Patents by Inventor Kazuhiko Mizuuchi

Kazuhiko Mizuuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020103270
    Abstract: This invention relates to a photo- or heat-curable resin composition which yields a cured product with minimal cracking and high reliability. The resin composition of this invention comprises 100 parts by weight of (A) photo- or heat-polymerizable unsaturated compound composed of a polycarboxylic acid adduct of bisphenol-epoxy (meth)acrylate , 10-100 parts by weight of (B) alkylene oxide-modified product of (meth)acrylate or oligomers thereof, 0-50 parts by weight of (C) compound containing epoxy group and 0-50 parts by weight of (D) photopolymerization initiator or sensitizer. The composition exhibits high heat resistance and good microfabrication quality and is useful as a peripheral material of electronic parts such as semiconductor devices by the build-up process, for example, as a material for forming insulation layers in multilayer printed wiring boards.
    Type: Application
    Filed: November 30, 2001
    Publication date: August 1, 2002
    Inventors: Masahiko Takeuchi, Kazuhiko Mizuuchi, Hironobu Kawasato
  • Publication number: 20020051942
    Abstract: This invention relates to a photo- or heat-curable resin composition which yields a cured product with minimal cracking and high reliability. The resin composition of this invention comprises 100 parts by weight of the resin-forming component containing a photo- or heat-polymerizable unsaturated compound and 0.01-5 parts by weight of an inorganic filler such as silica sol with its average particle diameter controlled in the range 5 nm-0.5 &mgr;m. The composition exhibits high heat resistance and good microfabrication quality and is useful as a peripheral material of electronic parts such as semiconductor devices by the build-up process, for example, as a material for forming insulation layers in multilayer printed wiring boards.
    Type: Application
    Filed: August 22, 2001
    Publication date: May 2, 2002
    Inventors: Masahiko Takeuchi, Kazuhiko Mizuuchi, Hironobu Kawasato
  • Patent number: 5425931
    Abstract: A bundle of pitch-based carbon fibers which is composed of 1000 to 100,000 continuous fiber filaments having an average diameter of 4 to 8 .mu.m, a filament tensile strength of at least 3.0 GPa, and a modulus of at least 600 GPa, and also a method for producing a fine diameter pitch-based carbon fiber wherein use is made of a spinning nozzle with a single nozzle plate which has at least 1000 capillary holes, has the capillaries arranged concentrically and circularly in 3 to 20 rows, has the capillaries positioned to be divided into at least two blocks, has a columnar projection protruding at least 20 mm from the surface of the nozzle plate at the center of the nozzle plate, and has capillaries of a diameter of 50 to 110 .mu.m.
    Type: Grant
    Filed: September 7, 1993
    Date of Patent: June 20, 1995
    Assignees: Nippon Steel Corporation, Nippon Steel Chemical Co., Ltd.
    Inventors: Yutaka Arai, Ken Kobayashi, Kunio Miura, Hiroyuki Tadokoro, Yasuo Nagata, Kazuhiko Mizuuchi