Patents by Inventor Kazuhiro Asai

Kazuhiro Asai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11938729
    Abstract: A liquid ejection head includes a base plate and at least two device chips in which ejection ports for ejecting a liquid are formed and which are disposed on the base plate. At least one first reference mark is provided on the base plate. A second reference mark is provided on each of the device chips. At least one space is formed between adjacent device chips. The second reference marks and the first reference mark present in the space are disposed on an array axis along which the device chips are arrayed.
    Type: Grant
    Filed: August 3, 2021
    Date of Patent: March 26, 2024
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kazuhiro Asai, Koji Sasaki, Jun Yamamuro, Shingo Nagata
  • Publication number: 20240092080
    Abstract: A liquid ejection head includes a base plate and at least two device chips in which ejection ports for ejecting a liquid are formed and which are disposed on the base plate. At least one first reference mark is provided on the base plate. A second reference mark is provided on each of the device chips. At least one space is formed between adjacent device chips. The second reference marks and the first reference mark present in the space are disposed on an array axis along which the device chips are arrayed.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 21, 2024
    Inventors: Kazuhiro Asai, Koji Sasaki, Jun Yamamuro, Shingo Nagata
  • Publication number: 20240083167
    Abstract: A liquid ejection head includes a base plate and at least two device chips in which ejection ports for ejecting a liquid are formed and which are disposed on the base plate. At least one first reference mark is provided on the base plate. A second reference mark is provided on each of the device chips. At least one space is formed between adjacent device chips. The second reference marks and the first reference mark present in the space are disposed on an array axis along which the device chips are arrayed.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Inventors: Kazuhiro Asai, Koji Sasaki, Jun Yamamuro, Shingo Nagata
  • Publication number: 20230341762
    Abstract: A print element substrate including a substrate having an energy generating element that generates energy for ejecting liquid from an ejection port and a flow passage forming member including a flow passage that supplies the liquid to the ejection port, wherein the flow passage forming member includes a cavity not communicating with the flow passage, and a side surface of the cavity is formed substantially perpendicular to the substrate wherein a base film is formed between the cavity and the substrate. The refractive index of the flow passage forming member is lower than the refractive index of the base film, and the difference between the refractive index of the flow passage forming member and the refractive index of the base film is greater than or equal to 0.3.
    Type: Application
    Filed: April 19, 2023
    Publication date: October 26, 2023
    Inventors: KEIJI MATSUMOTO, KAZUHIRO ASAI
  • Patent number: 11465418
    Abstract: A manufacturing method for a structure includes preparing a dry film supported on one surface of a support; bonding the dry film to a substrate so that the dry film and the substrate are in contact with each other; performing first exposure of the dry film bonded to the substrate via the support; removing the support after the first exposure; performing second exposure of the dry film after the support is removed via a photomask; and developing the dry film after the first exposure and the second exposure.
    Type: Grant
    Filed: March 17, 2021
    Date of Patent: October 11, 2022
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kenji Tamamori, Kazuhiro Asai, Tetsushi Ishikawa, Seiichiro Yaginuma
  • Publication number: 20210362499
    Abstract: Provided is a liquid ejection head comprising a base plate and at least two device chips in which ejection ports for ejecting a liquid are formed and which are disposed on the base plate. At least one first reference mark is provided on the base plate. A second reference mark is provided on each of the device chips. At least one space is formed between adjacent ones of the device chips. The second reference marks and the first reference mark present in the space are disposed on an array axis along which the device chips are arrayed.
    Type: Application
    Filed: August 3, 2021
    Publication date: November 25, 2021
    Inventors: Kazuhiro Asai, Koji Sasaki, Jun Yamamuro, Shingo Nagata
  • Publication number: 20210300042
    Abstract: A manufacturing method for a structure includes preparing a dry film supported on one surface of a support; bonding the dry film to a substrate so that the dry film and the substrate are in contact with each other; performing first exposure of the dry film bonded to the substrate via the support; removing the support after the first exposure; performing second exposure of the dry film after the support is removed via a photomask; and developing the dry film after the first exposure and the second exposure.
