Abstract: A miniaturized metal joint body and an apparatus for manufacturing the metal joint body to be improved about strength are provided. By cutting three overlapped metal sheets along a first cutting line and a pair of second cutting lines extending so as to intersect the first cutting line at each end of the first cutting line and pressing areas surrounded with the first cutting line and the pair of second cutting lines and each of a pair of bending lines connecting both ends of the pair of second cutting lines, each of the pairs of projecting members is formed so as to project in a pressing direction of arrow Z.

Abstract: A method for manufacturing a solid electrolyte capacitor, the method including: preparing a connection body including a frame and a plurality of capacitor elements, the frame including a plurality of element connection units and a coupling portion that integrally couples the plurality of element connection units with each other, the plurality of element connection units being provided along a first direction and a second direction intersecting with first direction the plurality of capacitor elements being connected to the plurality of element connection units; sealing the plurality of capacitor elements by using a sealing resin having a stripe shape that extends in the first direction; forming a groove in the sealing resin by running a blade along the second direction between the capacitor elements adjacent in the first direction; and segmenting the plurality of capacitor elements by cutting the sealing resin along a bottom surface of the groove by laser and cutting a boundary between each of the plurality of

Abstract: A vehicle comprising a steering wheel; a steering switch disposed on the steering wheel; an other-vehicle-detector for detecting another vehicle; a tactile sensation presentation unit for presenting a tactile sensation to an operator by vibrating the steering switch; and a controller configured to, according to detection by the other-vehicle-detector, cause the tactile sensation presentation unit to vibrate the steering switch to present a tactile sensation to the operator.

Abstract: A vehicular control unit includes a touch sensor on which a predetermined area is set, a tactile sensation presentation unit, a pressing detector, and a controller that enables operation of a vehicle mounted apparatus in response to an input to the touch sensor when pressing is equal to or higher than a first pressure. The controller is configured to: when the operation of the vehicle mounted apparatus is enabled, within a first time period, cause the tactile sensation presentation unit to present a tactile sensation corresponding to enablement of the operation of the vehicle mounted apparatus; in the case of a first slide in a direction going out of the predetermined area, cause the tactile sensation presentation unit to present a tactile sensation corresponding to the first slide; and in the case of a second slide in a direction going into the predetermined area, cause the tactile sensation presentation unit to present a tactile sensation corresponding to the second slide.

Abstract: A vehicular control unit includes a display configured to display a menu screen including an object for activating an application for operating an apparatus mounted on a vehicle, and a controller configured to activate the application corresponding to the object in accordance with control information acquired from a touch sensor. The controller is configured to set a first stage and a second stage threshold values that are related to data based on pressing, and switch the menu screen when the data based on pressing reaches the second stage threshold value.

Abstract: A tactile sensation providing apparatus includes a touch sensor, a tactile sensation provider that provides a tactile sensation on a touch surface of the touch sensor, a proximity sensor that detects the approach of an object to the touch sensor, and a controller that starts driving of the tactile sensation provider in accordance with detection by the proximity sensor.

Abstract: The resistance welding method of welding two objects together includes the steps of: clamping the objects between a pair of electrodes; and applying a current between the electrodes while the objects are pressed to bring them close to each other to allow a contacting surface between them to generate heat. One object includes a core member and a plated layer coating the core member and having a melting point lower than that of a metal constituting an outer surface of the core member. The objects are clamped between the electrodes and the contacting surface are allowed to generate heat to melt the plated layer to weld the outer surface of the core member of the one object and a base member of another object together. At least the outer surface of the core member and the base member are made of respective metals, between which no intermetallic compound is formed.

Abstract: A power control IC has a switching control circuit of a fixed on-period type which generates an output voltage from an input voltage by driving a coil by turning on and off an output transistor according to a result of comparison between a feedback voltage and a reference voltage, and a quieting circuit which forcibly turns on the output transistor by ignoring the result of comparison when, after an on-timing of the output transistor, a predetermined threshold time elapses without the next on-timing coming.

Abstract: A semiconductor device includes a first substrate, an aluminum pad, a first nickel electrode, a second substrate, a second nickel electrode, and a connection layer. The first substrate includes a wiring therein. The aluminum pad is provided adjacent to a surface layer of the first substrate and is connected to the wiring. A portion of the first nickel electrode extends inwardly of the first substrate and is connected to the aluminum pad. A top surface of the first nickel electrode projects from a surface of the first substrate. A portion of the second nickel electrode extends inwardly of the second substrate. A top surface of the second nickel electrode projects from a surface of the second substrate facing the first substrate. The connection layer comprises an alloy including tin and connects the first nickel electrode and the second nickel electrode.

Abstract: In one embodiment, a semiconductor manufacturing apparatus includes a carrier having first and second ends extending in a first direction, and third and fourth ends extending in a second direction and being not shorter than the first and second ends. The apparatus further includes a member holder having a magnet placement face on which first and second magnetic-pole portions are placed, the magnet placement face having fifth and sixth ends extending in the first direction and being shorter than the first and second ends, and seventh and eighth ends extending in the second direction, being longer than the fifth and sixth ends, and being longer than the third and fourth ends. The apparatus further includes a carrier transporter transporting the carrier along the first direction. The carrier transporter can transport the carrier such that the third and fourth ends pass under a center line of the magnet placement face.

Abstract: A vehicle and a steering unit can improve safety. A vehicle includes a steering wheel and a touchpad disposed on the steering wheel. The vehicle enables control of a controlled apparatus by a gesture on the touchpad of the steering wheel upon detecting a predetermined pressure on the touchpad of the steering wheel and provides a tactile sensation from the touchpad in accordance with the gesture on the touchpad of the steering wheel.

