamine represented by the formula (1), [Chemical Formula 29] is provided. Furthermore, a fluorine-containing polymer is provided by using this fluorine-containing amine as a monomer. The fluorine-containing polymer can exhibit superior characteristics such as low dielectric property and high transparency, while maintaining high fluorine content and retaining adhesive property.

Abstract: A protective casing structure of an electronic apparatus capable of keeping the apparatus compact and light is provided. A display-side block includes a display module and a display casing. The display casing is provided with frame edges at a periphery thereof, with projections formed on the frame edges. Grooves engaging with the projections are formed in a system casing. When the display-side block is closed, the projections engage with the grooves to increase rigidity against pressing from the outside in the closed state. The casing structure thereby increases the protective capability of the display module while keeping the apparatus compact and light.

Abstract: There is provided a novel polyester compound having in its main polymer chain an aliphatic cyclic structure with carboxylic acids or carboxylic acid ester groups as represented by the chemical formula (1), a resist material containing the polyester compound and a patterning method using the resist material.

Abstract: A polymer comprising recurring units of formula (1) wherein R1 is F or fluoroalkyl, R2 is alkylene or fluoroalkylene, and R3 is an acid labile group and having a Mw of 1,000-500,000 is used to formulate a resist composition, which is processed by the lithography involving ArF exposure and offers many advantages including resolution, minimal line edge roughness, etch resistance, and minimal surface roughness after etching. The composition performs well when processed by the ArF immersion lithography with liquid interposed between the projection lens and the wafer.

Abstract: Disclosed is a fluorine-containing polymerizable monomer represented by the formula [1] below. (In the formula [1], a represents an integer of 1-4.) By having a plurality of polymerizable amines in a molecule while containing a hexafluoroisopropyl group, this fluorine-containing polymerizable monomer exhibiting water repellancy, oil repellency, low water absorbency, heat resistance, weather resistance, corrosion resistance, transparency, photosensitivity, low refractive index, low dielectric properties, and the like, and thus can be applied to the field of advanced polymer materials.

Abstract: Disclosed is a fluorine-containing polymerizable monomer represented by the formula [1] below. (In the formula, A represents a single bond, an oxygen atom, a sulfur atom, CO, CH2, SO, SO2, C(CH3)2, NHCO, C(CF3)2, a phenyl or an alicyclic ring; a and b independently represent an integer of 0-2; and 1?a+b?4.) Such a fluorine-containing polymerizable monomer can be used as an effective polymerizable monomer exhibiting water repellency, oil repellency, low water absorbency, heat re-sistance, weather resistance, corrosion resistance, transparency, photosensitivity, low refractive index, low dielectric properties and the like. Consequently, the fluorine-containing polymeriz-able monomer can be applied to the field of advanced polymer materials.

Abstract: A fluorine-containing diamine represented by the formula (1), [Chemical Formula 29] is provided. Furthermore, a fluorine-containing polymer is provided by using this fluorine-containing amine as a monomer. The fluorine-containing polymer can exhibit superior characteristics such as low dielectric property and high transparency, while maintaining high fluorine content and retaining adhesive property.

Abstract: The present invention relates to a fluorine-containing copolymer. This fluorine-containing copolymer includes (a) a first unit derived from ?-trifluoromethyl acrylic ester represented by the following general formula (1); and (b) a second unit derived from a vinyl monomer, where R1 is an organic group containing at least one fluorine atom.

Abstract: The present invention relates to a novel fluorine-containing cyclic compound that is derived from a norbornadiene and hexafluoroacetone and has an oxacyclopentane structure. This compound may be represented by the following formula (1) or (2). Furthermore, the present invention relates to a fluorine-containing polymer compound prepared by a polymerization or copolymerization using this fluorine-containing cyclic compound or its derivative. By using such fluorine-containing polymer compound, it is possible to provide a superior resist material and a fine pattern forming process using the same.

Abstract: The present invention relates to a top coat composition, which is characterized in that it is applied to a photoresist top surface by using a polymer containing at least one structure represented by the formula [1], [2] or [3]. It is possible to produce a top coat composition solution by dissolving this top coat composition in an organic solvent. These top coat composition and top coat composition solution can be used in immersion lithography.

Abstract: The invention relates to a fluorine-containing allyl ether compound represented by the formula 1, wherein R represents an organic group containing at least one fluorine atom and an alicyclic structure. The invention further relates to a fluorine-containing copolymer containing a first unit derived from the fluorine-containing allyl ether represented by the formula 1; and a second unit derived from a vinyl monomer.

Abstract: A fluorinated polymer comprising recurring units of formulae (1a) to (1d) and having a Mw of 1,000-500,000 is provided. R1 is an acid labile group, R2 is a single bond or methylene, a1, a2, a3, and a4 are numbers from more than 0 to less than 1, and 0<a1+a2+a3+a4?1, b is 1 or 2, and c is 0 or 1.

Abstract: In an immersion lithography process, a pattern is formed by forming a photoresist layer on a wafer, forming a protective coating on the photoresist layer from an overlay material, exposing the layer structure to light in water, and developing. A water-insoluble, alkali-soluble material is used as the overlay material.

Abstract: There is provided a novel polyester compound having in its main polymer chain an aliphatic cyclic structure with carboxylic acids or carboxylic acid ester groups as represented by the chemical formula (1), a resist material containing the polyester compound and a patterning method using the resist material.

Abstract: The present invention relates to, for example, a fluorine-containing cyclic compound represented by the following general formula (1). In the general formula (1), R1a is a C1-C25 cyclic alkyl group, cyclic alkenyl group or cyclic alkynyl group; each of R2 and R3 is independently a hydrogen atom, a halogen atom, or a C1-C25 straight-chain, branched or cyclic alkyl group; and each of R1a, R2 and R3 may contain fluorine atom, oxygen atom, sulfur atom, nitrogen atom or an atomic group containing a carbon-carbon double bond.

Abstract: The invention relates to a fluorine-containing compound containing a substituent represented by the formula 1: where R1 is (a) a straight-chain alkylene group, (b) a branched alkylene group, (c) a cyclic structure containing an aromatic ring group or aliphatic cyclic group, or (d) a substituent containing an aromatic ring group and an aliphatic cyclic group, and R1 optionally contains fluorine, another halogen, CN, oxygen, nitrogen, silicon, or alcohol, and R2 is a hydrogen atom, a straight-chain or branched alkyl group, an aromatic group, or a hydrocarbon group optionally containing an aliphatic cyclic group, and R2 optionally contains fluorine, oxygen, nitrogen, carbonyl bond, or alcohol, and a plural number of R2 having different structures are optionally contained in the molecule.