Patents by Inventor Kazuhiro Nagaoka

Kazuhiro Nagaoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9036306
    Abstract: A flexible cable assembly (FCA) has a stiffener layer positioned in electrical contact with an electrical ground feature of the FCA, and a head stack assembly (HSA) may include a suspension tail electrically connected to the stiffener layer of the FCA, thus providing a robust ground path between the read/write head and the arm or E-block of the HSA. Additional efficient grounding techniques may include directly electrically connecting the suspension tail to the arm via a conductive adhesive, directly electrically connecting the FCA stiffener layer to the arm via a conductive screw, and/or directly electrically connecting the ground feature and the stiffener layer of the FCA to the arm using a ground post or screw.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: May 19, 2015
    Assignee: HGST Netherlands B.V.
    Inventors: Nobumasa Nishiyama, Yuji Soga, Kazuhiro Nagaoka, John Contreras, Albert Wallash
  • Patent number: 8857233
    Abstract: An object of the invention is to provide a compact and inexpensive pipe bending processing apparatus.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: October 14, 2014
    Assignee: Sanoh Industrial Co., Ltd.
    Inventors: Kazuhiko Nakazato, Yoshiaki Amasaki, Kazuhiro Nagaoka
  • Publication number: 20130047691
    Abstract: An object of the invention is to provide a compact and inexpensive pipe bending processing apparatus.
    Type: Application
    Filed: March 9, 2011
    Publication date: February 28, 2013
    Applicant: SANOH INDUSTRIAL CO., LTD.
    Inventors: Kazuhiko Nakazato, Yoshiaki Amasaki, Kazuhiro Nagaoka
  • Patent number: 8194356
    Abstract: A head-stack assembly. The head-stack assembly includes: a magnetic-recording head; a lead-suspension supporting the magnetic-recording head on an actuator arm; a metal plate coupled with the actuator arm; a resin layer disposed on the metal plate; a flexible-printed-circuit board disposed on the resin layer, and substantially perpendicularly connected to the lead-suspension; a arm-electronics module disposed on the flexible-printed-circuit board configured to shape a write-signal current waveform of a write signal to said magnetic-recording head; transmission lines disposed on the flexible-printed-circuit board configured to transmit the write signal to, and a read-back signal from, the lead-suspension; and, a single intermediate conductor layer that is disposed between the resin layer and the flexible-printed-circuit board, and having a planar shape substantially facing a bottom of the arm-electronics module and a bottom of the transmission lines.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: June 5, 2012
    Assignee: Hitachi Global Storage Technologies, Netherlands B.V.
    Inventors: Kazuhiro Nagaoka, Tatemi Ido, Nobumasa Nishiyama, Yuji Soga
  • Publication number: 20110102935
    Abstract: A head-stack assembly. The head-stack assembly includes: a magnetic-recording head; a lead-suspension supporting the magnetic-recording head on an actuator arm; a metal plate coupled with the actuator arm; a resin layer disposed on the metal plate; a flexible-printed-circuit board disposed on the resin layer, and substantially perpendicularly connected to the lead-suspension; a arm-electronics module disposed on the flexible-printed-circuit board configured to shape a write-signal current waveform of a write signal to said magnetic-recording head; transmission lines disposed on the flexible-printed-circuit board configured to transmit the write signal to, and a read-back signal from, the lead-suspension; and, a single intermediate conductor layer that is disposed between the resin layer and the flexible-printed-circuit board, and having a planar shape substantially facing a bottom of the arm-electronics module and a bottom of the transmission lines.
    Type: Application
    Filed: December 22, 2009
    Publication date: May 5, 2011
    Inventors: Kazuhiro Nagaoka, Tatemi Ido, Nobumasa NISHIYAMA, Yuji Soga
  • Patent number: 6747488
    Abstract: A multiple PLL oscillator for oscillating and outputting a plurality of frequencies having a predetermined step frequency, comprising a first and a second reference frequency sources, a switch for selecting the ore of outputs of the first and the second reference frequency sources alternatively and at predetermined time interval, and a PLL frequency synthesizer generating a millimeter wave oscillation output corresponding to each of the first and second reference frequency sources.
    Type: Grant
    Filed: August 19, 2002
    Date of Patent: June 8, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Hideyuki Nagaishi, Naoyuki Kurita, Toshiyuki Nagasaku, Kazuhiro Nagaoka, Hiroshi Kondoh
  • Publication number: 20040012447
    Abstract: One of outputs of reference frequency sources 11 and 12 is selected by a switch 13, as a reference frequency signal and compared with the phase of an output of a frequency divider 19 by a phase comparator 14. A voltage controlled oscillator 16 is controlled by a result of comparison. An output of the voltage controlled oscillator 16 and an output of another reference frequency source 18 are mixed by a mixer 17. An upper side band frequency signal of the mixer 17 is used as an output of the multiple PLL oscillator, and a lower side band frequency signal of the mixer 17 is supplied to the frequency divider 19. With the configuration, in the multiple millimeter PLL oscillator, even when the dividing number of frequency increases, lock-up time to reach a desired frequency can be shortened. Thus, stability of a PLL can be improved and specifications of the oscillation frequency of the millimeter wave band and a step frequency of hundreds kHz can be realized.
    Type: Application
    Filed: August 19, 2002
    Publication date: January 22, 2004
    Applicant: Hitachi, Ltd.
    Inventors: Hideyuki Nagaishi, Naoyuki Kurita, Toshiyuki Nagasaku, Kazuhiro Nagaoka, Hiroshi Kondoh