    Type: Application
    Filed: March 17, 2021
    Publication date: September 30, 2021
    Inventors: Kenji Tamamori, Kazuhiro Asai, Tetsushi Ishikawa, Seiichiro Yaginuma
  • Patent number: 11097540
    Abstract: A liquid ejection head includes a base plate and at least two device chips in which ejection ports for ejecting a liquid are formed and which are disposed on the base plate. At least one first reference mark is provided on the base plate. A second reference mark is provided on each of the device chips. At least one space is formed between adjacent device chips. The second reference marks and the first reference mark present in the space are disposed on an array axis along which the device chips are arrayed.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: August 24, 2021
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kazuhiro Asai, Koji Sasaki, Jun Yamamuro, Shingo Nagata
  • Patent number: 10894410
    Abstract: A method of manufacturing a liquid ejection head includes forming a resist film on a first surface of a light-transmitting support having the first surface and a second surface being a back surface of the first surface; bonding a back side of the surface of the resist film to the support side on a substrate having a through hole so as to block the through hole; exposing the resist film with light transmitted from the second surface to the first surface of the support and forming a portion which is removable with a dissolving liquid and a portion which remains against the dissolving liquid on the resist film; immersing the substrate and the exposed resist film in the dissolving liquid, allowing the dissolving liquid to enter the through hole, and removing the removable portion; and peeling the support from the resist film from which the removable portion has been removed.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: January 19, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Kazuhiro Asai
  • Patent number: 10894409
    Abstract: Provided is a method of manufacturing a liquid ejection head, which is capable of patterning a dry film while suppressing deformation of the dry film caused by a pressure. The method of manufacturing a liquid ejection head includes: preparing a substrate including an ejection orifice member on a first surface; forming, on an ejection orifice surface of the ejection orifice member, a protection film having communicating holes for allowing ejection orifices to communicate to outside; closing an opening of a supply port on a second surface on a side opposite to the first surface of the substrate with a dry film; and patterning the dry film by irradiating the dry film with light under a state in which the protection film is formed on the ejection orifice surface.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: January 19, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Jun Yamamuro, Kazuhiro Asai, Keiji Matsumoto, Kunihito Uohashi, Keiji Watanabe, Masahisa Watanabe, Tetsushi Ishikawa, Yasuaki Tominaga, Manabu Otsuka
  • Publication number: 20200139711
    Abstract: A method of manufacturing a liquid ejection head includes forming a resist film on a first surface of a light-transmitting support having the first surface and a second surface being a back surface of the first surface; bonding a back side of the surface of the resist film to the support side on a substrate having a through hole so as to block the through hole; exposing the resist film with light transmitted from the second surface to the first surface of the support and forming a portion which is removable with a dissolving liquid and a portion which remains against the dissolving liquid on the resist film; immersing the substrate and the exposed resist film in the dissolving liquid, allowing the dissolving liquid to enter the through hole, and removing the removable portion; and peeling the support from the resist film from which the removable portion has been removed.
    Type: Application
    Filed: October 11, 2019
    Publication date: May 7, 2020
    Inventor: Kazuhiro Asai
  • Patent number: 10625506
    Abstract: A method for manufacturing a liquid discharge head includes a transferring step of transferring a dry film supported by a supporting member to a substrate having a hole, and a peeling step of peeling the supporting member off the dry film on the substrate. In the peeling step, the dry film is in contact with a wall surface defining the hole in the substrate.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: April 21, 2020
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kazuhiro Asai, Kenji Fujii, Keiji Matsumoto, Koji Sasaki, Kunihito Uohashi, Jun Yamamuro, Seiichiro Yaginuma, Masahisa Watanabe, Ryotaro Murakami
  • Publication number: 20200079086
    Abstract: Provided is a liquid ejection head comprising a base plate and at least two device chips in which ejection ports for ejecting a liquid are formed and which are disposed on the base plate. At least one first reference mark is provided on the base plate. A second reference mark is provided on each of the device chips. At least one space is formed between adjacent ones of the device chips. The second reference marks and the first reference mark present in the space are disposed on an array axis along which the device chips are arrayed.
    Type: Application
    Filed: August 9, 2019
    Publication date: March 12, 2020
    Inventors: Kazuhiro Asai, Koji Sasaki, Jun Yamamuro, Shingo Nagata
  • Patent number: 10562306
    Abstract: A liquid ejection head is manufactured by covering a mold material arranged on a patterned protecting layer on a substrate and subsequently removing the mold material to produce a flow path. A sacrificial layer employed as the mold material operates as mask for patterning the protecting layer.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: February 18, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Seiichiro Yaginuma, Koji Sasaki, Kazuhiro Asai
  • Patent number: 10343406
    Abstract: A liquid ejection head has an ejection port forming region which includes liquid ejection energy generating elements arranged on a substrate, liquid supply ports each running through the substrate and having an opening at a surface of the substrate, a liquid path formed on the surface as a space containing the liquid ejection energy generating elements and the liquid supply ports therein, and ejection ports corresponding to the respective liquid ejection energy generating elements. The liquid ejection head is manufactured by forming a liquid path forming layer on the substrate using a dry film resist, forming an ejection port forming layer on the liquid path forming layer, forming a liquid path in the liquid path forming layer and ejection ports in the ejection port forming layer. The substrate has dummy holes each having an opening at a surface of the substrate outside the ejection port forming region.
