Abstract: A particle coating method includes placing magnetic particles in a vessel, fixing the magnetic particles by a magnetic force caused by a magnetic field generated in the vessel, and forming a coating film on surfaces of the magnetic particles by an atomic layer deposition method. Further, the method preferably includes forming a coating film on surfaces of the magnetic particles by an atomic layer deposition method in a state where the magnetic particles are fixed by the magnetic force in a first direction, thereby obtaining coated magnetic particles, and forming a coating film on surfaces of the coated magnetic particles in a state where the coated magnetic particles are fixed by the magnetic force in a second direction different from the first direction.

Abstract: A particle coating method includes placing magnetic particles in a vessel, fixing the magnetic particles by a magnetic force caused by a magnetic field generated in the vessel, and forming a coating film on surfaces of the magnetic particles by an atomic layer deposition method. Further, the method preferably includes forming a coating film on surfaces of the magnetic particles by an atomic layer deposition method in a state where the magnetic particles are fixed by the magnetic force in a first direction, thereby obtaining coated magnetic particles, and forming a coating film on surfaces of the coated magnetic particles in a state where the coated magnetic particles are fixed by the magnetic force in a second direction different from the first direction.

Abstract: A particle coating method includes placing magnetic particles in a vessel, fixing the magnetic particles by a magnetic force caused by a magnetic field generated in the vessel, and forming a coating film on surfaces of the magnetic particles by an atomic layer deposition method. Further, the method preferably includes forming a coating film on surfaces of the magnetic particles by an atomic layer deposition method in a state where the magnetic particles are fixed by the magnetic force in a first direction, thereby obtaining coated magnetic particles, and forming a coating film on surfaces of the coated magnetic particles in a state where the coated magnetic particles are fixed by the magnetic force in a second direction different from the first direction.

Abstract: A particle coating method includes placing magnetic particles in a vessel, fixing the magnetic particles by a magnetic force caused by a magnetic field generated in the vessel, and forming a coating film on surfaces of the magnetic particles by an atomic layer deposition method. Further, the method preferably includes forming a coating film on surfaces of the magnetic particles by an atomic layer deposition method in a state where the magnetic particles are fixed by the magnetic force in a first direction, thereby obtaining coated magnetic particles, and forming a coating film on surfaces of the coated magnetic particles in a state where the coated magnetic particles are fixed by the magnetic force in a second direction different from the first direction.

Abstract: Provided is a printed circuit board having a breakdown detection pattern formed thereon for preventing illicit acquisition of sensitive data, the printed circuit board being configured so that false detection of a disconnection or a short in the breakdown detection pattern can be prevented. The printed circuit board comprises a breakdown detection pattern layer wherein a breakdown detection pattern is formed for detecting a disconnection and/or a shorting thereof, a first pattern layer disposed more to a Y1 direction side than the breakdown detection pattern layer, a second pattern layer disposed more to a Y2 direction side than the breakdown detection pattern layer, and signal pattern layers disposed more to the Y2 direction side than the second pattern layer. Formed in the first pattern layer are a grounding pattern and a power source pattern covering the breakdown detection pattern from the Y1 direction side.

Abstract: A silicon substrate processing method includes forming an etching mask which has an opening portion, on a surface of a silicon substrate, forming an etching guide hole in the opening portion on the silicon substrate, and forming a through-hole which passes through the silicon substrate, by applying an etching treatment onto the silicon substrate in which the etching guide hole is formed. In the forming of the guide hole, the etching guide hole passing through the silicon substrate is formed by irradiating the opening portion with a laser beam a plurality of times, with a cooling period between each instance of irradiation with the laser beam.

Abstract: Provided is a printed circuit board having a breakdown detection pattern formed thereon for preventing illicit acquisition of sensitive data, the printed circuit board being configured so that false detection of a disconnection or a short in the breakdown detection pattern can be prevented. The printed circuit board (7) comprises a breakdown detection pattern layer (32) wherein a breakdown detection pattern is formed for detecting a disconnection and/or a shorting thereof, a first pattern layer (31) disposed more to a Y1 direction side than the breakdown detection pattern layer (32), a second pattern layer (33) disposed more to a Y2 direction side than the breakdown detection pattern layer (32), and signal pattern layers (34 to 36) disposed more to the Y2 direction side than the second pattern layer (33). Formed in the first pattern layer (31) are a grounding pattern and a power source pattern covering the breakdown detection pattern from the Y1 direction side.

