Abstract: A connection detection unit detects that a receiver is connected that is capable of recording an image data group captured by a capsule endoscope. A provision unit provides a plurality of pieces of subject information to a plurality of receivers detected to be connected.

Abstract: The present invention provides a ceramic-aluminum bonded body in which Mg-containing oxide having a spinel crystal structure are dispersed in an aluminum member within a range of 2 ?m in a thickness direction from a bonded interface with a ceramic member, a segregated portion in which Mg, Si, and O is segregated is formed in the aluminum member in the vicinity of the bonded interface with the ceramic member, mass ratios of Mg, Si, and O between the segregated portion and a position spaced by 10 ?m from the bonded interface toward an aluminum member side are within predetermined ranges, and the amount of Mg at the position spaced by 10 ?m from the bonded interface toward the aluminum member side is 0.8 mass % or less.

Abstract: An electronic apparatus is provided and includes a body and a displayer provided with a display screen. The displayer is supported by the body to be movable relative to the body and the display screen is rectangular in shape. The displayer is configured to tilt about different tilting directions including a long-side direction and a short-side direction of the rectangular display screen.

Abstract: The present invention provides a ceramic-aluminum bonded body in which Mg-containing oxide having a spinel crystal structure are dispersed in an aluminum member within a range of 2 ?m in a thickness direction from a bonded interface with a ceramic member, a segregated portion in which Mg, Si, and O is segregated is formed in the aluminum member in the vicinity of the bonded interface with the ceramic member, mass ratios of Mg, Si, and O between the segregated portion and a position spaced by 10 ?m from the bonded interface toward an aluminum member side are within predetermined ranges, and the amount of Mg at the position spaced by 10 ?m from the bonded interface toward the aluminum member side is 0.8 mass % or less.

Abstract: An electronic apparatus or an imaging apparatus includes a body, and a displayer provided with a display screen, the displayer being supported by the body to be movable relative to the body. The displayer is configured to be selectively set at different positions including a stand-by position and a plurality of tilt positions, at which the display screen tilts in different directions relative to an orientation of the displayer set at the stand-by position. The displayer is configured to be selectively moved directly to the plurality of tilt positions rather than via the stand-by position. A support mechanism including a movable member is also disclosed.

Abstract: An imaging apparatus includes a body provided with an image sensor; a displayer configured to display an image obtained via the image sensor, the displayer being supported by the body to be movable relative to the body; a connecting member provided with first and second connecting portions; a first support portion provided on one of the body and the displayer, the first connecting portion of the connecting member being connected to the first support portion in a rotatable manner about a spherical center thereof relative to the one of the body and the displayer; and a second support portion provided on the other of the body and the displayer, the second connecting portion of the connecting member being connected to the second support portion in a rotatable manner about a spherical center thereof and in a linearly-movable manner relative to the other of the body and the displayer.

Abstract: A variable-position operation device, provided on an electronic-device body, includes a variable-position operation member which shifts upon an operation thereof; a first electrical contact which shifts in accordance with the operation of the variable-position operation member; a second electrical contact which detects a shifted position of the first electrical contact, which is in sliding contact with the second electrical contact, in accordance with a shifted position of the variable-position operation member; and at least one light-emitting element, wherein a light-emitting state of the light-emitting element changes in accordance with the shifted position of the variable-position operation member. The second electrical contact is provided on a first board. The light-emitting element is provided on a second board, the second board being provided as a separate member from that of the first board.

Abstract: An electronic apparatus or an imaging apparatus includes a body, and a displayer provided with a display screen, the displayer being supported by the body to be movable relative to the body. The displayer is configured to be selectively set at different positions including a stand-by position and a plurality of tilt positions, at which the display screen tilts in different directions relative to an orientation of the displayer set at the stand-by position. The displayer is configured to be selectively moved directly to the plurality of tilt positions rather than via the stand-by position. A support mechanism including a movable member is also disclosed.

Abstract: An imaging apparatus includes a body provided with an image sensor; a displayer configured to display an image obtained via the image sensor, the displayer being supported by the body to be movable relative to the body; a connecting member provided with first and second connecting portions; a first support portion provided on one of the body and the displayer, the first connecting portion of the connecting member being connected to the first support portion in a rotatable manner about a spherical center thereof relative to the one of the body and the displayer; and a second support portion provided on the other of the body and the displayer, the second connecting portion of the connecting member being connected to the second support portion in a rotatable manner about a spherical center thereof and in a linearly-movable manner relative to the other of the body and the displayer.

Abstract: Provided is a power module substrate including a ceramic substrate, and a metal plate which contains aluminum or an aluminum alloy, and which is stacked and bonded on a surface of the ceramic substrate, wherein one or more additional elements selected from Ag, Zn, Ge, Mg, Ca, Ga, and Li are solid-solubilized in the metal plate, and the Ag concentration in the metal plate in the vicinity of the interface with the ceramic substrate is greater than or equal to 0.05% by mass and less than or equal to 10% by mass, or the total concentration of Zn, Ge, Mg, Ca, Ga, and Li in the metal plate in the vicinity of the interface with the ceramic substrate is greater than or equal to 0.01% by mass and less than or equal to 5% by mass.