    Type: Grant
    Filed: December 27, 2016
    Date of Patent: July 9, 2019
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Keiji Matsumoto, Jun Yamamuro, Kazuhiro Asai, Koji Sasaki, Kunihito Uohashi, Seiichiro Yaginuma, Ryotaro Murakami, Masahisa Watanabe, Tomohiko Nakano, Keiji Edamatsu, Haruka Nakada, Kenji Fujii
  • Patent number: 10322584
    Abstract: A method for manufacturing a liquid ejection head including the steps of preparing a substrate including, on a surface of the substrate, a layer having a plurality of openings in which opening portions of supply portions are located and which are arrayed in an array direction and another opening which is different from the plurality of openings and is located beyond the array end portion in the array direction, and attaching a dry film for forming flow passages to the substrate and the layer.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: June 18, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Jun Yamamuro, Kenji Fujii, Kazuhiro Asai, Keiji Matsumoto, Koji Sasaki, Kunihito Uohashi, Seiichiro Yaginuma, Masahisa Watanabe, Ryotaro Murakami, Tomohiko Nakano, Keiji Edamatsu, Haruka Nakada
  • Patent number: 10286668
    Abstract: A liquid ejection head has an ejection port forming region which includes liquid ejection energy generating elements arranged on a substrate, liquid supply ports each running through the substrate and having an opening at a surface of the substrate, a liquid path formed on the surface as a space containing the liquid ejection energy generating elements and the liquid supply ports therein, and ejection ports corresponding to the respective liquid ejection energy generating elements. The liquid ejection head is manufactured by forming a liquid path forming layer on the substrate using a dry film resist, forming an ejection port forming layer on the liquid path forming layer, forming a liquid path in the liquid path forming layer and ejection ports in the ejection port forming layer. The substrate has dummy holes each having an opening at a surface of the substrate outside the ejection port forming region.
    Type: Grant
    Filed: December 27, 2016
    Date of Patent: May 14, 2019
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Keiji Matsumoto, Jun Yamamuro, Kazuhiro Asai, Koji Sasaki, Kunihito Uohashi, Seiichiro Yaginuma, Ryotaro Murakami, Masahisa Watanabe, Tomohiko Nakano, Keiji Edamatsu, Haruka Nakada, Kenji Fujii
  • Publication number: 20190077156
    Abstract: Provided is a method of manufacturing a liquid ejection head, which is capable of patterning a dry film while suppressing deformation of the dry film caused by a pressure. The method of manufacturing a liquid ejection head includes: preparing a substrate including an ejection orifice member on a first surface; forming, on an ejection orifice surface of the ejection orifice member, a protection film having communicating holes for allowing ejection orifices to communicate to outside; closing an opening of a supply port on a second surface on a side opposite to the first surface of the substrate with a dry film; and patterning the dry film by irradiating the dry film with light under a state in which the protection film is formed on the ejection orifice surface.
    Type: Application
    Filed: September 7, 2018
    Publication date: March 14, 2019
    Inventors: Jun Yamamuro, Kazuhiro Asai, Keiji Matsumoto, Kunihito Uohashi, Keiji Watanabe, Masahisa Watanabe, Tetsushi Ishikawa, Yasuaki Tominaga, Manabu Otsuka
  • Patent number: 10201974
    Abstract: A process for producing a liquid discharge head including a substrate having a liquid supply path passing through from its first surface to second surface and an discharge port forming member having a discharge port communicating with the supply path through a flow path, the process including providing a first layer of photosensitive resin in a region covering an opening of the supply path in the first surface; forming a latent image of a pattern of the flow path in the first layer by exposure; providing a second layer of negative photosensitive resin on the first layer; curing a portion, opposing to the opening of the supply path in the first surface, of the second layer; forming a latent image of a pattern of the discharge port in the second layer by exposure; and developing latent images of patterns of the flow path and discharge port.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: February 12, 2019
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Jun Yamamuro, Kazuhiro Asai, Keiji Matsumoto, Koji Sasaki, Masahisa Watanabe, Kunihito Uohashi, Seiichiro Yaginuma, Ryotaro Murakami, Kenji Fujii
  • Publication number: 20180361747
    Abstract: A liquid ejection head is manufactured by covering a mold material arranged on a patterned protecting layer on a substrate and subsequently removing the mold material to produce a flow path. A sacrificial layer employed as the mold material operates as mask for patterning the protecting layer.
    Type: Application
    Filed: June 12, 2018
    Publication date: December 20, 2018
    Inventors: Seiichiro Yaginuma, Koji Sasaki, Kazuhiro Asai