Abstract: A destruction detection pattern for use on a printed circuit board formed in a plate shape or a film shape may include a conductor wound in a spiral shape. A width of the conductor may be constant. Within an imaginary square overlaying the destruction detection pattern, the imaginary square having a side length that is 12 times the width of the conductor, and wherein a first direction is parallel to a first side of the imaginary square and a second direction parallel to a second side of the imaginary square that is perpendicular to the first side, the destruction detection pattern may include a first pattern part, a second pattern part, a third pattern part and a fourth pattern part. The destruction detection pattern may be structured to detect its own disconnection or its own short circuit.

Abstract: A silicon substrate processing method includes forming an etching mask which has an opening portion, on a surface of a silicon substrate, forming an etching guide hole in the opening portion on the silicon substrate, and forming a through-hole which passes through the silicon substrate, by applying an etching treatment onto the silicon substrate in which the etching guide hole is formed. In the forming of the guide hole, the etching guide hole passing through the silicon substrate is formed by irradiating the opening portion with a laser beam a plurality of times, with a cooling period between each instance of irradiation with the laser beam.

Abstract: A bonding method of bonding two base members together through a bonding film is provided. The bonding method is a method for forming a bonded body in which a first base member and a second base member are bonded together through the bonding film. The bonding method includes: applying a liquid material containing a silicone material composed of silicone compounds onto a surface of at least one of the first and second base members to form a liquid coating on the surface; drying the liquid coating so that it is transformed into the bonding film on the surface of the at least one of the first and second base members; and applying energy to the bonding film so that a bonding property is developed in the vicinity of a surface thereof, to thereby bond the first and second base members together through the bonding film.

Abstract: A bonding method of bonding two base members together through a bonding film having a fine pattern at low cost, and a bonded body with the bonding film which is formed using the bonding method are provided. The bonding method is a method for forming a bonded body in which a first base member and a second base member are bonded together through a bonding film having a predetermined pattern.

Abstract: A base member with a bonding film that can be firmly bonded to an object with high dimensional accuracy and efficiently bonded to the object at a low temperature, a bonding method which is capable of efficiently bonding such a base member and the object at a low temperature, and a bonded body formed by firmly bonding the base member and the object with high dimensional accuracy and therefore being capable of providing high reliability are provided. The base member is adapted to be bonded to an object through the bonding film thereof. The base member includes a substrate, a bonding film containing metal atoms, oxygen atoms bonded to the metal atoms, and leaving groups each bonded to at least one of the metal and oxygen atoms, and having a surface, and an intermediate layer provided between the substrate and the bonding film, the intermediate layer having such a property that its thickness can be changed by applying stress thereto.

Abstract: A bonding method of bonding two base members together through a bonding film is provided. The bonding method is a method for forming a bonded body in which a first base member and a second base member are bonded together through the bonding film. The bonding method includes: applying a liquid material containing a silicone material composed of silicone compounds onto a surface of at least one of the first and second base members to form a liquid coating on the surface; drying the liquid coating so that it is transformed into the bonding film on the surface of the at least one of the first and second base members; and applying energy to the bonding film so that a bonding property is developed in the vicinity of a surface thereof, to thereby bond the first and second base members together through the bonding film.

Abstract: The purpose of this study was to identify the periodontal regeneration factors in enamel protein shown to induce cementum- and osteo-promotive activities in vivo. The cementum regeneration (CR), a part of periodontal regeneration, was examined by using experimental cavities prepared in a buccal dehiscence dog model. The CR activity was found in the aggregate consisted of sheath proteins along with a small amount of amelogenins separated from newly formed secretory enamel. The sheath proteins were purified to be homogeneous, and examined for the alkaline phosphatase (ALP) inducing activity of human periodontal ligament (HPDL) cells. Application of 17 kDa sheath protein induced ALP activity in HPDL cells. Peptides synthesized from the sheath protein sequence also showed ALP inducing activity. The 17 kDa sheath protein has cell differentiation activity.