Abstract: A light emitting device includes a first layer of a first conductivity type, a second layer of a second conductivity type, and a light emitting layer between the first and second layers. A resin layer is disposed on a first surface of the first layer. The first layer has an outer portion that extends beyond the second and light emitting layers to an outer edge. A first electrode contacts the first layer in the outer portion on a second surface opposite the first surface; and a second electrode contacts the second layer. A first insulating material contacts the first surface in the outer portion of the first layer and has a wall surface extending from the first surface at a position that is in the outer portion and spaced from the outer edge.

Abstract: A variable-position operation device, provided on an electronic-device body, includes a variable-position operation member which shifts upon an operation thereof; a first electrical contact which shifts in accordance with the operation of the variable-position operation member; a second electrical contact which detects a shifted position of the first electrical contact, which is in sliding contact with the second electrical contact, in accordance with a shifted position of the variable-position operation member; and at least one light-emitting element, wherein a light-emitting state of the light-emitting element changes in accordance with the shifted position of the variable-position operation member. The second electrical contact is provided on a first board. The light-emitting element is provided on a second board, the second board being provided as a separate member from that of the first board.

Abstract: A rotational joint is provided that comprises a first member, second member, rotational shaft member, rotational biasing member and stop ring. The first member has a pair of sidewalls that face each other. The second member has a pair of plate members each disposed proximate to the outer-facing sides of the sidewalls. The rotational shaft member is fitted into shaft holes in each of the plate members and the sidewalls. The rotational biasing member is disposed around the rotational shaft member and its one end is engaged with the first member and the other end with the stop ring fixed to the rotational shaft member. The first member is rotatable with respect to the rotational shaft member that is fixed to the second member. The rotational biasing member and stop ring are disposed between the sidewalls.

Abstract: A semiconductor light-emitting device includes a first-conductivity-type first semiconductor layer, a second-conductivity-type second semiconductor layer, a light-emitting layer provided between the first semiconductor layer and the second semiconductor layer, a nitride semiconductor layer that is provided on a side of the first semiconductor layer opposite to the light-emitting layer, has a resistance higher than a resistance of the first semiconductor layer, and includes recess portions communicating with the first semiconductor layer, and a conductive layer that comes into contact with the first semiconductor layer in the recess portions.

Abstract: A light emitting device includes a first layer of a first conductivity type, a second layer of a second conductivity type, and a light emitting layer between the first and second layers. A resin layer is disposed on a first surface of the first layer. The first layer has an outer portion that extends beyond the second and light emitting layers to an outer edge. A first electrode contacts the first layer in the outer portion on a second surface opposite the first surface; and a second electrode contacts the second layer. A first insulating material contacts the first surface in the outer portion of the first layer and has a wall surface extending from the first surface at a position that is in the outer portion and spaced from the outer edge.

Abstract: A power module substrate includes a ceramics substrate composed of Si3N4 having a top face. A metal plate composed of aluminum having a purity of 99.99% or more is joined to the top face of the ceramics substrate with a brazing filler metal which includes a melting-point lowering element interposed therebetween. A high concentration section is formed at a joint interface at which the metal plate is joined to the ceramics substrate, has an oxygen concentration greater than an oxygen concentration in the metal plate and in the ceramics substrate, and has a thickness of less than or equal to 4 nm.

Abstract: A power module substrate includes a ceramics substrate composed of Al2O3 having a top face. A metal plate composed of aluminum having a purity of 99.99% or more is joined to the top face of the ceramics substrate with a brazing filler metal which includes silicon interposed therebetween. A high concentration section is formed at a joint interface at which the metal plate is joined to the ceramics substrate, and has a silicon concentration that is more than five times the silicon concentration in the metal plate.

Abstract: A power module substrate includes: a ceramics substrate having a surface; and a metal plate connected to the surface of the ceramics substrate, composed of aluminum, and including Cu at a joint interface between the ceramics substrate and the metal plate, wherein a Cu concentration at the joint interface is in the range of 0.05 to 5 wt %.

Abstract: A power module substrate includes: a ceramics substrate having a surface; and a metal plate connected to the surface of the ceramics substrate, composed of aluminum, and including Cu at a joint interface between the ceramics substrate and the metal plate, wherein a Cu concentration at the joint interface is in the range of 0.05 to 5 wt %.

Abstract: According to one embodiment, a semiconductor light emitting device includes a semiconductor film, an electrode, a passivation film, a sealing resin body, and an intermediate film. The semiconductor film contains a Group III nitride semiconductor. The electrode is connected to a first surface of the semiconductor film. The passivation film covers an end surface of the semiconductor film and the first surface. The sealing resin body covers the first surface and a side surface of the electrode to leave a second surface of the semiconductor film exposed. The intermediate film is provided between the passivation film and the sealing resin body. The absolute value of the difference between an internal stress of the intermediate film and that of the sealing resin body is less than the absolute value of the difference between an internal stress of the passivation film and that of the sealing resin body.