Abstract: A miniaturized metal joint body and an apparatus for manufacturing the metal joint body to be improved about strength are provided. By cutting three overlapped metal sheets along a first cutting line and a pair of second cutting lines extending so as to intersect the first cutting line at each end of the first cutting line and pressing areas surrounded with the first cutting line and the pair of second cutting lines and each of a pair of bending lines connecting both ends of the pair of second cutting lines, each of the pairs of projecting members is formed so as to project in a pressing direction of arrow z.

Abstract: In one embodiment, a semiconductor manufacturing apparatus includes a carrier having first and second ends extending in a first direction, and third and fourth ends extending in a second direction and being not shorter than the first and second ends. The apparatus further includes a member holder having a magnet placement face on which first and second magnetic-pole portions are placed, the magnet placement face having fifth and sixth ends extending in the first direction and being shorter than the first and second ends, and seventh and eighth ends extending in the second direction, being longer than the fifth and sixth ends, and being longer than the third and fourth ends. The apparatus further includes a carrier transporter transporting the carrier along the first direction. The carrier transporter can transport the carrier such that the third and fourth ends pass under a center line of the magnet placement face.

Abstract: A power supply control IC includes: a switching control circuit of a fixed on-time type configured to generate an output voltage from an input voltage by driving an inductor by complimentarily turning on/off an output transistor and a synchronous rectification transistor based on a result of comparison between a predetermined reference voltage and a feedback voltage in accordance with the output voltage. The switching control circuit extends an on-time of the output transistor more when a backflow of a coil current is detected than when the backflow is not detected.

Abstract: The invention provides a composite metal sheet produced by joining two metal sheets together, comprising: a projection formed by cutting the two metal sheets along a cutting line and pressing an area surrounded by the cutting line and a reference line in the two metal sheets, with the two metal sheets overlapping each other, with the reference line remaining uncut, with the cutting line extending from and communicating with both terminals of the reference line while forming a predetermined shape together with the reference line, and with the projection formed at one portion of the area in response to pressure applied to the area; hole generated by forming the projection in the two metal sheets; and a joint disposed between an outer peripheral cutting face of the projection and an inner peripheral cutting face of the hole.

Abstract: An overvoltage protection portion (14) includes a transistor (P1) that achieves continuity with an input voltage (VIN) used as an output voltage (VOUT) to an internal circuit when the input voltage (VIN) applied to an external terminal (T1) is not in an overvoltage state. The overvoltage protection portion (14) also includes: a transistor (P2) operating as a short circuit that short-circuits the source and the gate of the transistor (P1) and that interrupts the input voltage (VIN) when the input voltage (VIN) is in the overvoltage state; a resistor (R2); and a Zener diode (ZD1). The overvoltage protection portion (14) also includes: a transistor (NTr1) operating as a bypass circuit that supplies a constant output voltage (VOUT) from the external terminal (T1) to the internal circuit when the input voltage (VIN) is brought into the overvoltage state; a resistor (R3); and a Zener diode (ZD2).

Abstract: A high-side variable current source and a high-side transistor are provided in series between a supply power terminal of a control circuit and a gate of a switching transistor. A low-side variable current source and a low-side transistor are provided in series between the gate of the switching transistor and a ground terminal. A slew rate controller controls the current value of at least one of the high-side and low-side variable current sources according to the state of a setting terminal. A switching power supply device has a plurality of output transistors connected in parallel with one another and a controller that generates control signals turning on and off the output transistors at a predetermined frequency so as to generate a desired output voltage from an input voltage and supply the output voltage to a load. The controller determines which output transistor to drive according to the magnitude of the load.

Abstract: A semiconductor device includes a first substrate, an aluminum pad, a first nickel electrode, a second substrate, a second nickel electrode, and a connection layer. The first substrate includes a wiring therein. The aluminum pad is provided adjacent to a surface layer of the first substrate and is connected to the wiring. A portion of the first nickel electrode extends inwardly of the first substrate and is connected to the aluminum pad. A top surface of the first nickel electrode projects from a surface of the first substrate. A portion of the second nickel electrode extends inwardly of the second substrate. A top surface of the second nickel electrode projects from a surface of the second substrate facing the first substrate. The connection layer comprises an alloy including tin and connects the first nickel electrode and the second nickel electrode.

Abstract: A method for manufacturing a semiconductor device includes determining a position of a first semiconductor chip having a plurality of first electrodes, using one or more first alignment marks formed on the first semiconductor chip, determining a position of a second semiconductor chip having a plurality of second electrodes, using one or more second alignment marks formed on the second semiconductor chip, moving the second semiconductor chip relative to the first semiconductor chip, based on the determined positions of the first and second semiconductor chips, such that the second electrodes are aligned with the first electrodes, after said moving, stacking the second semiconductor chip on the first semiconductor chip, such that the first electrodes are electrically connected to the second electrodes, and calculating a misalignment amount between the first semiconductor chip and the second semiconductor chip stacked thereon.

Abstract: In one embodiment, a semiconductor manufacturing apparatus includes a carrier having first and second ends extending in a first direction, and third and fourth ends extending in a second direction and being not shorter than the first and second ends. The apparatus further includes a member holder having a magnet placement face on which first and second magnetic-pole portions are placed, the magnet placement face having fifth and sixth ends extending in the first direction and being shorter than the first and second ends, and seventh and eighth ends extending in the second direction, being longer than the fifth and sixth ends, and being longer than the third and fourth ends. The apparatus further includes a carrier transporter transporting the carrier along the first direction. The carrier transporter can transport the carrier such that the third and fourth ends pass under a center line of the magnet placement face.