Abstract: A separating method of a bonded body, the bonded body including two base members and a bonding film through which the base members are boded together, enabling to easily and efficiently separating the bonded body into the two original base members is provided. Further, the bonding film contains a silicone material composed of silicone compounds. The separating method includes: preparing the bonded body with the bonding film; and applying energy for separation to the bonding film so that cleavage is generated within the bonding film due to breakage of a part of molecular bonds of the silicone compounds, to thereby separate the bonded body into the first and second base members.

Abstract: A reduced-pressure drying method includes: decompressing a second chamber communicated with a first chamber housing a base material coated with a liquid substance containing a solvent to predetermined operative pressure by a decompressing device; leaving the first chamber closed in response to reaching the predetermined operative pressure until the evaporated solvent raising the pressure in the first chamber to predetermined pressure; communicating the first chamber with the pressure raised to the predetermined pressure with the second chamber; and discharging the vapor of the solvent dispersed in the first and the second chambers by the decompressing device.

Abstract: A method includes: preparing a transfer base material to have repellency against a silicone material- and conductive particle-containing liquid material; applying the liquid material to a transfer base material surface to form a liquid coating, and drying the liquid coating to obtain a bonding film; imparting energy to the bonding film to develop adhesion near a surface thereof, bonding the transfer base material to a first base material, and then separating the transfer and first base materials to transfer the bonding film to the first base material; thereafter imparting energy to the bonding film to develop adhesion near another surface of the bonding film, and bonding the first base material to a second base material to obtain a temporarily bonded structure; and applying pressure to the temporarily bonded structure to finalize the bonding and electrically connect a first terminal and a second terminal via the conductive particles.

Abstract: A method includes: preparing a transfer base material to have repellency against a silicone material- and conductive particle-containing liquid material; applying the liquid material to a transfer base material surface to form a liquid coating, and drying the liquid coating to obtain a bonding film; imparting energy to the bonding film to develop adhesion near a surface thereof, bonding the transfer base material to a first base material, and then separating the transfer and first base materials to transfer the bonding film to the first base material; thereafter imparting energy to the bonding film to develop adhesion near another surface of the bonding film, and bonding the first base material to a second base material to obtain a temporarily bonded structure; and applying pressure to the temporarily bonded structure to finalize the bonding and electrically connect a first terminal and a second terminal via the conductive particles.

Abstract: A bonding method includes: preparing a first base material to have liquid repellency against a silicone material-containing liquid material; applying the liquid material to a surface of the first base material to form a liquid coating in a predetermined shape, and drying the liquid coating to obtain a bonding film with the predetermined shape; imparting energy to the bonding film to develop adhesion near a surface of the bonding film, and bonding the first base material to a second base material via the bonding film, and then separating the first and second base materials from each other to transfer the bonding film to the second base material; and imparting energy to the bonding film after the transfer to develop adhesion near a surface of the bonding film, and bonding the second base material to a third base material via the bonding film to obtain a bonded structure.

Abstract: The purpose of this study was to identify the periodontal regeneration factors in enamel protein shown to induce cementum- and osteo-promotive activities in vivo. The cementum regeneration (CR), a part of periodontal regeneration, was examined by using experimental cavities prepared in a buccal dehiscence dog model. The CR activity was found in the aggregate consisted of sheath proteins along with a small amount of amelogenins separated from newly formed secretory enamel. The sheath proteins were purified to be homogeneous, and examined for the alkaline phosphatase (ALP) inducing activity of human periodontal ligament (HPDL) cells. Application of 17 kDa sheath protein induced ALP activity in HPDL cells. Peptides synthesized from the sheath protein sequence also showed ALP inducing activity. The 17 kDa sheath protein has cell differentiation activity.